IMS and RFIC Technical Sessions

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Hao Wang, Anis Ben Arfi
MediaTek, Analog Devices
Location
144AB
Abstract

The pursuit of ubiquitous connectivity and the rapid evolution of wireless communication technologies such as 5G and mm-wave have spurred a growing demand for RF front-end design that can operate across a wide frequency spectrum for various communication standards. However, achieving highly reconfigurable transceivers for multiple communication standards and frequencies presents a series of challenges. Accommodating various frequency bands necessitates multiple bulky filters in both transmitter and receiver, leading to increased form factor, cost, and insertion loss. High-speed communications typically with high peak-to-average power ratios (PAPR) require more power backoff in power amplifier (PA) for good linearity while compromising transmitter efficiency. Moreover, ultra-high-speed communications such as 5G mm-wave call for ultra-low-jitter local oscillator (LO) and clock generation with fine frequency resolutions. This workshop focuses on addressing these challenges through the approaches of RF/analog/digital hybrid design techniques. Critical circuit topologies including RF digital-to-analog converter (RFDAC), digital power amplifier (DPA), N-path filter/mixer, magnet-free circulator, and fractional-N sub-sampling all-digital phase-locked loop (ADPLL) are presented. The audiences are invited to explore the integration of these techniques to achieve unified transceiver architectures with exceptional reconfigurability. Five prominent speakers from leading institutes and companies will present their latest works and share insights on the development of advanced RF front-end design. Two speakers will delve into the design of RFDACs and DPAs in high-efficiency transmitters. Afterwards, another two speakers will discuss N-path filters and mixers, as well as magnet-free circulators, for high-selectivity receivers and full-duplex transceivers. Finally, the fifth speaker will guide our attentions to the LO and clock generation, by presenting the design of ultra-low-jitter fractional-N all-digital sampling phase-locked loops. The workshop serves as a collaborative platform, bringing together experts from academia and industry to discuss and envision the future of highly reconfigurable transceiver IC design. Through the presentations and the panel discussion session, attendees will gain valuable insights into the cutting-edge techniques driving the development of RFIC design.

Technical Papers
Abstract
WSB-1: Emerging Techniques for RF Digital-to-Analog Converter
Mike Shuo-Wei Chen
Mike Shuo-Wei Chen, Univ. of Southern California
Univ. of Southern California
(08:00 - 11:50)
Materials
workshops-2023/WSB_1.pdf
Abstract
WSB-2: Reconfigurable Digital PAs for Backoff Efficiency, Output Power, Bandwidth, and Linearity Enhancement
Huizhen Jenny Qian
Huizhen Jenny Qian, Xidian Univ.
Xidian Univ.
(08:00 - 11:50)
Materials
workshops-2023/WSB_2.pdf
Abstract
WSB-3: Interference Mitigation in RF and mm-Wave Circuits and Systems for Future Wireless Networks
Negar Reiskarimian
Negar Reiskarimian, MIT
MIT
(08:00 - 11:50)
Materials
workshops-2023/WSB_3.pdf
Abstract
WSB-4: High Dynamic-Range Passive Mixers for Flexible mm-Wave Communications
Alyosha Christopher Molnar
Alyosha Christopher Molnar, Cornell Univ.
Cornell Univ.
(08:00 - 11:50)
Materials
workshops-2023/WSB_4.pdf
Abstract
WSB-5: Low-Jitter PLLs for Advanced Wireless Transceivers
Wanghua Wu
Wanghua Wu, Samsung
Samsung
(08:00 - 11:50)
Didier Belot, Pierre Busson
STMicroelectronics
Location
143ABC
Abstract

The 6G Telecom generation forecasts mm-wave and sub-THz applications as Fronthaul and Backhaul mm-wave and sub-THz wireless links; Reflective Intelligent Surface between mini-cell station and devices mainly in mm-wave frequency range; Short distance ultra-high data-rate mm-wave and sub-THz wireless data storage transfer; Automotive Joint communication and Sensing Radars; Health and Industrial mm-wave and sub-THz Radars and imagers; and other applications which are not yet defined. A Key challenge facing us is how to manage multi-processes dies with antennas integrated in the same object, reducing losses, and then increasing power efficiency and, at the same time targeting the cost efficiency. The workshop will discuss the trade-off Power Efficiency/Cost Efficiency of different 3D assembly strategies and will try to have a picture of the most promising research in the domain, through topics which will address as III-V GaN/Si and InP/Si, with SiGe and or CMOS Heterogeneous Integration; Wafer to Wafer; Die to Wafer, Backend of line co-integration; mm-wave sub-THz packaging, including Antenna integration, Si-Interposers, organic interposers, and other packaging 3D approach. The power efficiency can be defined as the max data rate ability, with the max distance covered by the transceiver over its power consumption, the cost efficiency is max data rate ability, with the max distance covered by the transceiver over its cost. This simple relation does not take into account the cooling equipment, if necessary, the reliability, and finally the environmental impact of the different strategies. These last points are difficult to quantify at the research level.

Technical Papers
Abstract
WSF-1: System-on-Wafer: 2D and 3D Technologies for Heterogeneous Systems
Hervé Boutry, Olivier Valorge, Christophe Dubarry
Olivier Valorge, CEA-LETI
CEA-LETI, CEA-LETI, CEA-LETI
(08:00 - 11:50)
Materials
workshops-2023/WSF_1.pdf
Abstract
WSF-2: RF-Heterointegration at Wafer-Level and Panel-Level for mm-Wave Applications
Siddhartha Sinha, Nadine Collaert
Siddhartha Sinha, IMEC
IMEC, IMEC
(08:00 - 11:50)
Materials
workshops-2023/WSF_2.pdf
Abstract
WSF-3: Material and Packaging Trends for High Frequency mm-Wave Applications
Tanja Braun
Tanja Braun, Fraunhofer IZM
Fraunhofer IZM
(08:00 - 11:50)
Materials
workshops-2022/WSF_3.pdf
Abstract
WSF-4: Heterointegration Approaches for InP-HBT Technologies for 5G Applications and Beyond
Hady Yacoub, Wolfgang Heinrich
Hady Yacoub, FBH
FBH, FBH
(08:00 - 11:50)
Materials
workshops-2023/WSF_4.pdf
Travis Forbes, Amrita Masurkar
Sandia National Laboratories, BAE Systems
Location
147AB
Abstract

Emerging applications such as satellite-based internet, quantum computing, high-temperature sensors and communications systems, and massive Internet-of-Things (IoT) wireless networks are enabling disruptive advances in computational ability, global internet coverage, device-to-device communications, and industrial and military sensing abilities. However, all of these extreme environments require integrated circuits to operate well beyond environmental ranges and operating voltages provided by the standard Process Development Kits (PDK) and require a combination of design skills traditionally held in non-overlapping design communities. This workshop will bring together these design communities through experts from academia and industry to provide attendees with a holistic view on overcoming these challenges. Starting near zero Kelvin, the first talk will give an overview of circuit design at cryogenic temperatures including effects on devices, matching, and how to overcome these effects. Taking it hotter, the next talk will cover device effects operating well above 150C and ongoing research to enable high yield systems at these temperatures. Making the workshop RAD, the third talk will give an overview of radiation effects on CMOS circuits and ways to design RF and analog circuits to overcome these effects. Taking it out of this world, the fourth talk will cover challenges of both radiation and temperature effects found in space-based applications and design techniques to overcome these challenges. The final talk will cover dense wireless environments with high-power RF blockers pushing the limits of the supported process supply voltage and RFIC design techniques to filter and operate through this interference. To end the workshop, we will bring the experts together for cross-pollination of ideas through a panel interaction with attendees. Can this panel create a space radiation hardened, any temperature-stable, high-power handling device? … Come and find out!

Technical Papers
Abstract
WSH-1: Challenges and Approaches for Mixed-Signal Cryogenic CMOS Design
Kevin Tien
Kevin Tien, IBM
IBM
(08:00 - 11:50)
Materials
workshops-2023/WSH_1.pdf
Abstract
WSH-2: Operating at the Extreme: Design of Electronics at High Temperatures
Matt Francis
Matt Francis, Ozark Integrated Circuits
Ozark Integrated Circuits
(08:00 - 11:50)
Materials
workshops-2023/WSH_2.pdf
Abstract
WSH-3: Effects of Radiation on CMOS RF and Analog Circuits, and Mitigation Techniques
Samuel Palermo
Samuel Palermo, Texas A&M Univ.
Texas A&M Univ.
(08:00 - 11:50)
Materials
workshops-2023/WSH_3.pdf
Abstract
WSH-4: RFIC Techniques for Deep Space Planetary Exploration
Adrian Tang
Adrian Tang, JPL
JPL
(08:00 - 11:50)
Abstract
WSH-5: Maintaining Receiver Sensitivity in the Presence of High-Power RF Blockers
Eric Klumperink
Eric Klumperink, Univ. of Twente
Univ. of Twente
(08:00 - 11:50)
Materials
workshops-2023/WSH_5.pdf
Salvatore Finocchiaro, Teerachot Siriburanon
Qorvo, Univ. College Dublin
Location
145AB
Abstract

The evolution of 5G and the need for increased capacity drive new transmitter requirements. Broadband and multiband operation requires the Power Amplifiers (PAs) to support a wider operating frequency range and high data rate require large instantaneous bandwidths, further extended by carrier aggregation, while delivering high power and maintaining high efficiency. Additionally, modern systems require complex modulation schemes exhibiting high Peak-to-Average-Power Ratio (PAPR) of more than 10dB. When operating at high Output-BackOff (OBO), Drain and Power Added Efficiency (DE and PAE) of traditional PA is typically low, with the majority of power dissipated in heat! New efficiency enhancement architectures and design techniques, from Waveform Engineering, to Load Modulation (Doherty, Outphasing and LMBA) and Supply Modulation (Envelope Tracking), have been explored in recent years. The desire for the widest possible operational bandwidth (operating frequency range) to reduce system complexity and cost is driving new broadband design techniques exploring broadband combining and broadband matching. This workshop will introduce recent trends in PA architectures, PA design and broadband matching techniques addressing the three major challenges listed above, ie wide operating bandwidth, wide instantaneous bandwidth, and large PAPR. We will look at design trade-offs to improve and maintain efficiency while satisfying system requirements which include ACLR, EVM, and other metrics for 5G New Radio (5GNR) waveforms. The concept of linearization and Digital Predistortion (DPD) will be introduced in the context of evaluating the PA performance with respect to system requirements. Experts from industry and academia that are at the frontline of these developments are invited to address these issues and inform the audience about the latest advances in this field.

Technical Papers
Abstract
WSJ-1: The Load Modulated Balanced Amplifier as a Frequency Agile PA Technique
Roberto Quaglia
Roberto Quaglia, Cardiff University
Cardiff University
(08:00 - 11:50)
Materials
workshops-2023/WSJ_1.pdf
Abstract
WSJ-2: Design Challenges of Broadband High-Power Load-Modulated Power Amplifiers
Luís C. Nunes
Luís C. Nunes, Instituto de Telecomunicações
Instituto de Telecomunicações
(08:00 - 11:50)
Materials
workshops-2023/WSJ_2.pdf
Abstract
WSJ-3: Wideband Power Amplifier Design Through Active Impedance Matching
Taylor Barton
Taylor Barton, University of Colorado Boulder
University of Colorado Boulder
(08:00 - 11:50)
Materials
workshops-2023/WSJ_3.pdf
Abstract
WSJ-4: Power, Efficiency, and Linearity Trade-Off in Designing GaN Solid-State Power Amplifiers (SSPAs) for SATCOM Applications
Rocco Giofrè
Rocco Giofrè, Università di Roma “Tor Vergata”
Università di Roma “Tor Vergata”
(08:00 - 11:50)
Materials
workshops-2023/WSJ_4.pdf
Abstract
WSJ-5: MISO Load Modulated Power Amplifiers with Digital Predistortion
Noureddine Outaleb
Noureddine Outaleb, Analog Devices, Inc.
Analog Devices, Inc.
(08:00 - 11:50)
Materials
workshops-2023/WSJ_5.pdf
Abstract
WSJ-6: mm-Wave Power Amplifiers with Wideband Efficiency, Ultra-Compactness and Built-in Sensors
Hua Wang
Hua Wang, ETH Zürich
ETH Zürich
(08:00 - 11:50)
Materials
workshops-2022/WSJ_6.pdf

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Manoj Stanley, Masahiro Horibe, Nick Ridler
NPL, AIST
Location
149AB
Abstract

The growing field of quantum computing relies on a broad range of microwave technologies and has spurred development of microwave devices and methods in new operating regimes. But despite the significant progress made in the last decade in the science, engineering and characterization of quantum computation systems, several challenges remain to be overcome before quantum computation can become practically usable. One of the most promising quantum computing technologies is the superconducting quantum computing platform, which relies on microwave waveforms and devices to control and readout quantum bits, typically at cryogenic temperatures of tens of milli-kelvin. The advancement of quantum computing implies an increase in number of qubits within or across quantum processors leading to a significant increase in microwave cabling and components operating at such cryogenic temperatures to operate the quantum processors. This puts stringent requirements on heat-load, space, and signal integrity under these extreme temperatures. The challenges of realizing such practical large-scale quantum computing systems present microwave engineers and metrologists with opportunities in cryogenic microwave modeling, design, measurement, and characterization of cryogenic semiconductor and superconductor components, circuits, systems, and networks. This workshop reviews the existing microwave measurement and engineering challenges in realizing a practical quantum computer and addresses some of these challenges. The workshop includes talks from end-users, instrument and equipment manufacturers, academia, and national measurement labs from around the world.

Technical Papers
Abstract
WSA-1: Device Characterization at Cryogenic Temperatures for Quantum Computing
Manoj Stanley, Nick Ridler
Manoj Stanley, NPL
NPL, NPL
(08:00 - 17:20)
Materials
workshops-2023/WSA_1.pdf
Abstract
WSA-2: Measurement Techniques and Challenges for Qubit Control
Suren Singh
Suren Singh, Keysight Technologies
Keysight Technologies
(08:00 - 17:20)
Materials
workshops-2023/WSA_2.pdf
Abstract
WSA-3: How to Succeed in RF and mm-Wave On-Wafer Testing at Cryogenic Temperatures?
Gavin Fisher
Gavin Fisher, FormFactor
FormFactor
(08:00 - 17:20)
Materials
workshops-2023/WSA_3.pdf
Abstract
WSA-4: Cryogenic Microwave Measurements on Superconducting Circuits at PTB
Karsten Kuhlmann
Karsten Kuhlmann, PTB
PTB
(08:00 - 17:20)
Materials
workshops-2023/WSA_4.pdf
Abstract
WSA-5: On-Wafer S-Parameter Measurements of Passive Planar Circuits at Cryogenic Temperatures
Xiaobang Shang
Xiaobang Shang, NPL
NPL
(08:00 - 17:20)
Materials
workshops-2023/WSA_5.pdf
Abstract
WSA-6: Next-GEN Quantum Computing Supply Chain
Masahiro Horibe
Masahiro Horibe, AIST
AIST
(08:00 - 17:20)
Abstract
WSA-7: Scalable Hardware for Quantum Computing
Alirio Boaventura, Kyle Thompson
Alirio Boaventura, Maybell Quantum
Maybell Quantum, Maybell Quantum
(08:00 - 17:20)
Abstract
WSA-8: Addressing Integration Challenges in CMOS RF Circuits at Cryogenic Temperatures
James Kirkman, Grayson Noah
Grayson Noah, Quantum Motion
Quantum Motion, Quantum Motion
(08:00 - 17:20)
Abstract
WSA-9: Can Wireless Interfacing Address the Qubit Upscaling Challenge?
Chong Li
Chong Li, Univ. of Glasgow
Univ. of Glasgow
(08:00 - 17:20)
Gabriele Formicone, David Brown
Integra Technologies, BAE Systems
Location
209ABC
Abstract

This workshop gathers together world experts, research and industry leaders to report and discuss the latest RF/MW technology developments that continue to drive innovation in high-power applications in Aerospace & Defense, as well as in ISM. Specific areas of interest discussed in this workshop span from vacuum tubes (VEDs) to solid-state transistors for active devices, to circuit design and techniques, as well as specific applications that leverage the benefits of the evolving technology. This full-day workshop is geared towards practitioners in the high-power RF/MW aerospace, defense, industry, scientific and medical areas who want to gain a broader perspective on the latest technology developments as well as nuances specific to each different application. Novices and newcomers to the A&D and ISM industry will also gain a comprehensive exposure and understanding of the RF/MW landscape that drives innovation in this specific arena.

Technical Papers
Abstract
WSC-1: Traveling Wave Tube Amplifiers for Space System Transmitters
Andrew Moulthrop, Michael S. Muha
Andrew Moulthrop, Aerospace
Aerospace, Aerospace
(08:00 - 17:20)
Materials
workshops-2023/WSC_1.pdf
Abstract
WSC-2: Development of High-Power Vacuum Electron Devices for Radar
Monica Blank, Mohamed D. Abouzahra, Michael MacDonald
Monica Blank, CPI
CPI, MIT Lincoln Laboratory, MIT Lincoln Laboratory
(08:00 - 17:20)
Materials
workshops-2023/WSC_2.pdf
Abstract
WSC-3: High-Power RF Technology for Solid-State Radar
Nestor Lopez, Michael MacDonald, Mohamed D. Abouzahra
Nestor Lopez, BAE Systems
BAE Systems, MIT Lincoln Laboratory, MIT Lincoln Laboratory
(08:00 - 17:20)
Materials
workshops-2023/WSC_3.pdf
Abstract
WSC-4: Technology Options for Phased Array Beamforming
Frank E. van Vliet
Frank E. van Vliet, TNO
TNO
(08:00 - 17:20)
Materials
workshops-2023/WSC_4.pdf
Abstract
WSC-5: Overview of Modern High-Power Microwave (HPM) Technologies and Challenges
Feyza Berber Halmen, Travis Fields, Roy C. Allen
Feyza Berber Halmen, MIDE
MIDE, MIDE, MIDE
(08:00 - 17:20)
Materials
workshops-2023/WSC_5.pdf
Abstract
WSC-6: High-Power RF Pallet and Transistor Solutions for Radar and Avionic Systems from UHF to S-Band
John Walker, James Custer
John Walker, Integra Technologies
Integra Technologies, Integra Technologies
(08:00 - 17:20)
Materials
workshops-2023/WSC_6.pdf
Abstract
WSC-7: High-Power RF/Microwave Systems in Medical and Agricultural Applications
Paolo F. Maccarini
Paolo F. Maccarini, Duke Univ.
Duke Univ.
(08:00 - 17:20)
Abstract
WSC-8: Solid-State Amplifiers for Noninvasive Thermo-Acoustic Imaging to Diagnose Liver Fat and Other Medical Applications
Chris Davis
Chris Davis, ENDRA Life Sciences
ENDRA Life Sciences
(08:00 - 17:20)
Abstract
WSC-9: The Role of RF Technology in MR Imaging (MRI) Systems
Daniel Myer
Daniel Myer, CPC
CPC
(08:00 - 17:20)
Abstract
WSC-10: Build-a-Radar Self-Paced Massive Open Online Course (MOOC) for Students of All Backgrounds
Kenneth E. Kolodziej
Kenneth E. Kolodziej, MIT Lincoln Laboratory
MIT Lincoln Laboratory
(08:00 - 17:20)
Naoki Shinohara, Christopher T. Rodenbeck
Kyoto Univ., U.S. Naval Research Laboratory
Location
144C
Abstract

Recently, new research projects toward Space Based Solar Power (SBSP) and related beam Wireless Power Technology (WPT) are born simultaneously in the world. The SBSP was originally called a Solar Power Satellite (SPS) and it was proposed in 1968. The SBSP is a future power station in geostationary satellite orbit and the electricity generated in space is transmitted wirelessly via microwave beam to the ground. In the past 50 years, research and development projects toward the SBSP were carried out several times in US, in Japan, and in Europe. In each R&D project, new SBSPs were designed with the latest technology at the time. What is different now is that the industrial revolution is happening in parallel. For example the commercial WPT (both coupled WPT and far-field WPT) market has started in the past 10 years. Revolutionary start-up companies for space applications are developing. Based on changes in the business market, new R&D projects toward the SBSP have now started in US, in Japan, in Europe, in China, and in other countries. In this workshop, we focus on the new technologies and new R&D projects of the SBSP and related beam WPT R&Ds. The requirements of the beam WPT for the SBSP are accurate beam forming with a huge phased array, high-efficiency microwave transmitter/generators, novel high-efficiency devices, high-efficiency rectifiers with diodes, harmonization between the WPT beam and conventional wireless systems, and suppression of interference between the WPT beam and space plasma/atmosphere, etc. ITU-R (International Telecommunication Union Radiocommunication Sector) recommends frequencies suitable for commercial WPT, especially weak-powered wide-beam WPT in 2022. The Japanese government established new radio regulation of the weak-powered wide-beam WPT in 2022. Radio regulations are under discussion for beam WPT suitable not only for the SBSP but also for WPT aided drone, etc, which is the expected 2nd step of commercial WPT in the world. The WPT technologies introduced in this session are widely applicable both to the SBSP and to 2nd step commercial WPT.

Technical Papers
Abstract
WSD-1: Terrestrial Microwave Power Beaming at Distances >1km
Christopher T. Rodenbeck
Christopher T. Rodenbeck, U.S. Naval Research Laboratory
U.S. Naval Research Laboratory
(08:00 - 17:20)
Materials
workshops-2022/WSD_1.pdf
Abstract
WSD-2: Space Demonstration Experiment Towards Practical Solar Power Satellite
Koji Tanaka, Koichi Ijichi, Hiroki Yanagawa, Hidetoshi Kitabatake
Koji Tanaka, JAXA
JAXA, Japan Space Systems, Japan Space Systems, Japan Space Systems
(08:00 - 17:20)
Materials
workshops-2023/WSD_2.pdf
Abstract
WSD-3: ESA’s SOLARIS Initiative and Technology Developments for Wireless Power Transmission
Sanjay Vijendran
Sanjay Vijendran, ESA
ESA
(08:00 - 17:20)
Materials
workshops-2023/WSD_3.pdf
Abstract
WSD-4: Simulating Gigascale Antenna Arrays with Open Source Software
Francesco Raimondo
Francesco Raimondo, Univ. of Bristol
Univ. of Bristol
(08:00 - 17:20)
Materials
workshops-2023/WSD_4.pdf
Abstract
WSD-5: Korean SBSP Pilot System and High-Powered WPT Technology
Sang-Hwa Yi
Sang-Hwa Yi, KERI
KERI
(08:00 - 17:20)
Materials
workshops-2023/WSD_5.pdf
Abstract
WSD-6: (Space-Based Solar) Wireless Power Transfer: The Airbus Vision
Volker Ziegler
Volker Ziegler, Airbus
Airbus
(08:00 - 17:20)
Abstract
WSD-7: Scaled SBSP Demonstration Mission and Wireless Power Transfer for Space Applications
Matto Madi
Matto Madi, Sirin Orbital Systems
Sirin Orbital Systems
(08:00 - 17:20)
Abstract
WSD-8: Technical Advances and Market Progress Towards Intelligent Power-Beaming Microgrids
Chris Davlantes
Chris Davlantes, Reach
Reach
(08:00 - 17:20)
Abstract
WSD-9: CASSIOPeiA Antenna with Steering Scaled Indoor Experiments (CASSIE)
Neil Buchanan
Neil Buchanan, Queen’s University Belfast
Queen’s University Belfast
(08:00 - 17:20)
Abstract
WSD-10: Introduction to the Proposed High-Power Electric Generation and WPT Demonstration Mission
XinBin Hou
XinBin Hou, CAST
CAST
(08:00 - 17:20)
Abstract
WSD-11: The Development of SBSP Experimental Base and Comprehensive Research Facility
Huaiqing Zhang
Huaiqing Zhang, Chongqing Univ.
Chongqing Univ.
(08:00 - 17:20)
Abstract
WSD-12: Novel Satellite Experient by CLATEC
Ali Hajimiri
Ali Hajimiri, Caltech
Caltech
(08:00 - 17:20)
Xun Luo, Qingfeng Zhang, Sukomal Dey, Guoan Wang
UESTC, SUSTech, IIT Palakkad, Univ. of South Carolina
Location
201
Abstract

With ever-increasing advances in the fields of the modern wireless technologies (eg 6G and radar systems), the design of compact and multi-functional transceivers to meet the stringent requirements demanded by such systems remains a great challenge. In this context, multi-functional RF integrated passive components (IPCs) are considered key building circuits for their development. These components are based on novel miniaturized structures and specific technologies that can be utilized for the implementation of RF, microwave, mm-wave, and THz wireless systems. This unique workshop focuses, for the first time, on the area of IPCs and their applications in the context of 6G wireless and radar scenarios by reporting recent research findings in this exciting field. This includes current progress in miniaturized RF passive components enabling multi-functional and adaptive radios from the aspects of thin-films integration (eg ferroelectric and ferromagnetic thin films), on-chip tuning techniques (eg diodes and transistors) and novel THz (eg f-band, D-band, etc) passive components with application in active circuits will be presented. Furthermore, state-of-the-art transmission line synthesis and development will be presented. In particular, the technique of mode diversity and mode composition will be explained and discussed with a number of examples, including an emerging concept of mode selectivity. Theoretical and experimental results will be presented in an effort to explore structural integration, physical agility, multifunctional operation, and performance enhancement of integrated transmission lines. In addition, multi-functional on-chip reflectionless components (eg CMOS and SiGe passives) and integrated antenna sub-system, along with hybrid acoustic-wave lumped-element microwave resonator technologies for the realization of advanced compact microwave filtering devices are described. Finally, the latest advances in the area of RF to THz passive micro-systems for multi-functional applications in 6G, radar system, and beyond, will also be presented.

Technical Papers
Abstract
WSE-1: Exploring Structural Integration, Physical Agility, Multifunctional Operation, and Performance Enhancement through Mode-Diversity and Mode-Selectivity
Ke Wu
Ke Wu, Polytechnique Montréal
Polytechnique Montréal
(08:00 - 17:20)
Materials
workshops-2023/WSE_1.pdf
Abstract
WSE-2: Multiple Functional RF Passives Enabled with Thin-Films and Techniques
Guoan Wang
Guoan Wang, Univ. of South Carolina
Univ. of South Carolina
(08:00 - 17:20)
Materials
workshops-2023/WSE_2.pdf
Abstract
WSE-3: Field-Controlled Ferroelectric Film Bulk Acoustic Wave Resonators and Filters
Amir Mortazawi
Amir Mortazawi, Univ. of Michigan
Univ. of Michigan
(08:00 - 17:20)
Materials
workshops-2023/WSE_3.pdf
Abstract
WSE-4: Novel F-Band, D-Band SiC Substrate-Integrated Waveguide Passive Components with Application in Active Circuits for 6G and Beyond
James Hwang
James Hwang, Cornell Univ.
Cornell Univ.
(08:00 - 17:20)
Materials
workshops-2023/WSE_4.pdf
Abstract
WSE-5: Phase Change Material (PCM) Microwave and mm-Wave Reconfigurable Devices
Raafat R. Mansour
Raafat R. Mansour, Univ. of Waterloo
Univ. of Waterloo
(08:00 - 17:20)
Materials
workshops-2023/WSE_5.pdf
Abstract
WSE-6: Emerging Additive Manufacturing Technologies for mm-Wave and Sub-THz Applications
Yang Yang
Yang Yang, UTS
UTS
(08:00 - 17:20)
Abstract
WSE-7: Empowering Multi-Band 5G/6G Wireless and Beyond from Passive Components to Active Microsystem
Xun Luo
Xun Luo, UESTC
UESTC
(08:00 - 17:20)
Alberto Valdes-Garcia, Young-Kai Chen, Arun Paidimarri
IBM T.J. Watson Research Center, Coherent
Location
150AB
Abstract

Algorithms and processing pipelines based on Artificial-Intelligence (AI) and Machine-Learning (ML) techniques are on a solid trajectory to become an integral part of the next generation of wireless systems. While the exploration of AI/ML to RF applications started decades ago, their development has accelerated recently with the increasing availability of advanced AI knowledge, high-capacity compute infrastructure, and wireless testbeds for generation and training data sets. Nevertheless, the development of AI-enhanced wireless systems remains a challenging multi-disciplinary task, where EM, RF, IC design, signal processing, and ML expertise are all equally important. Emerging 6G wireless communications systems and mm-wave radar applications call for accelerated developments in this area. In particular, power consumption and latency requirements may require the implementation of optimized feature extraction methods in mixed-signal ICs closer to the antennas. The goal of this workshop is to bring together a set of active researchers to share their vision and expertise on these topics in order to bring a cross-disciplinary awareness and understanding among RFIC, AI, and systems communities. The speakers span academic and industrial research institutions from across the globe and the presentations will cover both wireless communications and radar.

Technical Papers
Abstract
WSL-1: AI/ML Empowered High-Order Modulations for 6G High Capacity Communications
Caleb Lo
Caleb Lo, Samsung
Samsung
(08:00 - 17:20)
Materials
workshops-2023/WSL_1.pdf
Abstract
WSL-2: (Air)space is the Final Frontier: The Role of mm-Wave Systems in Sensing and Communication for UAVs
Kaushik Chowdhury
Kaushik Chowdhury, Northeastern University
Northeastern University
(08:00 - 17:20)
Materials
workshops-2023/WSL_2.pdf
Abstract
WSL-3: Machine-Learning Physical-Layer Receivers for Future 6G Networks
Mikko Valkama
Mikko Valkama, Tampere University of Technology
Tampere University of Technology
(08:00 - 17:20)
Materials
workshops-2023/WSL_3.pdf
Abstract
WSL-4: Neural Networks and Dictionary Learning for Compressive, Phase-less, mm-Wave Beam Alignment
Danijela Cabric
Danijela Cabric, Univ. of California, Los Angeles
Univ. of California, Los Angeles
(08:00 - 17:20)
Materials
workshops-2023/WSL_4.pdf
Abstract
WSL-5: Multi-Modal Sensing Front-Ends Using Wireless Above 100GHz and Lidar
James F. Buckwalter
James F. Buckwalter, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara
(08:00 - 17:20)
Materials
workshops-2023/WSL_5.pdf
Abstract
WSL-6: Adaptive Analog Feature Extraction: Algorithm and Hardware Primitives
Saibal Mukhopadhyay
Saibal Mukhopadhyay, Georgia Tech
Georgia Tech
(08:00 - 17:20)
Materials
workshops-2023/WSL_6.pdf
Abstract
WSL-7: High-Resolution mm-Wave Imaging and Detection for Self-Driving Cars
Jungfeng Guan, Haitham Al-Hassanieh
Jungfeng Guan, EPFL
EPFL, EPFL
(08:00 - 17:20)
Materials
workshops-2023/WSL_7.pdf
Abstract
WSL-8: Concealed Object Detection with 3D Radar and DNN-Based Feature Extraction
Asaf Tzadok
Asaf Tzadok, IBM T.J. Watson Research Center
IBM T.J. Watson Research Center
(08:00 - 17:20)
Materials
workshops-2023/WSL_8.pdf
Abstract
WSL-9: Deep mm-Wave Gait Analysis: Challenges and Opportunities
Amin Arbabian
Amin Arbabian, Stanford Univ.
Stanford Univ.
(08:00 - 17:20)
Materials
workshops-2023/WSL_9.pdf
Abstract
WSL-10: Machine-Learning Application in Surveillance and Infrastructure Radars — Small Target Detection and Identification of Vulnerable Road Users
Simon Wagner
Simon Wagner, Fraunhofer FHR
Fraunhofer FHR
(08:00 - 17:20)
Materials
workshops-2023/WSL_10.pdf
Bahar Jalali Farahani, Mahdi Parvizi, Salvatore Finocchiaro, Ko-Tao Lee
Cisco, Qorvo
Location
151AB
Abstract

As the Moore’s law is coming to an end, separating large systems into smaller chips based on their functionality is not only a cost-benefit solution but it allows the complex system to expand beyond theoretical size limits. Although chiplet technology has been around for many years, it has not been till the rise of the AI supercomputers and the accompanied unprecedented computational demand that put the spotlight on SiPs (System in Package). There are different aspects to the design of chiplets including the packaging, the high-speed chip-to-chip interconnect and the interoperability and standardization which allow the SiP built by the combination of chips from different vendors. There are multiple benefits to the chiplet-based architectures. Breaking down the large complex systems into smaller chips based on their functionality means better yields and lower cost due to the lower probability of manufacturing defects. Cost reduction can also come with customizing the process technology for each chiplet (eg using advanced nodes for GPUs and CPUs and less expensive technologies for memories and analog interfaces). Design upgrades can also be done on certain functional blocks without the need for redesigning the whole system. To take full advantage of chiplet-based architectures, the D2D (die-to-die) interface needs to be standardized. The interoperability allows the developer to use multiple vendors. In terms of the packaging, development of 3DHI (3D Heterogeneous Integration) that enables stacking up separately manufactured components, is the perfect technology choice for chiplet-based architectures. Additionally, the ever-increasing demand for high-throughput communication links and high-resolution radar sensors is driving the development of future wireless systems at higher operating frequencies. In order to support multiple functionality, the flexibility requested to those systems, is driving the adoption of large phased array antennas. Heterogeneous technologies and vertical 3D integration will play a vital role in enhancing the performance and functional density, along with reducing the size and costs, of such RF systems. In addition to the already mentioned standardization, both on the digital and RF side, 3DHI will pose a new set of technology (processes and substrates), design (MMICS, RFIC, analog, power management, passives), packaging and thermal challenges. This workshop will address some of the challenges mentioned above both from the digital and RF point of view, combining commercial and defense perspectives with state-of-the-art research in the field. Experts from industry and academia that are at the frontline of these developments are invited to address these issues and inform the audience about the latest advances in this field.

Technical Papers
Abstract
WSM-1: The Motivation for Chiplets
Tony Chan
Tony Chan, Univ. of Toronto
Univ. of Toronto
(08:00 - 17:20)
Materials
workshops-2023/WSM_1.pdf
Abstract
WSM-2: Chiplet Interconnect Solutions
Syrus Ziai
Syrus Ziai, Elivan, Inc.
Elivan, Inc.
(08:00 - 17:20)
Materials
workshops-2023/WSM_2.pdf
Abstract
WSM-3: Package-to-Package Scale-Out Interconnect Solutions Based on In-Package Optical I/O
Miloš Popović
Miloš Popović, Ayar Labs
Ayar Labs
(08:00 - 17:20)
Materials
workshops-2023/WSM_3.pdf
Abstract
WSM-4: Die-to-Die Interconnect Based on Micro-LED Arrays
Bardia Pezeshki
Bardia Pezeshki, Avicena
Avicena
(08:00 - 17:20)
Materials
workshops-2023/WSM_4.pdf
Abstract
WSM-5: Vertical Stacking with Si-Cored Substrates
Steven Verhaverbeke
Steven Verhaverbeke, Applied Materials
Applied Materials
(08:00 - 17:20)
Materials
workshops-2023/WSM_5.pdf
Abstract
WSM-6: Glass-Based Stitch-Chip Technologies and Advanced Packaging for mm-Wave HI
Muhannad S. Bakir
Muhannad S. Bakir, Georgia Tech
Georgia Tech
(08:00 - 17:20)
Materials
workshops-2023/WSM_6.pdf
Abstract
WSM-7: Building >100GHz Phased Array Systems using Standard 3D Integration Technologies
Gabriel M. Rebeiz
Gabriel M. Rebeiz, Univ. of California, San Diego
Univ. of California, San Diego
(08:00 - 17:20)
Materials
workshops-2023/WSM_7.pdf
Abstract
WSM-8: 3D Integration of ICs and Antennas for Ubiquitous mm-Wave Arrays
Arun Natarajan
Arun Natarajan, Oregon State Univ.
Oregon State Univ.
(08:00 - 17:20)
Materials
workshops-2023/WSM_8.pdf
Abstract
WSM-9: Thermal Management for 3DHI and Advanced Packaging
Robert Pearson
Robert Pearson, Lockheed Martin
Lockheed Martin
(08:00 - 17:20)
Materials
workshops-2023/WSM_9.pdf
Abstract
WSM-10: 3D Heterogenous Integration (3DHI) for Advanced Communications
Madhavan Swaminathan
Madhavan Swaminathan, Pennsylvania State Univ.
Pennsylvania State Univ.
(08:00 - 17:20)
Materials
workshops-2023/WSM_10.pdf
Vadim Issakov, Joseph C. Bardin
Technische Univ. Braunschweig, Google Quantum AI and UMass Amherst
Location
152AB
Abstract

Large-scale quantum computers promise to enable the solution to certain classes of problems for which no other efficient approaches are currently available. The realization of such a computer is hence a major open challenge that is being aggressively researched by academic and industrial teams across the globe. There are several types of competing qubit realizations, each offering different advantages. Yet, all of these realizations require some form of cryogenic cooling and most require RF electronics for control and potentially for readout (in several realizations the readout is optical). Moreover, integrating the control and/or readout electronics at an intermediate temperature stage within the cryostat is an attractive option. However, the circuits still need to fulfill stringent requirements on power consumption, spectral purity, noise budget etc, making their optimization challenging. As such, there is a growing opportunity for the RFIC community to influence this emerging field. In this full-day workshop the state-of-the-art in cryogenic RF circuits for various types of qubit realizations is reviewed. System considerations for various qubit modalities will be discussed, leading to the circuit-level specifications that drive the architectural considerations associated with control ICs targeting different qubit types. The talks will present different RF circuit design solutions for various types of qubits including silicon spin qubits, superconducting qubits, and trapped-ion qubits. The workshop features distinguished speakers from leading companies and academia, who will present their latest advances on cryogenic circuits for quantum computer applications. A brief concluding discussion will round-off the workshop to summarize the key learnings on the wide range of aspects presented during the day.

Technical Papers
Abstract
WSN-1: Control of Frequency Tunable Superconducting Processors
Juhwan Yoo
Juhwan Yoo, Google Quantum AI
Google Quantum AI
(08:00 - 17:20)
Materials
workshops-2023/WSN_1.pdf
Abstract
WSN-2: Cryogenic Circuits for Superconducting Qubit-Based Quantum Computing
Daniel Friedman
Daniel Friedman, IBM T.J. Watson Research Center
IBM T.J. Watson Research Center
(08:00 - 17:20)
Materials
workshops-2023/WSN_2.pdf
Abstract
WSN-3: Circuit Design for Large-Scale Quantum Controller SoC
Jae-Yoon Sim
Jae-Yoon Sim, POSTECH
POSTECH
(08:00 - 17:20)
Materials
workshops-2023/WSN_3.pdf
Abstract
WSN-4: Cryogenic CMOS Mixed-Signal Circuits for Quantum Computer
Hiroki Ishikuro
Hiroki Ishikuro, Keio Univ.
Keio Univ.
(08:00 - 17:20)
Materials
workshops-2023/WSN_4.pdf
Abstract
WSN-5: Circuit and System-Level Considerations Towards Scalable Trapped Ion Quantum Computer
Peter Toth
Peter Toth, Technische Univ. Braunschweig
Technische Univ. Braunschweig
(08:00 - 17:20)
Abstract
WSN-6: Multiplexed Qubit Control with Ultra-Low-Power, Base-Temperature Cryo-CMOS Multiplexer
Anton Potočnik
Anton Potočnik, IMEC
IMEC
(08:00 - 17:20)
Abstract
WSN-7: Cryo-CMOS Electrical Interfaces for Large-Scale Quantum Computers
Fabio Sebastiano
Fabio Sebastiano, Technische Universiteit Delft
Technische Universiteit Delft
(08:00 - 17:20)
Abstract
WSN-8: Cryo-CMOS Integrated Circuits Across a Silicon Qubit Quantum Computing Stack
Sushil Subramanian
Sushil Subramanian, Intel
Intel
(08:00 - 17:20)
Debopriyo Chowdhury, Hyun-Chul Park
Broadcom, Samsung
Location
146A
Abstract

The rapid increase in data throughput in recent 5G (FR1 and FR2), Wi-Fi (6E and 7), and 6G (FR3 in the near future) requires high-efficiency, linear and wideband RF power amplifiers. However, it is extremely challenging to simultaneously enhance the linearity and efficiency of the power amplifier, especially for spectrally-efficient and wide modulation bandwidths (eg 320MHz for Wi-Fi 7, 100MHz for 5G FR1, and >400MHz for FR2). Higher order constellations like 4k-QAM for Wi-Fi 7, 256-QAM for FR2 make PA design a challenging task. This workshop will cover the “practical” and “most promising” linearity and efficiency improvement techniques for RF power amplifiers and transmitters. Several techniques like wideband envelope tracking, Doherty power amplifiers, digital transmitters, mm-wave power amplifiers etc, will be covered in a tutorial type fashion, with emphasis on practical aspects of the design.

Technical Papers
Abstract
WSO-1: Power Amplifiers for High Peak-to-Average-Ratio Signals — Architectures and Tradeoffs of Efficiency, Linearity and Bandwidth
Peter Asbeck
Peter Asbeck, Univ. of California, San Diego
Univ. of California, San Diego
(08:00 - 17:20)
Materials
workshops-2023/WSO_1.pdf
Abstract
WSO-2: Design Techniques for Doherty Power Amplifiers to Enable Deep Backoff Efficiency Enhancement and Wide Modulation Bandwidth
Taiyun Chi
Taiyun Chi, Rice Univ.
Rice Univ.
(08:00 - 17:20)
Materials
workshops-2023/WSO_2.pdf
Abstract
WSO-3: Digital Envelope Tracking to Address 5G, 6G, and WiFi7 Power Efficiency
John Hoversten
John Hoversten, Eta Wireless
Eta Wireless
(08:00 - 17:20)
Materials
workshops-2023/WSO_3.pdf
Abstract
WSO-4: Design, Characterization and Linearization of Wideband Outphasing Power Amplifiers Operating within the Doherty-Chireix Continuum
Patrick Roblin
Patrick Roblin, The Ohio State University
The Ohio State University
(08:00 - 17:20)
Materials
workshops-2023/WSO_4.pdf
Abstract
WSO-5: Efficiency Enhancement Techniques for Digital Power Amplifiers
Yun Yin
Yun Yin, Fudan Univ.
Fudan Univ.
(08:00 - 17:20)
Materials
workshops-2023/WSO_5.pdf
Abstract
WSO-6: Efficient Wideband Digital Predistortion for Power Amplifier Linearization
Paul Draxler
Paul Draxler, MaXentric Technologies
MaXentric Technologies
(08:00 - 17:20)
Abstract
WSO-7: Highly Efficient and Linear mm-Wave Power Amplifiers for 5G FR2 Communication
Joonhoi Hur
Joonhoi Hur, Samsung
Samsung
(08:00 - 17:20)
Abstract
WSO-8: Recent Progress on Wideband Integrated SOI CMOS Power Amplifiers for Mobile and Wi-Fi Applications
Ayssar Serhan
Ayssar Serhan, CEA-LETI
CEA-LETI
(08:00 - 17:20)
Didier Belot, Wanghua Wu, Hao Gao
STMicroelectronics, Samsung, Technische Universiteit Eindhoven
Location
146B
Abstract

With technological advancement, the spectrum of possibilities within the realms of communication and sensing is expanding astonishingly. One of the most exciting frontiers in this domain is the utilization of mm-wave and sub-THz frequencies, offering a gateway to revolutionary advances in wireless communication and sensing. The workshop collects the transformative capabilities of mm-Wave and Sub-THz technologies, which collectively span the frequency range from 30GHz to 300GHz. This previously underutilized spectrum is now at the forefront of technological breakthroughs. At the heart of this paradigm shift lies the broadband front-end, a critical component that enables the seamless harnessing of mm-Wave and Sub-THz frequencies for applications that were once considered futuristic. One of the central themes of the workshop is the advancement of high-frequency communication technologies. Explore the latest developments in ultra-fast data transfer, low-latency networks, and the mm-wave and Sub-THz spectrum integration in wireless systems. Witness how these innovations reshape the connectivity landscape, enabling applications like 6G, autonomous vehicles, smart cities, etc. The workshop takes participants on a journey through the diverse applications of mm-wave and Sub-THz sensing, from radar systems that can revolutionize wireless communication to high-resolution imaging techniques that can potentially transform human life.

Technical Papers
Abstract
WSP-1: 28GHz, 60GHz and 140GHz mm-Wave Phased Arrays for Communication and Sensing Systems: a Common Platform
Gabriel M. Rebeiz
Gabriel M. Rebeiz, Univ. of California, San Diego
Univ. of California, San Diego
(08:00 - 17:20)
Materials
workshops-2023/WSP_1.pdf
Abstract
WSP-2: 6G Architectures and Technology Partitioning for Communication and Sensing
Yang Zhang, Giovanni Mangraviti
Yang Zhang, IMEC
IMEC, IMEC
(08:00 - 17:20)
Materials
workshops-2023/WSP_2.pdf
Abstract
WSP-3: Energy Efficient Communication and Sensing Front-Ends Enabled by Innovative Frequency Generation Techniques
Jose-Luis Gonzalez-Jimenez
Jose-Luis Gonzalez-Jimenez, CEA-LETI
CEA-LETI
(08:00 - 17:20)
Abstract
WSP-4: Pioneering Ultrahigh-Speed Terahertz Communication for 6G: Challenges and Opportunities
Minoru Fujishima
Minoru Fujishima, Hiroshima Univ.
Hiroshima Univ.
(08:00 - 17:20)
Materials
workshops-2023/WSP_4.pdf
Abstract
WSP-6: SiGe: BiCMOS Technology is Enabling D-Band Link with Active Phased Antenna Array
Andrea Pallotta, Didier Belot
Andrea Pallotta, STMicroelectronics, Didier Belot, STMicroelectronics
STMicroelectronics, STMicroelectronics
(08:00 - 17:20)
Materials
workshops-2023/WSP_6.pdf
Abstract
WSP-7: The Impact of Joint Communication and Sensing to Radio Front-End
Rui Hou
Rui Hou, Ericsson
Ericsson
(08:00 - 17:20)
Materials
workshops-2023/WSP_7.pdf
Abstract
WSP-8: The Evolution of Automotive Radar Circuits — from Gunn Diodes to CMOS SoCs
Christoph Wagner
Christoph Wagner, Silicon Austria Labs
Silicon Austria Labs
(08:00 - 17:20)
Materials
workshops-2023/WSP_8.pdf
Abstract
WSP-9: Broadband mm-Wave Front-End Design Methodology for Radar and Wireless Communication
Hao Gao
Hao Gao, Technische Universiteit Eindhoven
Technische Universiteit Eindhoven
(08:00 - 17:20)
Rocco Tam, Oren Eliezer, Jin Zhou, Kostas Doris
NXP Semiconductors, Samsung, MediaTek
Location
146C
Abstract

The reliance on digital beamforming and large arrays in mm-wave is increasing as communication and sensing systems migrate to higher frequency bands and occupy wider bandwidths. In this workshop experts in communications, automotive radar/sensing, antennas and silicon and packaging technologies will share their related experience and vision and discuss various challenges and solutions at the system, circuit, and technology levels.

Technical Papers
Abstract
WSQ-1: Re-Thinking the mm-Wave MIMO Radar Architecture for Future Automotive Radars
Kostas Doris
Kostas Doris, NXP Semiconductors
NXP Semiconductors
(08:00 - 17:20)
Abstract
WSQ-2: Integrated mm-Wave (IMMW) Wi-Fi
Carlos Cordeiro
Carlos Cordeiro, Intel
Intel
(08:00 - 17:20)
Abstract
WSQ-3: Design of Advanced mm-Wave Phased Array Modules
Bodhisatwa Sadhu
Bodhisatwa Sadhu, IBM T.J. Watson Research Center
IBM T.J. Watson Research Center
(08:00 - 17:20)
Abstract
WSQ-4: ICs and Transceivers for 100–300GHz Wireless (Comm and Sensing)
Mark Rodwell
Mark Rodwell, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara
(08:00 - 17:20)
Abstract
WSQ-5: True-Time-Delay Large Scale Array for Next-Generation Wireless
Subhanshu Gupta
Subhanshu Gupta, Washington State Univ.
Washington State Univ.
(08:00 - 17:20)
Abstract
WSQ-6: Emerging Devices and Heterogeneous Integration for Future mm-Wave Systems
Nadine Collaert
Nadine Collaert, IMEC
IMEC
(08:00 - 17:20)
Abstract
WSQ-7: Beamforming Challenges in 5G FR-2 Base Stations
Yuuichi Aoki
Yuuichi Aoki, Samsung
Samsung
(08:00 - 17:20)
Abstract
WSQ-8: Architecture, Design and Deployment Challenges of E-Band and D-Band Communication Systems
Shahriar Shahramian
Shahriar Shahramian, Nokia Bell Labs
Nokia Bell Labs
(08:00 - 17:20)
Zeshan Ahmad, Matt Markel
Cambridge Terahertz, Spartan Radar
Location
204ABC
Abstract

Sensing modalities are enabling technologies for the ongoing revolution in autonomy. This is evident from the global sensor market that was valued at B in 2019 and is projected to reach over B by 2028. Camera, LiDAR, and RADAR dominate the autonomy field, and IR/thermal is now emerging as an important modality in that space. However, today none of the sensing modalities alone can solve the abundant challenges needed for robust, reliable, and trust-worthy autonomy in difficult environments. To that end, this workshop brings together a unique mix of top industry, academic, and regulatory body speakers to discuss these challenges, the current solutions, and what we can expect today’s research to bring for tomorrow. The speakers bring a breadth of expertise and experiences ranging from electronics to photonics, integrated systems to sensor fusion, and OEMs to regulators; this insight comes together in a workshop-concluding panel discussion that dives deep into key forces pushing us towards — and holding us back from — autonomy.

Technical Papers
Abstract
WSR-1: Brief Workshop Introduction
Zeshan Ahmad
Zeshan Ahmad, Cambridge Terahertz
Cambridge Terahertz
(08:00 - 17:20)
Abstract
WSR-2: Software Defined Radars with the Resolution of Lidar
Antonio Puglielli
Antonio Puglielli, Zendar
Zendar
(08:00 - 17:20)
Abstract
WSR-3: Navigating Frequencies — A Comprehensive Exploration of Radar Applications and Beyond
Francisco Salmeron
Francisco Salmeron, A4Radar
A4Radar
(08:00 - 17:20)
Abstract
WSR-4: Digital Radar for Convergence of Sensing and Communications
Jungah Lee
Jungah Lee, Aura Intelligent Systems
Aura Intelligent Systems
(08:00 - 17:20)
Abstract
WSR-5: Silicon Photonics for Solid-State LiDAR and Beyond
Jelena Notaros
Jelena Notaros, MIT
MIT
(08:00 - 17:20)
Abstract
WSR-6: From IoT (Internet-of-Things) to AoT (Autonomy-of-Things)
Sabbir Rangwala
Sabbir Rangwala, Patience Consulting
Patience Consulting
(08:00 - 17:20)
Abstract
WSR-7: Advanced Sensing for Autonomy
Abdullah Zaidi
Abdullah Zaidi, Rivian
Rivian
(08:00 - 17:20)
Abstract
WSR-8: Enhanced Pedestrian Safety with 3D Thermal Ranging using AI for ADAS/AV Applications
Chuck Gershman
Chuck Gershman, Owl Autonomous Imaging
Owl Autonomous Imaging
(08:00 - 17:20)
Abstract
WSR-10: Panel Discussion
Matt Markel
Matt Markel, Spartan Radar
Spartan Radar
(08:00 - 17:20)

-

Ali Hajimiri
California Institute of Technology
Location
207AB
Abstract

In this technical lecture, we will discuss the fundamentals of noise processes within an oscillator and the associated design insights. We will start with understanding evolution of noise from device and external noise sources to phase noise. We will develop the time-varying phase noise model, discuss some of the nuances involved in it, and how a deeper understanding of that process can help us identify additional intuition in design of voltage controlled oscillators (VCO). We will investigate specific applications of this model to various kinds of oscillators, such as LC ad ring VCOs and how it fits with the general picture of frequency generation.

-

Huizhen Jenny Qian, Jeffrey Walling, Austin Chen
Xidian Univ., Virginia Tech, Peraso, Inc.
Location
143ABC
Abstract

Advanced CMOS technologies enable direct bits-to-RF conversion, which provides higher energy-efficiency and more compact die area, especially for sub-7GHz. Meanwhile, such digital intensive transmitters, with highly reconfigurable nature are well adapted for multifunction and intelligent communication systems. When the operation bands extend to mm-wave to meet the increasing data streaming requirements of modern communication systems (eg 5G, 6G, etc), digital intensive transmitters also exhibit potential advantages compared to traditional Cartesian transmitters. This workshop discusses techniques of digital intensive transmitters operating from sub-7GHz to mm-wave with continuous evolution of higher output power, efficiency, data-rate, and multi-functions such as distortion self-calibration, multi-band, multi-mode, etc.

Technical Papers
Abstract
WSG-1: Highly Efficient, Wideband, Frequency-Agile Digital Transmitters
Masoud Babaie, Marco Spirito, Leo de Vreede, Morteza S. Alavi
Masoud Babaie, Technische Universiteit Delft
Technische Universiteit Delft, Technische Universiteit Delft, Technische Universiteit Delft, Technische Universiteit Delft
(13:30 - 17:20)
Materials
workshops-2023/WSG_1.pdf
Abstract
WSG-2: Data-Rate Enhancement Techniques for Digital Transmitters
Huizhen Jenny Qian
Huizhen Jenny Qian, Xidian Univ.
Xidian Univ.
(13:30 - 17:20)
Materials
workshops-2023/WSG_2.pdf
Abstract
WSG-3: Versatile RF-DACs, from RF-to-mm-Wave, to Enable the Sixth Generation of Wireless Communication
Jeffrey Walling
Jeffrey Walling, Virginia Tech
Virginia Tech
(13:30 - 17:20)
Materials
workshops-2023/WSG_3.pdf
Abstract
WSG-4: Design of Digital-Intensive Wireless Transmitters
Yun Yin
Yun Yin, Fudan Univ.
Fudan Univ.
(13:30 - 17:20)
Materials
workshops-2023/WSG_4.pdf
Abstract
WSG-5: Road to Digitally Intensive Transmitter Architectures at mm-Waves
Khaled Khalaf
Khaled Khalaf, Pharrowtech
Pharrowtech
(13:30 - 17:20)
Materials
workshops-2023/WSG_5.pdf
Joseph Cali, Bichoy Bahr, Oren Eliezer
Raytheon, Texas Instruments, Samsung
Location
147AB
Abstract

Are you a student or a professional researcher seeking insights into the process of productizing ideas? Perhaps you are an experienced designer keen on understanding how fellow professionals have surmounted challenges during product development. If so, this workshop is tailored for you! Industry experts representing high-volume commercial integrated circuit (IC) companies, IP developers, aerospace, and defense sectors will share their experiences of navigating the journey from conceptualization to fielded product. Engaging discussions will encompass a diverse array of topics, spanning high-speed analog to digital converters, digital to analog converters, mm-wave packaging, multi-antenna beam steering calibration, RF front-ends and the benefits of RF/packaging co-simulation. During the developmental phase of prototypes, constraints related to budgets and schedules often hinder thorough validation, verification, and testing procedures. Consequently, this limitation can lead to the emergence of latent defects that remain undetected until later stages of productization. In these scenarios, research teams and start-ups may be primarily focused on core innovations and transformative concepts, only to encounter obstacles when the company aims to expedite the implementation of these ideas. For instance, in startup environments lacking dedicated facilities for environmental testing, issues like low-temperature oscillations (which are unobservable during simulations) may go unnoticed until far too late. The instances discussed within this workshop serve as valuable examples that can form the basis of a comprehensive checklist, enabling a smoother transition from the prototype phase to the final product. We hope this workshop could potentially prevent the need for extensive reiterations, saving both time and resources for you and your colleagues.

Technical Papers
Abstract
WSI-1: mm-Wave LGA and BGA Package Design and Assembly Challenges
Joel Dobler, Prabir Saha, Sukhjinder S. Deo
Joel Dobler, Analog Devices
Analog Devices, Analog Devices, Analog Devices
(13:30 - 17:20)
Materials
workshops-2023/WSI_1.pdf
Abstract
WSI-2: mm-Wave and RF Data Converter Design Challenges
Farhan Adil, Joseph Cali
Farhan Adil, Raytheon
Raytheon, Raytheon
(13:30 - 17:20)
Materials
workshops-2023/WSI_2.pdf
Abstract
WSI-3: High Frequency IC/Package Co-Design using Integrated Toolsets
Paul Mosinkskis
Paul Mosinkskis, Cadence
Cadence
(13:30 - 17:20)
Materials
workshops-2023/WSI_3.pdf
Abstract
WSI-4: Transitioning RF SiGe Designs from R&D into Production for Defense Systems
Gregory M. Flewelling
Gregory M. Flewelling, BAE Systems
BAE Systems
(13:30 - 17:20)
Materials
workshops-2023/WSI_4.pdf
Abstract
WSI-5: Phased Array Calibration: Overcoming Productization Challenges in CMOS Analog Beamforming Arrays
Viduneth Ariyarathna
Viduneth Ariyarathna, Samsung
Samsung
(13:30 - 17:20)
Materials
workshops-2023/WSI_5.pdf
Subhanshu Gupta, Antoine Frappé, Najme Ebrahimi
Washington State Univ., IEMN (UMR 8520), Univ. of Florida
Location
145AB
Abstract

With global networking data traffic predicted to reach petabytes in the next few years, mm-wave wireless communications enabled by silicon-based phased arrays is poised as a game-changer for new infrastructure applications. Emergence of untethered space constellations such as low-earth orbit (LEO) satellite communications approximately lying between 500km to 800km altitude such as Amazon Kuiper (590–630km), SpaceX Starlink (550–750km), OneWeb (1200km), and Telesat Lightspeed (1015–1325km) will further benefit global connectivity. By utilizing the fallow spectrum at mm-wave, it is expected to provide gigabits-per-second data rates to multiple users including under-served and remote areas. While planar mm-Wave phased arrays have cemented their position in communication systems, the future of satellite constellation hosting thousands of antenna elements is dependent on the choice of frequency, application, field-of-view, and form factor. Conformal phased arrays, which encompass mechanically flexible, foldable, or stretchable arrays, are one of the promising new frontiers of array development. Conformal antennas provides multiple degrees of freedom to the scan angle that is typically limited by antenna aperture. Recent works have demonstrated new viable research directions at the antenna-RF interface with the adaptive control that will be presented in this workshop.

Technical Papers
Abstract
WSK-1: Shape-Morphing Origami-Based Microwave Arrays for Reconfigurable Computational Imaging
Kaushik Sengupta
Kaushik Sengupta, Princeton Univ.
Princeton Univ.
(13:30 - 17:20)
Materials
workshops-2023/WSK_1.pdf
Abstract
WSK-2: A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
Atom Watanabe
Atom Watanabe, IBM T.J. Watson Research Center
IBM T.J. Watson Research Center
(13:30 - 17:20)
Materials
workshops-2023/WSK_2.pdf
Abstract
WSK-3: Additively Manufactured Flexible Tile-Based Massively Scalable Phased Arrays for 5G+ Enabled Smart Skins and Reconfigurable Intelligent Surfaces
Manos M. Tentzeris
Manos M. Tentzeris, Georgia Tech
Georgia Tech
(13:30 - 17:20)
Materials
workshops-2023/WSK_3.pdf
Abstract
WSK-4: Large-Aperture Flexible Phased Array with CMOS Beamformer for Small Satellites
Kenichi Okada
Kenichi Okada, Tokyo Tech
Tokyo Tech
(13:30 - 17:20)
Materials
workshops-2023/WSK_4.pdf

-

Giuseppe GRAMEGNA
IMEC
Magnus Wiklund
BeammWave AB
Location
150AB
Abstract

In this session five mm-wave integrated transmitters, receivers, phase arrays suitable for wireless communication and sensing are presented.
The session starts with a 60-GHz Positive-Feedback-Based Transmitter Front-End with a maximum 22.8% PAE in 28-nm Bulk CMOS for Inter-Satellite Communications.
The second paper reports A Ka-band 8-element 4-Beam Transmitter Front End with Hybrid VGA and Symmetrical Transformer-based Doherty PA.
The third paper describes a 32-element 25.8-30.8 GHz phased-array CMOS transmitter with programable temperature compensation technique that achieves ±0.002 dB/°C gain variation across –60-to-85 °C.
The fourth paper demonstrates a 45nm SOI 5G blocker-tolerant mm-wave MIMO receiver with up to 41dB spatial notch filtering.
Final paper of the session reports a 56 – 65 GHz FMCW radar transceiver with 7.8 dB NF and 8 GHz Chirp-Bandwidth in 65-nm CMOS.

Technical Papers
Abstract
RMo1A-1: A 60-GHz Positive-Feedback-Based Transmitter Front-End with 22.8% PAEmax in 28-nm Bulk CMOS for Inter-Satellite Communications
Kaijie Ding, Dusan Milosevic, Vojkan Vidojkovic, Khaled Khalaf, Mark Bentum, Peter Baltus
Kaijie Ding, Eindhoven Univ. of Technology
Eindhoven Univ. of Technology, Eindhoven Univ. of Technology, Eindhoven Univ. of Technology, Pharrowtech, Eindhoven Univ. of Technology, Eindhoven Univ. of Technology
(08:00 - 08:20)
Abstract
RMo1A-2: A Ka-band 8-element 4-Beam Transmitter Front End with Hybrid VGA and Symmetrical Transformer-based Doherty PA
Huiyan Gao, Hang Lu, Shaogang Wang, Nayu Li, Gaopeng Chen, Chunyi Song, Yen-Cheng Kuan, Qun Jane Gu, Zhiwei Xu
Huiyan Gao, Zhejiang Univ.
Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., National Yang Ming Chiao Tung Univ., Univ. of California, Davis, Zhejiang Univ.
(08:20 - 08:40)
Abstract
RMo1A-3: A 32-Element 25.8-to-30.8 GHz Phased-Array CMOS Transmitter with Programable Piecewise Linear Temperature-Compensation Technique Achieving ±0.002 dB/°C Gain Variation across –60-to-85 °C
Dongze Li, Wei Deng, Ziyuan Guo, Haikun Jia, Xintao Li, Xiangyu Nie, Ruiheng Qiu, Baoyong Chi
Dongze Li, Tsinghua Univ.
Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ.
(08:40 - 09:00)
Abstract
RMo1A-4: A Blocker-Tolerant mm-Wave MIMO Receiver with Spatial Notch Filtering Using Non-Reciprocal Phase-Shifters for 5G Applications
Shahabeddin Mohin, Soroush Araei, Mohammad Barzgari, Negar Reiskarimian
Shahabeddin Mohin, Massachusetts Institute of Technology
Massachusetts Institute of Technology, Massachusetts Institute of Technology, Massachusetts Institute of Technology, Massachusetts Institute of Technology
(09:00 - 09:20)
Abstract
RMo1A-5: A 56 – 65 GHz Highly-Integrated FMCW Radar Transceiver with 7.8dB NF and 8 GHz Chirp-Bandwidth in 65-nm CMOS
Jiangbo Chen, Shengjie Wang, Jiabing Liu, Qizhou Yang, quanyong li, Jane Gu, Chunyi Song, Na Yan, Zhiwei Xu, Hui Nie
Jiangbo Chen, Zhejiang Univ.
Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., Univ. of California, Davis, Zhejiang Univ., Fudan Univ., Zhejiang Univ., Zhejiang Univ.
(09:20 - 09:40)
Frederic Gianesello
STMicroelectronics
Harshpreet Bakshi
Texas Instruments, Inc.
Location
151AB
Abstract

This session is dedicated to advances in Silicon and III-V technologies enabling innovative mmW IC design ultimately leveraging advanced packaging including heterogeneous integration strategies to develop next generation mmW systems. The first paper of the session will describe a wideband 5G FR2 5G FEM in 150-nm GaN on SiC technology. The second paper will then extend III-V technology capability by proposing an innovative heterogeneous integration with Silicon technology. The third paper focuses on advanced packaging by presenting a high performance glass interposer targeting D-band mmW system. The fourth paper presents advances in Silicon technologies by introducing an innovative LDMOS device in 22-nm FD SOI technology targeting Wi-Fi power amplifiers, while the fifth and final paper will complement this update on PA design by introducing an innovative wideband directional coupler design achieved in RF SOI technology.

Technical Papers
Abstract
RMo1B-1: A 24-30 GHz GaN Front-End MMIC with Coupled-Resonator based Transmit/Receive Switch for 5G Millimeter-Wave Applications
Dingyuan Zeng, Haoshen Zhu, Qi Cai, Guangxu Shen, Outong Gao, Wenquan Che, Quan Xue
Dingyuan Zeng, South China Univ. of Technology
South China Univ. of Technology, South China Univ. of Technology, Nanjing University of Posts and Telecommunications, Nanjing University of Posts and Telecommunications, South China Univ. of Technology, South China Univ. of Technology, South China Univ. of Technology
(08:00 - 08:20)
Abstract
RMo1B-2: Heterogeneously-Integrated Gallium Nitride and Indium Phosphide Devices for Ka-band Amplifiers
Justin Kim, Michael Hodge, Mark Soler, Florian Herrault, Daniel Green, James Buckwalter
Justin Kim, PseudolithIC, Inc.
PseudolithIC, Inc., PseudolithIC, PseudolithIC, Inc., PseudolithIC, PseudolithIC, PseudolithIC
(08:20 - 08:40)
Abstract
RMo1B-3: A G-Band Glass Interposer Technology for the Integration of an Amplified Noise Source based on SiGe BiCMOS 55-nm Technology
Maya Alawar, Victor Fiorese, Sylvie Lepilliet, Daniel Gloria, Guillame Ducournau, Emmanuel Dubois
Maya Alawar, Univ. of Lille
Univ. of Lille, STMicroelectronics, Univ. of Lille, STMicroelectronics, Univ. of Lille, Univ. of Lille
(08:40 - 09:00)
Abstract
RMo1B-4: A 22FDX® Wi-Fi PA demonstrating a new LDMOS Device with 10V Breakdown achieving Output Power of 29.5dBm at 40% PAE
Arul Balasubramaniyan, Xuemei Hui, Abdellatif Bellaouar, Miguel Meza Campos, Apurv Bharadwaj, Elanchezhian Veeramani, Shafiullah Syed
Arul Balasubramaniyan, GLOBALFOUNDRIES
GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES
(09:00 - 09:20)
Abstract
RMo1B-5: A Reconfigurable Compact Multiband RF Bi-directional Coupler for sub-6 GHz RF Front-Ends in RF SOI CMOS Switch Technology
Ting-Li Hsu, Amelie Marietta Hagelauer, Valentyn Solomko
Ting-Li Hsu, Tech. Univ. of Munich
Tech. Univ. of Munich, Tech. Univ. of Munich, Infineon Technologies AG
(09:20 - 09:40)
Pierluigi Nuzzo
Univ. of Southern California
Yao-Hong Liu
IMEC
Location
152AB
Abstract

This session provides an overview of the latest advances in RF systems for low-power sensing and 5G applications. It features a self-reconfigurable RF energy harvesting system with voltage regulation and wide power dynamic range as well as a compact RFSOI CMOS 5G phased-array transceiver with outstanding TX average output power performance and RX noise figure. The session then introduces a novel RF sensing system with enhanced linearity and dynamic range for microplastic detection followed by a record harmonic-rejection-ratio frequency quadrupler for 5G applications and a time-division power and data transfer system for wirelessly powered biopotential sensing.

Technical Papers
Abstract
RMo1C-1: A 2.4 GHz, -19dBm Sensitivity RF Energy Harvesting CMOS Chip with 51% Peak Efficiency and 24 dB Power Dynamic Range
Jing-Ren Yan, Yao-Wei Huang, Wei-Jen Lai, Jen-Hao Liao, Ching-Chun Lin, Yu-Te Liao
Jing-Ren Yan, National Yang Ming Chiao Tung Univ.
National Yang Ming Chiao Tung Univ., National Yang Ming Chiao Tung Univ., Novatek Microelectronics Corp., Novatek Microelectronics Corp., Novatek Microelectronics Corp., National Yang Ming Chiao Tung Univ.
(08:00 - 08:20)
Abstract
RMo1C-2: A 45 nm RFSOI CMOS-based 24.25-29.5 GHz 2×16-Channel Phased-Array Transceiver IC for 5G NR Applications
Jooseok Lee, Seungjae Baek, Kihyun Kim, Seungwon Park, Hansik Oh, Taewan Kim, Joonho Jung, Jinhyun Kim, Sehyug Jeon, Jee Ho Park, Woojae Lee, Jaehong Park, Dong-hyun Lee, Sangho Lee, Jeong Ho Lee, Ji Hoon Kim, Younghwan Kim, Sangyong Park, Bohee Suh, Soyoung Oh, Dongsoo Lee, Juho Son, Sung-gi Yang
Jooseok Lee, Samsung Electronics Co., Ltd.
Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd.
(08:20 - 08:40)
Abstract
RMo1C-3: A Fully Integrated Microplastic Detection SoC with 0.1–3 GHz Bandwidth and 35 dB Dynamic Range for Narrow-Band Notch RF MEMS Sensor System
Seung-Beom Ku, Jinhyoung Kim, Kwon-Hong Lee, Han-Sol Lee, Kyeongho Eom, Joonghoon Kang, Hyungjin Jung, Cheolung Cha, Hyung-Min Lee
Seung-Beom Ku, Korea Univ.
Korea Univ., Korea Electronics Technology Institute, Korea Univ., Korea Univ., Korea Univ., Korea Univ., Korea Univ., Korea Electronics Technology Institute, Korea Univ.
(08:40 - 09:00)
Abstract
RMo1C-4: A 21-27-GHz Frequency Quadrupler in 0.13um SiGe BiCMOS with 0-dBm Pout and 40-dBc HRR for Wideband 5G Applications
Caglar Ozdag, Arun Paidimarri, Masayuki Yoshiyama, Yuichiro Yamaguchi, Yujiro Tojo, Bodhisatwa Sadhu
Caglar Ozdag, IBM Research
IBM Research, IBM T.J. Watson Research Center, Fujikura Ltd., Fujikura Ltd., Fujikura Ltd., IBM T.J. Watson Research Center
(09:00 - 09:20)
Abstract
RMo1C-5: Design of a Dual-Mode Coil-Reuse Data Acquisition System for Miniaturized Wirelessly Powered Biopotential Sensing Nodes
Hamid Jafari Sharemi, Aydin Babakhani
Hamid Jafari Sharemi, Univ. of California, Los Angeles
Univ. of California, Los Angeles, Univ. of California, Los Angeles
(09:20 - 09:40)

-

Valentyn Solomko, Amelie Hagelauer, Xu Zhu
Infineon Technologies, Technische Univ. München, Menlo Microsystems
Location
143ABC
Abstract

High-voltage, linear RF switches are extensively demanded in a wide variety of applications, ranging from high-volume, cost-efficient cellular handsets to performance-centric and high-reliability automated test and measurements, RF infrastructure, military, and medical systems. Antenna tuning techniques utilized in modern cellular mobile devices have been the main driver for rapid improvement of commercial solid-state CMOS-based high-voltage switches. A need for more radical RF performance improvement in other demanding applications calls for innovative solutions based on RF-MEMS and disruptive PCM switch technologies. In this workshop experts from industry and academia will report on recent advances in MOSFET-based, RF-MEMS and PCM-switches for RF communication and test platforms. A panel session will conclude the event, where the speakers will debate on the insights and outlooks for the trending technology candidates for switchable RF devices in cellular RF front-ends, automated test and measurement systems, industrial/military radios and others.

Technical Papers
Abstract
WMB-1: Antenna Tuning in Mobile Phones
Dirk Manteuffel
Dirk Manteuffel, Leibniz Univ. Hannover
Leibniz Univ. Hannover
(08:00 - 11:50)
Materials
workshops-2023/WMB_1.pdf
Abstract
WMB-2: Chasing Ideality with Ohmic RF MEMS Switches
Chris Keimel
Chris Keimel, Menlo Microsystems
Menlo Microsystems
(08:00 - 11:50)
Materials
workshops-2023/WMB_2.pdf
Abstract
WMB-3: Engineered SOI Substrates for RF and mm-Wave Switches
Jean-Pierre Raskin
Jean-Pierre Raskin, UCLouvain
UCLouvain
(08:00 - 11:50)
Materials
workshops-2023/WMB_3.pdf
Abstract
WMB-4: PCM-Based Tunable Circuits and Switches
Pierre Blondy
Pierre Blondy, XLIM and Université de Limoges
XLIM and Université de Limoges
(08:00 - 11:50)
Materials
workshops-2023/WMB_4.pdf
Abstract
WMB-5: Recent Advances in High-Voltage MOSFET-Based RF Switches for Antenna Tuning Applications
Valentyn Solomko
Valentyn Solomko, Infineon Technologies
Infineon Technologies
(08:00 - 11:50)
Materials
workshops-2023/WMB_5.pdf
Kamal K. Samanta, Huei Wang
AMWT, National Taiwan Univ.
Location
145AB
Abstract

The realization of advanced front-end modules (FEM) for mobile applications, whether below 6GHz and definitely at mm-wave, and their packaging, pose daunting design challenges to fit significant electrical functionality within a relatively small space while meeting or exceeding electrical, mechanical, thermal, and reliability requirements for both the UE and BS use-cases at a low cost. As a result, it will be more important to solve signal integrity, reduce insertion losses imposed by various interconnects and packaging techniques at the chip, module, and board levels with co-engineering across disciplines, and realize an integrated module cost-effectively. This workshop is organized to address current and future design and manufacturing techniques by bringing together subject-matter experts from the IEEE Electronic Packaging Society (EPS) and the MTT-S communities. Presentations will cover the state-of-the-art in advanced, cost-effective multichip module integration, integrated passive devices (IPD) and interposer technologies for circuit and system design for signal diversity, and beam-forming approaches that would leverage emerging next-generation wireless communications, including handset modules, economically. In particular, the workshop will highlight the latest advances and state-of-the-art developments in interposer technologies, including high-resistive Si, glass, and organic substrates for 2.5D/3D IC integration through vias (TSV/TGV), high-Q IPDs, antennas in packages (AiP), and wafer-scale packaging, covering sub-6GHz 5G to 300GHz 6G applications. The workshop will discuss the relative merits and de-merits of existing approaches in terms of losses, Q, isolation, non-linearity, and, most importantly, cost, and it will provide possible solutions with future directions. This will present advanced HR Si (with buffer, passivation, and isolation layers) and glass-based high-Q IPDs integrating filters, matching networks, and integration of antennas optimizing radiation pattern and system performance; RF-optimized silicon interposer developed with TSV and IPDs for above 100GHz applications with particular focus on antenna, CMOS, III-V integration, and thermal management of highly scaled solutions. Further, it will present recent progress in using glass as a material for MMIC packages in the D-band, using the organic chip carrier glass IPD process to design antennas-in-package, and including the design of transmission lines, flip-chip transitions, and antenna arrays for realizing cost-effective integrated modules in the 150GHz and 300GHz bands. The speakers are the experts and are the leading contributors in both the industrial and academic sectors.

Technical Papers
Abstract
WME-1: Integrated Passive Device Platform for RF Interposers and Multi-Chip Module Integration
Tauno Vähä-Heikkilä
Tauno Vähä-Heikkilä, VTT
VTT
(08:00 - 11:50)
Materials
workshops-2023/WME_1.pdf
Abstract
WME-2: RF-Optimized Silicon Interposer for mm-Wave and Sub-THz Applications — Technology, Design and System Considerations
Siddhartha Sinha, Eric Beyne
Siddhartha Sinha, IMEC
IMEC, IMEC
(08:00 - 11:50)
Abstract
WME-3: mm-Wave and THz Antenna Integration within Semiconductor Packages
Harshpreet Bakshi
Harshpreet Bakshi, Texas Instruments
Texas Instruments
(08:00 - 11:50)
Materials
workshops-2023/WME_3.pdf
Abstract
WME-4: Antenna-in-Package Design for 6G at 150GHz and 300GHz Bands
Hsin-Chia Lu
Hsin-Chia Lu, National Taiwan Univ.
National Taiwan Univ.
(08:00 - 11:50)
Materials
workshops-2023/WME_4.pdf
Abstract
WME-5: Glass Packages and Technology for MMICs at D-Band
Martin Hitzler, Christian Waldschmidt
Martin Hitzler, Universität Ulm, Christian Waldschmidt, Universität Ulm
Universität Ulm, Universität Ulm
(08:00 - 11:50)
Materials
workshops-2023/WME_5.pdf
Marc Vanden Bossche, Zoya Popović
National Instruments, University of Colorado Boulder
Location
146B
Abstract

The system performance of wireless transmitters depends heavily on the behavior of RF power amplifiers (PA). To satisfy the increasing demand for higher data rates, modern communications standards adopt ever higher modulation orders at increasing modulation bandwidths. Additionally, radar systems are facing increasingly more complex signals while dual functionality remains a desired goal for future systems. As a result, PA designers are faced with the intractable goal of providing PAs with simultaneously high linearity and power at higher carrier frequencies with wide instantaneous bandwidths in a world where power conservation is often a primary objective. Traditional PA design starts typically from (pulsed) continuous waveform (CW) measurements combined with load-pull. Design techniques, like the Cripps method, come to the rescue of the designer to reduce the amount of characterization. Usually, the PA is characterized under the desired modulation conditions only after the design and fabrication, often with degraded performance from the predictions. This requires then one or more expensive redesigns. With the increased demand for active phased arrays, this problem is only magnified as amplifiers interact with each other through the antenna coupling, which affects both efficiency and linearity. This workshop showcases the state-of-the-art of practical design methodologies that anticipate the use of the amplifiers under realistic wideband modulation conditions. The goal of these methodologies is to reduce the number of fabrication iterations by characterizing the transistor and designing the PA in a realistic operating environment at an early stage of the design process.

Technical Papers
Abstract
WMH-1: Characterization and Design of High-Power GaN-on-SiC Devices Through the Utilization of Application-Oriented Signals and a Comprehensive Segmented Modeling Approach
Basim Noori, Jeremy Fisher, John Wood, Zulhazmi Mokhti
Basim Noori, Wolfspeed
Wolfspeed, Wolfspeed, Wolfspeed, Macom
(08:00 - 11:50)
Materials
workshops-2023/WMH_1.pdf
Abstract
WMH-2: State-of-the-Art Design Techniques for Efficient and Linear RF and Microwave Power Amplifiers
Tommaso Cappello
Tommaso Cappello, Villanova Univ.
Villanova Univ.
(08:00 - 11:50)
Materials
workshops-2023/WMH_2.pdf
Abstract
WMH-3: Design of Wide-Band, Supply Modulated Power Amplifiers Following Linearity Constraints
Gregor Lasser, Christian Fager
Gregor Lasser, Chalmers Univ. of Technology
Chalmers Univ. of Technology, Chalmers Univ. of Technology
(08:00 - 11:50)
Materials
workshops-2023/WMH_3.pdf
Abstract
WMH-4: Modulated Signal Testing Challenges in Industry
David Sardin
David Sardin, Qorvo
Qorvo
(08:00 - 11:50)
Materials
workshops-2023/WMH_4.pdf
Abstract
WMH-5: Transistor and Power Amplifier Characterization to Maximize Simultaneous Linearity, Efficiency, and Power
Reyes Lucero
Reyes Lucero, University of Colorado Boulder
University of Colorado Boulder
(08:00 - 11:50)
Materials
workshops-2023/WMH_5.pdf
Abstract
WMH-6: Matching in Power Amplifiers and its Effect on Amplification of Large IBW Signals
Roberto Quaglia
Roberto Quaglia, Cardiff University
Cardiff University
(08:00 - 11:50)
Atom Watanabe, Mehmet Kaynak
IBM T.J. Watson Research Center, Texas Instruments
Location
146C
Abstract

In this workshop, we will deeply explore high-frequency technologies, emphasizing the synergy between chipletization, heterogeneous integration, and advanced interconnect solutions for mm-wave and sub-THz applications. We will explore the need for innovative approaches to heterogeneous integration (HI), which involves integrating multiple dies and chiplets (eg CMOS, InP, and SiGe BiCMOS chips) on advanced packaging, to push the boundaries of high-frequency systems into new territories. The workshop will include insightful presentations from both academia and industry, highlighting the latest trends and future technologies in chipletization, HI, and advanced packaging. These talks will merge theoretical research with practical applications, offering a comprehensive view of the field’s progression. Additionally, we will discuss the necessity for cutting-edge interconnects and transitions, essential for ultra-broadband, low-loss signal transmission in the high-frequency domains. Through discussions and case studies, we will show how these technologies are crucial for the practical realization of chiplet and HI-based mm-wave and THz systems.

Technical Papers
Abstract
WMJ-1: The Future of Heterogeneous Integration for mm-Wave Systems — Challenges and Opportunities
Madhavan Swaminathan
Madhavan Swaminathan, Penn State University
Penn State University
(08:00 - 11:50)
Materials
workshops-2023/WMJ_1.pdf
Abstract
WMJ-2: A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
Alberto Valdes-Garcia
Alberto Valdes-Garcia, IBM T.J. Watson Research Center
IBM T.J. Watson Research Center
(08:00 - 11:50)
Materials
workshops-2023/WMJ_2.pdf
Abstract
WMJ-3: Advanced Packaging Solutions for mm-Wave Applications
Tanja Braun
Tanja Braun, Fraunhofer IZM
Fraunhofer IZM
(08:00 - 11:50)
Materials
workshops-2023/WMJ_3.pdf
Abstract
WMJ-4: mm-Wave Antenna on Package Challenges: Manufacturing, Cost and Performance
Mohammad Vatankhah
Mohammad Vatankhah, Texas Instruments
Texas Instruments
(08:00 - 11:50)
Materials
workshops-2023/WMJ_4.pdf
Ulf Gustavsson, Christian Fager
Ericsson, Chalmers Univ. of Technology
Location
149AB
Abstract

Large-scale distributed or cell-free MIMO is the next step of the wireless evolution beyond 5G and massive MIMO. The main idea is to utilize a very large number of distributed, low-cost and low-power access points to form a network where the service is user-centric rather than divided into cells as done in conventional wireless networks. With the access points and antenna elements spread out spatially, the network can provide a more ubiquitous service in terms of coverage and throughput, but several challenges come along compared to conventional co-located MIMO. As coherent operation is needed to manage interference, aspects such as front/back-haul and RF synchronization requires novel schemes that scales well with distributed antenna systems. Keeping the access points simple and cost effective also implies challenges on RF front-end design and signal processing algorithms commonly used in co-located antenna arrays. In this workshop, we present some of the recent advances in research on RF and microwave technology aimed to address the challenges of a truly distributed and cell-free network.

Technical Papers
Abstract
WMN-1: Breaking Out of the Cell with a Massively Distributed Network
Ulf Gustavsson
Ulf Gustavsson, Ericsson
Ericsson
(08:00 - 11:50)
Abstract
WMN-2: Investigation of Beyond-5G/6G Wireless Communication Systems Using All-Digital Radio-Over-Fiber Testbeds
Christian Fager
Christian Fager, Chalmers Univ. of Technology
Chalmers Univ. of Technology
(08:00 - 11:50)
Abstract
WMN-3: Advanced IF-over-Fiber FrontHaul for Distributed MIMO in 6G Networks
Simon Rommel, Bruno Cimoli, Metodi Belchovski, Idelfonso Tafur Monroy
Simon Rommel, Technische Universiteit Eindhoven
Technische Universiteit Eindhoven, Technische Universiteit Eindhoven, Technische Universiteit Eindhoven, Technische Universiteit Eindhoven
(08:00 - 11:50)
Abstract
WMN-4: Distributed Coordination of Microwave Wireless Systems at the Wavelength Level
Jeffrey A. Nanzer
Jeffrey A. Nanzer, Michigan State Univ.
Michigan State Univ.
(08:00 - 11:50)
Abstract
WMN-5: Open Multi-Diversity R&D Facility for Distributed Wireless Systems
Gilles Callebaut, Liesbet Van der Perre
Gilles Callebaut, KU Leuven
KU Leuven, KU Leuven
(08:00 - 11:50)

-

Jordi Verdú, Christopher Nordquist
Univ. Autònoma de Barcelona, Sandia National Laboratories
Location
144AB
Abstract

The complexity of the requirements in advanced 5G and forthcoming scenarios has a direct impact on the design of acoustic wave filters. Latest developments have pushed acoustic technology to an unprecedented situation mostly due to the developments in advanced functional materials; however, this entails at the same time, new challenges in relation to design and synthesis methodologies, electrical characterization and non-linear behavior and modeling. New scenarios open at the same time an opportunity window where new applications can be faced using acoustic wave technologies due to the outstanding performance and reduced size compared with conventional electromagnetic solutions. The workshop is divided in three differentiated blocks. The first block is focused on design and synthesis methodologies. The objective is to show how the amazing properties of new functional materials may help to overcome existing limitations, mainly related to the achievable bandwidth of the filter. In the second block, the focus is put on modeling and linear/non-linear characterization. New functional materials may require new modes of operation of AW resonators, and higher power handling, which may contribute to a higher non-linear behavior. All this phenomenological behavior can be used for the development of more precise linear and non-linear models. The third block is focused on new modes of operation and AW resonator configurations taking advantage of new material properties such as heterostructures, new doped materials, or other configurations as the periodically polarized piezoelectric P3F. The final block is focused on transversal markets to explore new opportunities where acoustic wave technologies may have a key role in future scenarios (UWB, Sensors, and/or other applications). With the objective of giving the widest view on the topic, the half of the presentations are given by international recognized research groups in academia, while the other half are given by the major global industrial players.

Technical Papers
Abstract
WMA-1: Surface Acoustic Wave (SAW) Filters on Piezo-On-Insulator (POI) Substrates: Effective Figures of Merit and Design Considerations
Sylvain Ballandras
Sylvain Ballandras, Soitec
Soitec
(08:00 - 17:20)
Materials
workshops-2023/WMA_1.pdf
Abstract
WMA-2: Preferable Configurations for SAW-Like Devices Using LN/LT Thin Plate
Ken-ya Hashimoto
Ken-ya Hashimoto, UESTC
UESTC
(08:00 - 17:20)
Materials
workshops-2023/WMA_2.pdf
Abstract
WMA-3: Thin-Film Piezoelectric Resonators and Filters at mm-Wave
Ruochen Lu
Ruochen Lu, Univ. of Texas at Austin
Univ. of Texas at Austin
(08:00 - 17:20)
Materials
workshops-2023/WMA_3.pdf
Abstract
WMA-4: Ferroelectric Material Structures for High Frequency Resonators
Roy H. Olsson
Roy H. Olsson, Univ. of Pennsylvania
Univ. of Pennsylvania
(08:00 - 17:20)
Materials
workshops-2023/WMA_4.pdf
Abstract
WMA-5: Novel Integration Approaches for UHF-Acoustofluidics Biosensing and Manipulation
Cristiano Palego
Cristiano Palego, Bangor Univ.
Bangor Univ.
(08:00 - 17:20)
Materials
workshops-2023/WMA_5.pdf
Abstract
WMA-6: CMOS-Based Fluorite Ferroelectrics: Enabling Microwave Acoustic Resonators for On-Chip Frequency Control
Roozbeh Tabrizian
Roozbeh Tabrizian, Univ. of Florida
Univ. of Florida
(08:00 - 17:20)
Abstract
WMA-7: Strategic Materials for MEMS Functionality in Standard ICs
Dana Weinstein
Dana Weinstein, Purdue Univ.
Purdue Univ.
(08:00 - 17:20)
Abstract
WMA-8: A Manufacturable AlScN Periodically Polarized Piezoelectric Film Bulk Acoustic Wave Resonator (AlScN P3F BAW) Technology
Rama Vetury, Kamran Cheema
Rama Vetury, Akoustis Technologies
Akoustis Technologies, Akoustis Technologies
(08:00 - 17:20)
Charles Baylis, Andrew Clegg
Baylor Univ., Google
Location
144C
Abstract

This workshop will discuss radio spectrum usage from the view of a microwave practitioner. The basics of wireless spectrum allocation and regulation will be discussed. Presentations will describe the spectrum needs and challenges for defense and the commercial wireless industry, as well as how the test and measurement industry will be challenged. Core microwave technology innovations enabling future innovative spectrum usage will be discussed, including mm-wave devices and reconfigurable circuitry. Finally, a discussion of workforce development for spectrum science and engineering will conclude the presentations. The workshop will include an opening discussion and audience poll for topics of interest, as well as a closing panel session with the speakers for additional participant interaction.

Technical Papers
Abstract
WMC-1: Opening Discussion: Challenges in Wireless Spectrum Use
(08:00 - 17:20)
Materials
workshops-2023/WMC_1.pdf
Abstract
WMC-2: Introduction to the Electromagnetic Spectrum
Andrew Clegg
Andrew Clegg, Google
Google
(08:00 - 17:20)
Materials
workshops-2023/WMC_2.pdf
Abstract
WMC-3: Spectrum Regulation: As Real as Maxwell’s Equations
Ira Keltz
Ira Keltz, FCC
FCC
(08:00 - 17:20)
Materials
workshops-2023/WMC_3.pdf
Abstract
WMC-4: Current Spectrum Sharing Deployments and Plans
Monisha Ghosh
Monisha Ghosh, Univ. of Notre Dame
Univ. of Notre Dame
(08:00 - 17:20)
Materials
workshops-2023/WMC_4.pdf
Abstract
WMC-5: Commercial Wireless Challenges for Microwave Designers
Tom Willis
Tom Willis, AT&T Labs
AT&T Labs
(08:00 - 17:20)
Materials
workshops-2023/WMC_5.pdf
Abstract
WMC-6: Spectrum Needs and Challenges for Defense
Kelly Sherbondy
Kelly Sherbondy, Army Research Laboratory
Army Research Laboratory
(08:00 - 17:20)
Materials
workshops-2023/WMC_6.pdf
Abstract
WMC-7: mm-Wave Devices to Expand Spectrum Usage
Robert M. Weikle
Robert M. Weikle, Univ. of Virginia
Univ. of Virginia
(08:00 - 17:20)
Materials
workshops-2023/WMC_7.pdf
Abstract
WMC-8: Reconfigurable Circuitry for Adaptive Microwave Spectrum Sharing Systems
Charles Baylis
Charles Baylis, Baylor Univ.
Baylor Univ.
(08:00 - 17:20)
Materials
workshops-2023/WMC_8.pdf
Abstract
WMC-9: The Use of Artificial-Intelligence in Radio Spectrum
Robert J. Marks
Robert J. Marks, Baylor Univ.
Baylor Univ.
(08:00 - 17:20)
Materials
workshops-2023/WMC_9.pdf
Abstract
WMC-10: Test and Measurement in the Changing Spectral Environment
Nizar Messaoudi
Nizar Messaoudi, Keysight Technologies
Keysight Technologies
(08:00 - 17:20)
Abstract
WMC-11: Workforce Development in the Changing Spectral Environment
Rashaunda Henderson
Rashaunda Henderson, Univ. of Texas at Dallas
Univ. of Texas at Dallas
(08:00 - 17:20)
Abstract
WMC-12: Closing Panel: Answering Today’s Challenges and Addressing Future Considerations
(08:00 - 17:20)
Nicholas Miller, Jerome Cheron
Michigan State Univ., NIST
Location
146A
Abstract

Microelectronics operating in the mm-wave frequency regime have gained considerable attention for numerous applications including beyond-5G communications, satellite communications, and G-band radar for humidity and cloud remote sensing. A central component in the mm-wave integrated circuit development is precise on-wafer characterization of the next-generation transistors for device characterization and model extraction/validation. On-wafer measurements at mm-wave frequencies pose considerable challenges, and these difficulties are compounded when large-signal measurements are required for device optimization and modeling. This workshop incorporates a diverse set of speakers from around the world who are international experts in the field of on-wafer mm-wave calibration and small- and large-signal measurements. The morning session of this workshop will provide a deep background on the need for, challenges of, and calibration requirements for on-wafer mm-wave large-signal measurements. Our afternoon session will present world-class research from both academia and industry on on-wafer load-pull measurements at mm-wave frequencies. This proposed workshop will enable an inclusive, international audience and will welcome open discussions on the technical aspects of the presentations.

Technical Papers
Abstract
WMF-1: Implementation Challenges and Opportunities in Beyond-5G and 6G Communication
Ricardo Figueiredo
Ricardo Figueiredo, Universidade de Aveiro
Universidade de Aveiro
(08:00 - 17:20)
Materials
workshops-2023/WMF_1.pdf
Abstract
WMF-2: Analog IC Design Centering and Modeling Challenges at mm-Waves: a III-V Perspective with a Peak at RF CMOS
Andrea Arias-Purdue
Andrea Arias-Purdue, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara
(08:00 - 17:20)
Materials
workshops-2023/WMF_2.pdf
Abstract
WMF-3: mTRL Standards and Calibration for Accurate mm-Wave Transistor Characterization
Jerome Cheron
Jerome Cheron, NIST
NIST
(08:00 - 17:20)
Materials
workshops-2023/WMF_3.pdf
Abstract
WMF-4: Requirements for, and Challenges of, On-Wafer mm-Wave Load-Pull: A Perspective
Nicholas Miller
Nicholas Miller, Michigan State Univ.
Michigan State Univ.
(08:00 - 17:20)
Materials
workshops-2023/WMF_4.pdf
Abstract
WMF-5: Device Fixtures, Calibration Approaches and Test Benches for Large Signal DUT Model Validation at Sub-THz
Marco Spirito
Marco Spirito, Technische Universiteit Delft
Technische Universiteit Delft
(08:00 - 17:20)
Materials
workshops-2023/WMF_5.pdf
Abstract
WMF-6: State-of-the-Art Solutions for mm-Wave Load-Pull
Osman Ceylan
Osman Ceylan, Maury Microwave Corp.
Maury Microwave Corp.
(08:00 - 17:20)
Abstract
WMF-7: Vector Receiver Load-Pull for mm-Wave: a Practical Comparison of Measurement Techniques
Bryan Hosein
Bryan Hosein, Focus Microwaves
Focus Microwaves
(08:00 - 17:20)
Abstract
WMF-8: Load-Pull Characterization at G-band: an Insight on BiCMOS 55nm Technology
Nicolas Defrance
Nicolas Defrance, IEMN (UMR 8520)
IEMN (UMR 8520)
(08:00 - 17:20)
Diego Masotti, Simon Hemour
Univ. of Bologna, IMS (UMR 5218)
Location
204ABC
Abstract

Ultra-low-power devices which are pervasive in the IoT world depend on energy autonomy to perform seamlessly their sensing and communication tasks. The wireless provision of power is an appropriate solution for IoT sensors, as demonstrated by the talks of this workshop, given by experts from both academia and industry from all continents. The workshop focuses on different areas, such as the miniaturization of the IoT node, the exploitation of additive manufacturing for eco-friendly solutions, the need for circuital/electromagnetic strategies for accurate low-power transceiver design, system-on-chip solutions with machine-learning assisted sensing capabilities. Moreover, both near- and far-field applications (up to mm-Wave) are considered with special emphasis on complex electromagnetic environments, from the viewpoint of the receiver (rectenna) and the transmitter (energy source), with recent solutions of both single or multiple rectenna combinations and advanced transmitting stations. This workshop is part of the initiative “Future Directions Days on WPT” sponsored by the MTT-S Technical Committee-25 (Wireless Power Transfer and Energy Conversion Committee).

Technical Papers
Abstract
WMK-1: Compact Wireless Power Solutions for IoT Nodes on Rotating Platforms
Valentina Palazzi
Valentina Palazzi, Università di Perugia
Università di Perugia
(08:00 - 17:20)
Materials
workshops-2023/WMK_1.pdf
Abstract
WMK-2: Flexible and Additive Electronics Enabling Sustainable MHz–mm-Wave Wireless Power
Mahmoud Wagih
Mahmoud Wagih, Univ. of Glasgow
Univ. of Glasgow
(08:00 - 17:20)
Materials
workshops-2023/WMK_2.pdf
Abstract
WMK-3: Low-Cost Deployable Scalable RF Energy Harvesting Arrays
Zoya Popović
Zoya Popović, University of Colorado Boulder
University of Colorado Boulder
(08:00 - 17:20)
Materials
workshops-2023/WMK_3.pdf
Abstract
WMK-4: Ultra-Low-Power Batteryless System-on-Chip Solutions for Next-Generation Bioelectronics and IoT
Hamed Rahmani
Hamed Rahmani, New York Univ.
New York Univ.
(08:00 - 17:20)
Materials
workshops-2023/WMK_4.pdf
Abstract
WMK-5: Wireless Power Transmission Powering Miniaturized Low-Power IoT Devices
Michele Magno
Michele Magno, ETH Zürich
ETH Zürich
(08:00 - 17:20)
Materials
workshops-2023/WMK_5.pdf
Abstract
WMK-6: Near-Field Wireless Power Transfer Using Free-Running and Injection-Locked Oscillators
Almudena Suárez Rodriguez
Almudena Suárez Rodriguez, Universidad de Cantabria
Universidad de Cantabria
(08:00 - 17:20)
Materials
workshops-2023/WMK_6.pdf
Abstract
WMK-7: Radiative WPT in a Complex Environment and mm-Wave WPT
Sun K. Hong
Sun K. Hong, Soongsil Univ.
Soongsil Univ.
(08:00 - 17:20)
Materials
workshops-2023/WMK_7.pdf
Abstract
WMK-8: Energy-Efficient Predictive Maintenance in Electromagnetically Harsh Environments
Diego Masotti, Alessandra Costanzo
Diego Masotti, Univ. of Bologna
Univ. of Bologna, Univ. of Bologna
(08:00 - 17:20)
Materials
workshops-2023/WMK_8.pdf
Abstract
WMK-9: Ultra-Low-Power Non-Linear Strategies for Next Generation, Wide Area Coverage IoT
Simon Hemour
Simon Hemour, IMS (UMR 5218)
IMS (UMR 5218)
(08:00 - 17:20)
Michael Haider, Thomas E. Roth, Zhen Peng, Vladimir Okhmatovski
Technische Univ. München, Purdue Univ., Univ. of Illinois at Urbana-Champaign, Univ. of Manitoba
Location
147AB
Abstract

The recent demonstration of quantum supremacy with superconducting quantum computers has triggered researchers all over the world to work towards improved superconducting microwave devices, as well as novel quantum methods and algorithms. For low temperatures and weak microwave signals, as is the case in the readout of superconducting qubits, the quantum nature of the electromagnetic field becomes apparent. Hence, the design, optimization, and scaling of superconducting microwave components need to be performed on a completely new theoretical basis, given by the framework of circuit quantum electrodynamics. For microwave engineers, this signifies a transfer of knowledge from classical electromagnetics to the quantum realm. More or less common microwave components such as mixers, isolators, parametric amplifiers, and circulators are key for the realization of superconducting quantum computers. They can be modeled using quantum theory or hybrid semi-classical quantum approaches, which is particularly important if quantum effects are fundamental to the device’s operation. To exploit the full potential of general-purpose quantum computers based on superconducting qubits, which will enable breakthrough applications in the mid and long-term. Further technological advances in quantum error correction and qubit readout are necessary. Fueled by the remarkable progress in quantum hardware, which has defined a new noisy intermediate-scale quantum computing era, innovative quantum-based algorithms have been proposed. Particularly in electromagnetics, specialized quantum algorithms have the potential of significant speedups against classical computing strategies, especially when it comes to NP-hard optimization problems. Quantum algorithms also show great potential for the solution of integral equations, inverse scattering problems, and the prediction of radiation patterns. However, at the current stage, inevitable noise and limited qubit coherence times are prohibitive for most methods to show a real quantum advantage yet. Current topics in the modeling of RF microwave quantum devices based on circuit quantum electrodynamics will be addressed, which will be connected to the design and implementation of advanced quantum algorithms for general-purpose quantum computers and quantum annealers. One goal of this workshop is to bring together specialists in the modeling, design, and experimental realization of quantum hardware and experts in quantum algorithms with a focus on computational electromagnetics to discuss their individual ideas and perspectives on quantum computing. Another important aspect of this workshop is to introduce microwave engineers step-by-step to the strange new world of quantum theory by means of a comprehensive tutorial in the beginning, bridging the language barrier between quantum physics and RF microwave engineering.

Technical Papers
Abstract
WML-1: Introduction to Quantum Circuits and Electromagnetics
Thomas E. Roth
Thomas E. Roth, Purdue Univ.
Purdue Univ.
(08:00 - 17:20)
Abstract
WML-2: Error Analysis of HHL-Based Quantum Matrix Solver with Improved Quantum Phase Estimation
Xinbo Li, Christopher Phillips, Ian Jeffrey, Vladimir Okhmatovski
Vladimir Okhmatovski, Univ. of Manitoba
Univ. of Manitoba, Univ. of Waterloo, Univ. of Manitoba, Univ. of Manitoba
(08:00 - 17:20)
Materials
workshops-2023/WML_2.pdf
Abstract
WML-3: Transient Quantum Transport Simulation of Nanoscale Devices in the THz Regime
Dan Jiao, Tillmann Kubis
Dan Jiao, Purdue Univ.
Purdue Univ., Purdue Univ.
(08:00 - 17:20)
Materials
workshops-2023/WML_3.pdf
Abstract
WML-4: Quantum-Empowered Combinatorial Optimization Algorithms for Electromagnetics and Microwave Applications
Zhen Peng
Zhen Peng, Univ. of Illinois at Urbana-Champaign
Univ. of Illinois at Urbana-Champaign
(08:00 - 17:20)
Materials
workshops-2023/WML_4.pdf
Abstract
WML-5: Rydberg Atom-Based E-Field Sensors and Receivers
Christopher L. Holloway
Christopher L. Holloway, NIST
NIST
(08:00 - 17:20)
Materials
workshops-2023/WML_5.pdf
Abstract
WML-6: Quantum Models for the Optimization of Superconducting Traveling Wave Parametric Amplifiers
Michael Haider
Michael Haider, Technische Univ. München
Technische Univ. München
(08:00 - 17:20)
Materials
workshops-2023/WML_6.pdf
Abstract
WML-7: Low-Energy Field Generation by “Bremsstrahlung” and Cherenkov Effects in Graphene Nanoribbons
Luca Pierantoni, Gian Marco Zampa, Davide Mencarelli
Luca Pierantoni, Università Politecnica delle Marche, Davide Mencarelli, Università Politecnica delle Marche
Università Politecnica delle Marche, Università Politecnica delle Marche, Università Politecnica delle Marche
(08:00 - 17:20)
Materials
workshops-2023/WML_7.pdf

-

Abhishek Agrawal
Intel Corp.
Andrea Bevilacqua
Univ. of Padova
Location
150AB
Abstract

This session presents a variety of techniques for mm-Wave and RF circuits. The papers report bi-directional front-ends and integrated TRSW-LNA-PA for 5G and satcom communications, along with a J-band TX/RX chipset and a variable attenuator for power detection applications.

Technical Papers
Abstract
RMo2A-1: A Compact Ka-Band Bi-Directional PA-LNA with 17.4-dBm Psat Using Three-Stack Power Amplifier in 28-nm CMOS
Jun Hwang, Byung-Wook Min
Jun Hwang, Yonsei Univ.
Yonsei Univ., Yonsei Univ.
(10:10 - 10:30)
Abstract
RMo2A-2: A Reconfigurable Ultra Compact Bi-directional Amplifier with a Build-in-Self Notch Filter for K/Ka-band Satellite Communication
Jian Zhang, Ming Zhai, Wei Zhu, Dawei Wang, Xiangjie Yi, Yan Wang
Jian Zhang, Tsinghua Univ.
Tsinghua Univ., Tsinghua Univ., Beijing Institute of Technology, Tsinghua Univ., Tsinghua Univ., Tsinghua Univ.
(10:30 - 10:50)
Abstract
RMo2A-3: Fully Integrated SiGe HBT BiCMOS Transmit-Receive Front-End IC for 5G mmW Radio with A Reconfigurable Built-In Diode RF Switch
Insu Han, Hanjung Lee, Inchan Ju
Insu Han, Ajou Univ.
Ajou Univ., Ajou Univ., Ajou Univ.
(10:50 - 11:10)
Abstract
RMo2A-4: Non-Coherent TX-RX Chipsets for J-band Communication in 16-nm FinFET CMOS
Berke Gungor, Patrick Reynaert
Berke Gungor, KU Leuven
KU Leuven, KU Leuven
(11:10 - 11:30)
Abstract
RMo2A-5: A Σ∆–Modulated Linear-in-dB Attenuator for On-Chip Power Detection with 0.12 dB Resolution in RF SOI CMOS Switch Technology
Ting-Li Hsu, Valentyn Solomko, Amelie Marietta Hagelauer
Ting-Li Hsu, Tech. Univ. of Munich
Tech. Univ. of Munich, Infineon Technologies AG, Tech. Univ. of Munich
(11:30 - 11:50)
Andrea Mazzanti
Univ. of Pavia
Bichoy Bahr
Texas Instruments
Location
151AB
Abstract

This session presents advancements in VCO performance, employing multi-mode, multi-core architectures, and Impulse Sensitivity Function (ISF) shaping. The first two papers extend frequency tuning range with multi-mode architectures. The third paper reduces phase noise in a triple-push, triple-core DCO for V-band operation. The fourth paper achieves record phase noise reduction in CMOS by combining series resonance in a multi-core architecture. Finally, the last paper demonstrates improved phase noise through ISF shaping with a multi-tank topology.

Technical Papers
Abstract
RMo2B-1: An Octave Tuning Range Quad-Core VCO Using a Compact Quad-Mode Transformer-Based Inductor
Hyunjoon Kim, Sangmin Kim, Sanggeun Jeon
Hyunjoon Kim, Korea Univ.
Korea Univ., Korea Univ., Korea Univ.
(10:10 - 10:30)
Abstract
RMo2B-2: An 18.5-to-36.5 GHz 206.8 dBc/Hz FoMT Quad-Core Triple-Mode VCO with Automatic-Mode-Tracking Output Buffers
Ziyi Lin, Haikun Jia, Wei Deng, Baoyong Chi
Ziyi Lin, Tsinghua Univ.
Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ.
(10:30 - 10:50)
Abstract
RMo2B-3: A 52.3-to-67.3GHz 35.8-kHz-Resolution Triple-Push DCO Exploiting Source-Combining Technique for Third-Harmonic Enhancement Achieving 196.4dBc/Hz Peak FoMT at 10MHz Offset
Qiyao Jiang, Jun Yin, Quan Pan, Rui Martins, Pui-In Mak
Qiyao Jiang, University of Macau
University of Macau, University of Macau, Southern Univ. of Science and Technology, University of Macau, University of Macau
(10:50 - 11:10)
Abstract
RMo2B-4: An 11GHz 8-core Series Resonance CMOS VCO withScalable Ring-coupling Scheme Achieving Phase Noiseof -136.8dBc/Hz at 1 MHz Offset
Shiwei Zhang, Wei Deng, Haikun Jia, Baoyong Chi
Shiwei Zhang, Tsinghua Univ.
Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ.
(11:10 - 11:30)
Abstract
RMo2B-5: A K-Band Voltage-Controlled Oscillator with Gate-Drain Phase Shift Achieving 110 kHz 1/f3 Corner
Zhenghua Jia, Dawei Ye
Zhenghua Jia, Fudan Univ.
Fudan Univ., Huazhong University of Science and Technology
(11:30 - 11:50)
Chun-Huat Heng
National Univ. of Singapore
Justin Wu
AmLogic
Location
152AB
Abstract

This session presents novel techniques for energy efficient performance enhancements to wireless transmitters and receivers. The first paper presents an IoT transmitter employing amplitude and phase calibration to improve harmonic rejection, followed by techniques to improve receiver blocker tolerance using novel N-path mixer-first front end topologies. An energy-efficient polar receiver based on a phase tracking architecture capable of amplitude demodulation is then presented, followed by a phase noise canceling receiver.

Technical Papers
Abstract
RMo2C-1: A Sub-6GHz Wideband Transmitter with LO Harmonic Rejection RF Front-ends Using Frequency-Adaptive Calibration
Haoyu Bai, Dong Wang, Keer Gao, Jiaqi He, Jiazheng Zhou, Junhua Liu, Huailin Liao
Haoyu Bai, Peking Univ.
Peking Univ., Peking Univ., Peking Univ., Peking Univ., Peking Univ., Peking Univ., Peking Univ.
(10:10 - 10:30)
Abstract
RMo2C-2: An 11.8mW 0.4-to-2.6GHz Blocker-Tolerant Receiver with LO Duty-Cycle Compensation and High-Q Selectivity Achieving +15.4/19.2dBm OB-IIP3 at 10/80MHz Offset
Rundi Wu, Yetong Wang, Ran Hong, Kenan Xie, Keping Wang
Rundi Wu, Tianjin Univ.
Tianjin Univ., Tianjin Univ., Tianjin Univ., Tianjin Univ., Tianjin Univ.
(10:30 - 10:50)
Abstract
RMo2C-3: A 2.8-4.3 GHz Simultaneous Dual-Carrier Transformer-Coupled Passive Mixer-First Receiver Front-End Supporting Blocker Suppression
Jamie Ye, Alain Anton, Russ Huang, Sanaz Sadeghi, Alyosha Molnar
Jamie Ye, Cornell Univ.
Cornell Univ., Cornell Univ., Cornell Univ., Cornell Univ., Cornell Univ.
(10:50 - 11:10)
Abstract
RMo2C-4: A 2.3nJ/b 32-APSK Polar Phase-Tracking Receiver with Two-Point Injection Technique
Xuansheng Ji, Jiahao Zhao, Woogeun Rhee, Zhihua Wang
Xuansheng Ji, Tsinghua Univ.
Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ.
(11:10 - 11:30)
Abstract
RMo2C-5: A 0.77mW 1.84nJ/bit Phase Noise Canceling Receiver for QAM and OFDM and Cellular IoT
Trevor Odelberg, David Wentzloff
Trevor Odelberg, Univ. of Michigan
Univ. of Michigan, Univ. of Michigan
(11:30 - 11:50)

-

Alistari Duffy, Ke Wu, J.-C. Chiao
Division IV, Polytechnique Montreal, Southern Methodist Univ.
Branislav Notaros, Wen-Chung Kao, Gregory Durgin, John La Salle, Maurizio Bozzi, Vesna Sossi
IEEE Antennas and Propagation Society, IEEE Consumer Technology Society, IEEE Council on RFID, IEEE Electromagnetic Compatibility Society, IEEE Microwave Theory and Techniques Society, IEEE Nuclear and Plasma Sciences Society
Location
201
Abstract

This panel session offers a chance to engage in dialogue with the Presidents of IEEE Societies within IEEE Division IV "Electromagnetics and Radiation." Given their shared research domains, this session presents a valuable opportunity to exchange perspectives on forthcoming technological challenges and foster avenues for future inter-society collaboration.

James Buckwalter, Shahriar Shahramian
Univ. of California, Santa Barbara, Nokia-Bell Labs
Ramesh Harjani, Payam Heydari, Donald Lie, Debabani Choudhury, Osamu Kusano, Bodhisatwa Sadhu
Univ. of Minnesota, Univ. of California, Irvine, Texas Tech Univ., Intel Corp., Keysight Technologies, IBM Corp.
Location
202AB
Abstract

Rather than a traditional panel, the RF and Microwave League of Champions will be a quiz show pitting a team of academics against a team of industry veterans to answer technical riddles sourced from RF and microwave history. Each team will comprise 3 members who will answer as a team on questions about RF/microwave theory, circuits, and systems. This event will be an entertaining diversion from the typical technical panel and hopefully a great deal of fun for participants.

-

Jane Gu
Univ. of California, Davis
Gernot Hueber
United Micro Technology
Location
150AB
Abstract

In this session five papers on millimeter wave power amplifiers are presented. The session starts with a 60 GHz PA in FDSOI CMOS with 42.3% PAE. The second paper presents a three-way combining wideband PA to achieve high backoff efficiency without load modulation. The third paper demonstrates a 22-44 GHz Doherty PA with 3:1 VSWR variation tolerance. The fourth paper presents a true power detector scheme to achieve >33dB dynamic range. The last paper demonstrates a dual-mode PA to support sub-6 GHz and mm-Wave for 5G FR1 and FR2, respectively.

Technical Papers
Abstract
RMo3A-1: A Class-J/F 60 GHz Power Amplifier with 42.3% Power Added Efficiency in FDSOI CMOS
Mengqi Cui, Jens Wagner, Frank Ellinger
Mengqi Cui, Technische Univ. Dresden
Technische Univ. Dresden, Technische Universität Dresden, Technische Universität Dresden
(13:30 - 13:50)
Abstract
RMo3A-2: A 25-40 GHz Three-Way Power Amplifier with No Load ModulationAchieving Broadband Deep Power Back-Off Efficiency Enhancement
Edward Liu, Han Zhou, Christian Fager, Hua Wang
Edward Liu, ETH Zurich
ETH Zurich, Chalmers Univ. of Technology, Chalmers Univ. of Technology, ETH Zurich
(13:50 - 14:10)
Abstract
RMo3A-3: A 22-44 GHz 28nm FD-SOI CMOS 5G Doherty Power Amplifier with Wideband PAE6dBPBO Enhancement and 3:1 VSWR Resiliency
Gwennaël Diverrez, Eric Kerhervé, Magali De Matos, Andreia Cathelin
Gwennaël Diverrez, Univ. of Bordeaux
Univ. of Bordeaux, Univ. of Bordeaux, Univ. of Bordeaux, STMicroelectronics
(14:10 - 14:30)
Abstract
RMo3A-4: A 25-31GHz Compact True Power Detector with >33dB Dynamic Range in 40nm Bulk CMOS
Haoqi Qin, Junjie Gu, Hao Xu, Zhiwei Xu, Pengcheng Jia, Na Yan
Haoqi Qin, Fudan Univ.
Fudan Univ., Fudan Univ., Fudan Univ., Zhejiang Univ., Starway Communication Inc., Guangdong Province, China, Fudan Univ.
(14:30 - 14:50)
Abstract
RMo3A-5: A Compact Dual-mode CMOS Power Amplifier Covering both Sub-6GHz and mm-Wave Bands for 5G NR
Jingye Zhang, Jiawen Chen, Taotao Xu, Pei Qin, Xiang Yi, Liang Wu, Haoshen Zhu, Wenquan Che, Quan Xue
Jingye Zhang, South China Univ. of Technology
South China Univ. of Technology, Univ. College Dublin, South China Univ. of Technology, South China Univ. of Technology, South China Univ. of Technology, Chinese Univ. of Hong Kong, South China Univ. of Technology, South China Univ. of Technology, South China Univ. of Technology
(14:50 - 15:10)
Fa Foster Dai
Auburn Univ.
Salvatore Finocchiaro
QORVO, Inc.
Location
151AB
Abstract

This session presents recent advancements in RF and MM-wave frequency multiplication techniques. The session starts with two papers on inductor-less wideband frequency doubler and multiplier designs, followed by two injection-locking frequency tripler and multiplier designs. Lastly, we present an mm-wave frequency tripler with power combining and harmonic shaping techniques.

Technical Papers
Abstract
RMo3B-1: A 0.2–25GHz Inductorless Complementary Pseudo-Push-Push Frequency Doubler
Changwenquan Song, Chen Yu, Liang Wu
Changwenquan Song, Chinese University of Hong Kong - Shenzhen
Chinese University of Hong Kong - Shenzhen, Chinese University of Hong Kong - Shenzhen, Chinese University of Hong Kong - Shenzhen
(13:30 - 13:50)
Abstract
RMo3B-2: A Compact D-Band Multiply-by-9 Frequency Multiplier with Inductor-Less Active Balun in 16nm p-FinFET Technology
Runzhou Chen, Hao-Yu Chien, Mau-Chung Frank Chang
Runzhou Chen, Univ. of California, Los Angeles
Univ. of California, Los Angeles, Univ. of California, Los Angeles, Univ. of California, Los Angeles
(13:50 - 14:10)
Abstract
RMo3B-3: A 17.4-26.4-GHz Dual-Injection Injection-Locked Frequency Tripler Featuring Low Power Consumption and High Harmonic Rejection
Qingfan Zeng, Jingzhi Zhang, Yiming Yu, Huihua Liu, Yunqiu Wu, Chenxi Zhao, Kai Kang
Qingfan Zeng, University of Electronic Science and Technology of
University of Electronic Science and Technology of, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China
(14:10 - 14:30)
Abstract
RMo3B-4: A 278-348 GHz 6th Harmonic Injection Locking Frequency Multiplierbased on 3rd Harmonic Injection Locking Oscillator in 130 nm SiGeProcess
Zheng Yan, Jixin Chen, Zhe Chen, Zekun Li, Rui Zhang, Rui Zhou, Peigen Zhou, Wei Hong
Zheng Yan, Southeast Univ.
Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ.
(14:30 - 14:50)
Abstract
RMo3B-5: A 192–229 GHz Frequency Tripler with 4.4 dBm Output Power Using Slotline-Based Drain Harmonic Shaping Technique in 40nm CMOS
Yifan Ding, Yizhu Shen, Zhen Lin, Zhenghuan Wei, Yun Qian, Sanming Hu
Yifan Ding, Southeast Univ.
Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ.
(14:50 - 15:10)
Emanuel Cohen
Technion - Israel Institute of Technology
Hao Gao
Eindhoven Univ. of Technology
Location
152AB
Abstract

This session covers several innovations in the design of components for phase arrays. The first three papers present phase-array receivers achieving high resolution and demonstrating accurate phase-shifter and multibeam capabilities up to the W-band. The last two papers showcase additional crucial components by presenting a high-linearity VGA and a reconfigurable front-end for 5G.

Technical Papers
Abstract
RMo3C-1: A 16-Channel W-band Phased-Array Receiver with a 8-Bit Octant Selector and Reflection-Type Phase Shifter of 0.23°/0.21-dB RMS Phase and Gain Error for ±30° Scanning Angle
Xianhu Luo, Yunbo Rao, Xu Cheng, Hao Yang, Renai Chen, Yang Yu, Jiangan Han, Changxuan Han, Binbin Cheng, Xianjin Deng, Hao Gao
Hao Gao, Technische Univ. Eindhoven
MTRC, China Academy of Engineering Physics,.China, University of Electronic Science and Technology of, MTRC, China Academy of Engineering Physics, China, MTRC, China Academy of Engineering Physics, China, MTRC, China Academy of Engineering Physics, China, MTRC, China Academy of Engineering Physics, China, MTRC, China Academy of Engineering Physics, China, Univ. of Electronic Science and Technology of China, MTRC, China Academy of Engineering Physics, China, MTRC, China Academy of Engineering Physics, China, Technische Univ. Eindhoven
(13:30 - 13:50)
Abstract
RMo3C-2: A K-Band 4-Element 8-Beam Phased-Array Receiver with Hybrid Vector Interpolation and Impedance-Adapted Multibeam Combining Techniques for Satellite Communications
Hang Lu, Nayu Li, Huiyan Gao, Botao Yang, Xuanyu He, Shaogang Wang, Yiwei Liu, Gaopeng Chen, Yen-Cheng Kuan, Xiaokang Qi, Chunyi Song, Qun Jane Gu, Zhiwei Xu
Hang Lu, Zhejiang Univ.
Zhejiang Univ., Donghai Laboratory, Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., National Yang Ming Chiao Tung Univ., Zhejiang Univ., Zhejiang Univ., Univ. of California, Davis, Zhejiang Univ.
(13:50 - 14:10)
Abstract
RMo3C-3: A Frequency Reconfigurable Phased-Array Front-End with Enhanced Image-Rejection and High-Resolution LO Phase Shifter for 5G FR2 n258/n260/n261 Bands
Qin Chen, Jun Lu, Xuhao Jiang, Xuanxuan Yang, Yuchen Liang, Yifei Hu, Yao Wang, Junbo Liu, Lin Lu, Depeng Cheng, Jing Feng, Lei Luo, Long He, Xu Wu, Lianming Li
Qin Chen, Southeast Univ.
Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Purple Mountain Laboratories, Southeast Univ., Purple Mountain Laboratories, Nanjing, Purple Mountain Laboratories, Nanjing, Southeast Univ., Southeast Univ.
(14:10 - 14:30)
Abstract
RMo3C-4: A 10:1 Bandwidth 2.5-25 GHz Multi-Standard High-Linearity 6-bit Phased-Array Receiver Front-End with Quad-Pole I/Q Network and 2.7° RMS Phase Error
Tian Liang, Zhaoxin Hu, Omar Hassan, Gabriel Rebeiz
Tian Liang, Univ. of California, San Diego
Univ. of California, San Diego, Univ. of California, San Diego, Univ. of California, San Diego, Univ. of California, San Diego
(14:30 - 14:50)
Abstract
RMo3C-5: A 26.5-35 GHz High Linearity VGA with an RMS Phase Error of 0.9o-2.8o Utilizing a Novel Hybrid Coupling Technique in 45RFSOI
Ahmed Afifi, Gabriel Rebeiz
Ahmed Afifi, Univ. of California, San Diego
Univ. of California, San Diego, Univ. of California, San Diego
(14:50 - 15:10)

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Kamal K. Samanta, Bumman Kim
AMWT, POSTECH
Location
145AB
Abstract

The rising demand for high data traffic, speed, and resolution requires new-generation (5G and B5G) power amplifiers (PAs) to operate at higher frequency bands, and deliver high linear power with wide bandwidth and high efficiency at high PAPR, and these PAs are among the most critical components for the next-generation mobile and backhaul systems. Load-modulated Doherty power amplifiers (DPAs) are highly regarded as suitable candidates, providing high efficiency and supporting higher-order modulation. However, conventional DPA suffers from restricted bandwidth, maintaining efficiency with BW, and increased sensitivity to load mismatch. This timely workshop will feature a wide range of presentations highlighting the recent advances and state-of-the-art developments in Doherty-based PA circuit design theory, methodology, and practical circuit and system implementation techniques for overcoming the above constraints. This will cover analog and hybrid beamforming and massive MIMO applications for sub-6GHz 5G to mm-wave and 6G applications, including those for handsets and infrastructures. This workshop will showcase advanced topologies, including a novel active load-modulated PA architecture called the circulator load-modulated amplifier; advanced sequential version and the voltage-combining approach; and novel analog/digital co-design, reducing undesirable memory effects and extending bandwidths with high efficiency. Further, the latest load-insensitive load-modulation PAs including quasi-balanced Doherty PA and load-modulated balanced and double balanced amplifiers, which provide inherent isolation from the antenna, will be presented. Finally, the workshop will conclude with the latest important trends, possible future directions, and experimental results based on monolithic and hybrid implementation and will compare the performance of novel DPAs with circuit/device technologies in terms of BW, ACLR/linearity, and efficiency at different backoffs (6 to 12dB) for fulfilling the challenging high-performance and low-cost requirements of next-generation wireless communications.

Technical Papers
Abstract
WMD-1: Recent Developments in Active Load Modulation Architectures
Christian Fager, Han Zhou
Christian Fager, Chalmers Univ. of Technology
Chalmers Univ. of Technology, Chalmers Univ. of Technology
(13:30 - 17:20)
Materials
workshops-2023/WMD_1.pdf
Abstract
WMD-2: Design of MMIC Doherty Power Amplifiers for 5G Applications
Paolo Colantonio, Rocco Giofrè, Anna Piacibello, Vittorio Camarchia
Paolo Colantonio, Università di Roma “Tor Vergata”
Università di Roma “Tor Vergata”, Università di Roma “Tor Vergata”, Politecnico di Torino, Politecnico di Torino
(13:30 - 17:20)
Materials
workshops-2023/WMD_2.pdf
Abstract
WMD-3: Advanced Doherty PA, Backoff Range and Bandwidth Extension Concepts
Renato Negra
Renato Negra, RWTH Aachen Univ.
RWTH Aachen Univ.
(13:30 - 17:20)
Materials
workshops-2023/WMD_3.pdf
Abstract
WMD-4: Antenna-VSWR-Resilient Load-Modulation Power Amplifiers for 5G-and-Beyond Communications
Kenle Chen
Kenle Chen, Univ. of Central Florida
Univ. of Central Florida
(13:30 - 17:20)
Materials
workshops-2023/WMD_4.pdf
Abstract
WMD-5: Analog/Digital Co-Design Techniques for Broadband Load-Modulated Power Amplifiers
Mohamed Helaoui, Fadhel M. Ghannouchi
Mohamed Helaoui, Univ. of Calgary
Univ. of Calgary, Univ. of Calgary
(13:30 - 17:20)
Materials
workshops-2023/WMD_5.pdf
Sidina Wane, Mo Shakouri, Oren Eliezer
eV-Technologies, Microsanj, Samsung
Location
146B
Abstract

This interactive half-day workshop of 4 tutorials includes 5 speakers from both industry and academia, who have been involved in the development of new approaches for the design and testing of power amplifiers, phased arrays and antenna-in-package modules. The tutorials present techniques for evaluating and optimizing efficiency and heat dissipation in RF devices and front-ends, and are a combination of recent research, as well as field-proven methods that are already available in the industry products, such as thermoreflectance solutions and over-the-air (OTA) thermal imaging for 5G phased array front-ends incorporating ICs and antenna-in-package modules. In addition to the conventional Q&A time made available to attendees during and after each tutorial, attendees will be encouraged at the beginning of the workshop to present challenges that they are interested in addressing, so as to allow the tutorial speakers to consider these in their tutorials.

Technical Papers
Abstract
WMG-1: A Holistic Near-Field Over-the-Air Approach for the Design, Testing, and Evaluation of Chip-Package-PCB-AiP Modules
Mo Shakouri, Sidina Wane
Mo Shakouri, Microsanj
Microsanj, eV-Technologies
(13:30 - 17:20)
Materials
workshops-2023/WMG_1.pdf
Abstract
WMG-2: Overview of Thermal Characterization Techniques for Front-End Modules
Ali Shakouri
Ali Shakouri, Purdue Univ.
Purdue Univ.
(13:30 - 17:20)
Materials
workshops-2023/WMG_2.pdf
Abstract
WMG-3: Advances in Efficient mm-Wave Front-End and Integrated Solutions for 5G and Beyond
Eric Leclerc
Eric Leclerc, UMS
UMS
(13:30 - 17:20)
Materials
workshops-2023/WMG_3.pdf
Abstract
WMG-4: Self-Heating Characterization Techniques for Advanced RF Transistors
Jean-Pierre Raskin
Jean-Pierre Raskin, UCLouvain
UCLouvain
(13:30 - 17:20)
Materials
workshops-2023/WMG_4.pdf
Mehmet Ogut, Shirin Montazeri
JPL, Google
Location
146C
Abstract

Understanding instrument noise and building stable, ultra-low-noise receivers have critical importance achieving high-quality accurate RF receivers that are used in a very broad field including 5G systems to weather/meteorological radars/sounders to communication systems. This workshop will fill an important gap by discussing noise parameter measurement techniques at room temperature and cryogenic environments, ultra-low-noise technologies and amplifiers in InGaAs mHEMTs and GaN HEMTs, low noise amplifiers and receivers for radiometric measurements and recent advanced state-of-the-art low-noise technology and their applications.

Technical Papers
Abstract
WMI-1: Low Noise Amplifiers and Receivers for Radiometric Measurements
Pekka Kangaslahti
Pekka Kangaslahti, JPL
JPL
(13:30 - 17:20)
Materials
workshops-2023/WMI_1.pdf
Abstract
WMI-2: Low Noise Technology at Northrop Grumman
William R. Deal
William R. Deal, Northrop Grumman
Northrop Grumman
(13:30 - 17:20)
Materials
workshops-2023/WMI_2.pdf
Abstract
WMI-3: Ultra-Low-Noise Technologies and Amplifiers in InGaAs mHEMTs and GaN HEMTs at Room-Temperature and Cryogenic Operation
Fabian Thome
Fabian Thome, Fraunhofer IAF
Fraunhofer IAF
(13:30 - 17:20)
Materials
workshops-2023/WMI_3.pdf
Abstract
WMI-4: Noise-Parameter Measurements at Room and Cryogenic Temperatures
Leonid Belostotski
Leonid Belostotski, Univ. of Calgary
Univ. of Calgary
(13:30 - 17:20)
Materials
workshops-2023/WMI_4.pdf
Rainee N. Simons, Kavita Goverdhanam
NASA Glenn, U.S. Army CCDC C5ISR Center
Location
149AB
Abstract

Over six decades of exploration of our solar system by robotic spacecraft has not only been one of the greatest adventures in history but has also transformed our understanding of the universe. Every mission has enabled stunning scientific discoveries that altered our knowledge of the universe. The breadth and depth of the discoveries from these robotic missions would not have been possible without the parallel development of broad range of science instruments that operate over wide range of wavelengths across the electromagnetic spectrum. These instruments provided the data to address key science questions and test scientific hypotheses. The focus of this workshop is the development of space-borne microwave and THz instruments for exploring our Earth and the numerous objects orbiting the Sun in our solar system such as the planets and moons. At present there are significant technological needs for improving existing instruments and adapting completely new concepts. Practically all instruments can benefit from technology developments that can reduce their mass and power consumption and improve data communications capability. Additionally, increased sensitivity and measurement accuracy are desired attributes along with survivability under extreme temperature/pressure in the ionizing radiation environment of space. Furthermore, autonomy is important given the enormous planetary distances that are involved. Accordingly, the workshop includes presentations from space agencies and organizations across the globe highlighting their instrument development successes and the missions that were enabled. The workshop commences with an overview talk that presents the state of THz instrumentation development, design, and implementation challenges. The second presentation will review the current and upcoming synthetic aperture radar (SAR) missions and their advanced exploitations to deliver actionable information for society in the context of climate change and green transition. In the third presentation, exemplary space-borne instruments such as a limb sounder operating in the microwave and THz spectral range for measuring the atmospheric composition will be discussed. The fourth presentation will highlight two recent projects that utilize Artificial-Intelligence (AI) and Machine-Learning (ML) and discuss successes and challenges experienced during development and provide additional insights into future pathways for AI and ML in spaceborne microwave instruments. The fifth presentation will describe a unique high ground-resolution SAR system on a novel quasi-two-dimensional satellite dubbed as the DiskSat for very low Earth orbit missions. Lastly, a THz heterodyne spectrometer with high sensitivity and resolution and with 2U form factor as a payload on a CubeSat for detecting the presence of hydroxyl and heavy water simultaneously in the Moon’s polar and equatorial regions will be presented.

Technical Papers
Abstract
WMM-1: Ultra-Compact THz Instruments for Space Exploration
Goutam Chattopadhyay
Goutam Chattopadhyay, JPL
JPL
(13:30 - 17:20)
Abstract
WMM-2: Present and Future ESA SAR Missions and their Advanced Exploitation to Deliver Actionable Information for Society in the Context of Climate Change and Green Transition
Anca Anghelea
Anca Anghelea, ESA
ESA
(13:30 - 17:20)
Abstract
WMM-3: Space Borne Microwave and THz Instruments for Earth/Planetary Science Applications
Heinz-Wilhelm Hübers
Heinz-Wilhelm Hübers, DLR and Humboldt-Universitüt zu Berlin
DLR and Humboldt-Universitüt zu Berlin
(13:30 - 17:20)
Abstract
WMM-4: Future Paths for Machine-Learning and Artificial-Intelligence in Spaceborne Microwave Instruments
Amber Emory
Amber Emory, NASA Earth Science Technology Office
NASA Earth Science Technology Office
(13:30 - 17:20)
Abstract
WMM-5: Low-Cost, Compact SAR System for Small-Satellite Constellation at LEO and vLEO
Hirobumi Saito, Jiro Hirokawa
Hirobumi Saito, ISAS, Jiro Hirokawa, Tokyo Tech
ISAS, Tokyo Tech
(13:30 - 17:20)
Abstract
WMM-6: THz Heterodyne Spectrometer for in-situ Resource Utilization (THSiRU)
Berhanu Bulcha
Berhanu Bulcha, NASA Goddard
NASA Goddard
(13:30 - 17:20)

-

Alexdandre Giry
CEA-LETI
Hyun-Chul Park
Samsung Electronics Co., Ltd.
Location
150AB
Abstract

This technical session focuses on addressing the demands of next-generation high-speed communication, high-resolution radar/imaging, and sensing applications, which necessitate high-power (>15dBm) and high-efficiency power amplifiers (PAs) operating at D-band frequencies and above (>100GHz). The session will delve into the design challenges associated with achieving improved output power, efficiency, linearity, and bandwidth in high-performance Silicon-based PAs, utilizing technologies such as SOI CMOS and SiGe. The first paper presents a high Pout and efficient PA operating at 130-151GHz, implemented in 22nm FD-SOI technology. It features a fully differential 8-way power combining network, enhancing Pout, and linearity. The subsequent two papers present advanced architectures and design techniques utilizing 45nm RF-SOI technology: Complex neutralization for source-gate-driven cascode PA and a cascade-stacked PA architecture. The last paper introduces a novel asymmetric slotline-based series-parallel combiner implemented in 130-nm SiGe BiCMOS technology, designing upper frequency bands up to 270GHz.

Technical Papers
Abstract
RMo4A-1: A D-Band Complex Neutralization Cascode Power Amplifier with A Source-Gate Driven Cascode for Enhanced Bandwidth and Efficiency.
Mohamed Eleraky, Hua Wang
Mohamed Eleraky, Swiss Federal Institute of Technology
Swiss Federal Institute of Technology, ETH Zurich
(15:40 - 16:00)
Abstract
RMo4A-2: A D-Band Power Amplifier with Optimized Common-Mode Behaviour Achieving 32Gb/s in 22-nm FD-SOI
Giacomo Venturini, Patrick Reynaert
Giacomo Venturini, KU Leuven
KU Leuven, KU Leuven
(16:00 - 16:20)
Abstract
RMo4A-3: Phased-Array-Compatible Area-Efficient D-Band Power Amplifiers in 45 RF SOI based on Cascade Stacking
Alfred Davidson, Harish Krishnaswamy
Alfred Davidson, Columbia Univ.
Columbia Univ., Columbia Univ.
(16:20 - 16:40)
Abstract
RMo4A-4: A 15.7-dBm 164‒270 GHz Power Amplifier with Asymmetric Slotline-Based Series-Parallel Combiner in 130-nm SiGe BiCMOS Technology
Gunwoo Park, Hyunjoon Kim, Sanggeun Jeon
Gunwoo Park, Korea Univ.
Korea Univ., Korea Univ., Korea Univ.
(16:40 - 17:00)
Andreia Cathelin
STMicroelectronics
Xiang Gao
Zhejiang Univ.
Location
151AB
Abstract

In this session, you will learn about 5 different CMOS Frequency Synthesis solutions that cover a range of frequencies from low GHz to sub-THz. These solutions are particularly relevant for applications such as FMCW radars and the upcoming 5G to 6G communications. The papers proposing these solutions are highly innovative and offer valuable insights.

Technical Papers
Abstract
RMo4B-1: A 45-fsrms-Jitter, 144-to-162-GHz D-Band Frequency Synthesizer Using a Subsampling PLL and a Harmonic-Boosting Frequency Multiplier
Seohee Jung, Jaeho Kim, Jooeun Bang, Jaehyouk Choi
Seohee Jung, Seoul National Univ.
Seoul National Univ., Seoul National Univ., Seoul National Univ., Seoul National Univ.
(15:40 - 16:00)
Abstract
RMo4B-2: A 37.2-fs, -254.6-dB FoM, 47.9-to-56.4 GHz PLL using Tightly Coupled Dual-core VCO with Implicit 4th Harmonic Extraction Technique
Qixiu Wu, Wei Deng, Mengjiao Xiong, Haikun Jia, Ruichen Wan, Hongzhuo Liu, Baoyong Chi
Mengjiao Xiong, Tsinghua Univ.
Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ.
(16:00 - 16:20)
Abstract
RMo4B-3: A 74GHz-80GHz 1.2GHz/µs-Slope 20.9mW FMCW Synthesizer with TDC-Gain-Independent Loop-Bandwidth Employing a TDC-Offset-Free Type-II Digital PLL and a Linearized Hybrid-Tuning DCO
Yi Liu, Zixi Jing, Zhiyu Liu, Chi Chung Yip, Zhirui Zong, Howard Luong
Yi Liu, Hong Kong Univ. of Science and Technology
Hong Kong Univ. of Science and Technology, Hong Kong Univ. of Science and Technology, Hong Kong Univ. of Science and Technology, Hong Kong Univ. of Science and Technology, Hong Kong University of Science and Technology (Guangzhou), Hong Kong Univ. of Science and Technology
(16:20 - 16:40)
Abstract
RMo4B-4: A 4.25GHz-8.45GHz 67%-Chirp-Fractional-Bandwidth -121.5dBc/Hz-PN@1MHz 88fs-Jitter FMCW Synthesizer with Bandwidth-Boosting and Phase-Noise-Cancellation Techniques
Yi Liu, Zixi Jing, Zhiyu Liu, Wen Yang, Chi Chung Yip, Liang Wu, Howard Luong
Yi Liu, Hong Kong Univ. of Science and Technology
Hong Kong Univ. of Science and Technology, Hong Kong Univ. of Science and Technology, Hong Kong Univ. of Science and Technology, Hong Kong Univ. of Science and Technology, Hong Kong Univ. of Science and Technology, Chinese University of Hong Kong - Shenzhen, Hong Kong Univ. of Science and Technology
(16:40 - 17:00)
Abstract
RMo4B-5: A 0.2-to-39.2GHz 66.2-fs Jitter and –71.3dBc Spur Sub-Sampling PLL Using DAC-Based Constant Control Voltage Compensator and Quad-Mode 2nd Harmonic Filtering Oscillator
Wen Chen, Yiyang Shu, Xun Luo
Wen Chen, Univ. of Electronic Science and Technology of China
Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China
(17:00 - 17:20)
Ahmed Elkholy
Broadcom Corp.
Sajjad Moazeni
Univ. of Washington
Location
152AB
Abstract

This session will present advanced wireline and localization systems. It includes a very wide bandwidth low distortion TIA for coherent optical communications. The second paper introduces an eye-opening monitor exploiting non-uniform sampling and quantization. The third paper presents a beamforming array with true-time delay for angle of arrival estimation. The last paper demonstrates a frequency-encrypted FMCW LiDAR using an electro-optical synthesizer.

Technical Papers
Abstract
RMo4C-1: Transimpedance Amplifiers with 95 GHz Transimpedance Bandwidth and 1.5% THD for 800G Coherent Optical Communications
Mir Mahmud, Hasan Al-Rubaye, Gabriel Rebeiz
Mir Mahmud, Univ. of California, San Diego
Univ. of California, San Diego, Broadcom, Univ. of California, San Diego
(15:40 - 16:00)
Abstract
RMo4C-2: A 4-26 Gbaud Configurable Multi-Mode Non-Uniform EOM with Improved Twin PI for High-Speed Wireline Communication Achieving 3-μs EW/EH Evaluation and 0.99-R2 Accuracy
Shubin Liu, Zhicheng Dong, Menghao Wang, Xiaoteng Zhao, Chenxi Han, Xianting Su, Zhangming Zhu
Menghao Wang, Xidian Univ.
Xidian Univ., Xidian Univ., Xidian Univ., Xidian Univ., Xidian Univ., Xidian Univ., Xidian Univ.
(16:00 - 16:20)
Abstract
RMo4C-3: RFIC A 10ns Delay Range 1.5GHz BW True-Time-Delay Array-based Passive-Active Signal Combiner with Negative-Cap Stabilized RAMP for Fast Precise Localization
Qiuyan Xu, Chung-Ching Lin, Aditya Wadaskar, Huan Hu, Danijela Cabric, Subhanshu Gupta
Qiuyan Xu, Washington State Univ.
Washington State Univ., Washington State Univ., Univ. of California, Los Angeles, Washington State Univ., Univ. of California, Los Angeles, Washington State Univ.
(16:20 - 16:40)
Abstract
RMo4C-4: An Electro-Optical Synthesizer to Generate Random Chirp Rates for Secure FMCW LiDAR Applications
Marziyeh Rezaei, Liban Hussein, Alana Dee, Sajjad Moazeni
Marziyeh Rezaei, Univ. of Washington
Univ. of Washington, Univ. of Washington, Univ. of Washington, Univ. of Washington
(16:40 - 17:00)

-

Venkata Vanukuru, Anurajan Hosagavi Puttaraju, Florinel Balteanu
GLOBALFOUNDRIES, Skyworks Solutions
Location
144C
Abstract

The research area of improving the performance, cost and size of 5G RF solutions and evolution to 6G is very active with many developments and it is one of the driving factors for semiconductor industry. Mobile cellular subscribers reached more than 6 billion in 2022 and 5G LTE brings high data capacity as low latency using sub-6GHz and mm-Wave spectrum. Mm-Wave up to 300GHz will play a major role in future 6G networks. The proliferation of worldwide smartphones has been in part possible due to increased computational power of CMOS technology in lower feature nodes as 3nm/7nm. This has made also possible to essentially enhance RF CMOS through digital signal processing (DSP) and digital calibration. The industrial workshop will cover 5G semiconductor technologies and architectures currently used in RF Front End Modules for cellular applications, the challenges for the 5G deployment as well the evolution to 6G.

Alexandre Siligaris
CEA-LETI
Travis Forbes
Sandia National Laboratories
Location
151AB
Abstract

This session highlights cutting-edge developments in cryogenic circuits and modeling in both CMOS and BiCMOS processes including a multicore VCO for bandwidth extension, a noise cancelling low noise amplifier for low power consumption, and a multi-channel waveform generator for quantum applications. An experimental study on radiation effects on a Ka Band PLL showing phase noise effects is presented.

Technical Papers
Abstract
RTu1B-1: Broadband Noise Characterization of SiGe HBTs Down to 4K
Jad Benserhir, Yating Zou, Yatao PENG, Hung Chi Han, Edoardo Charbon
Jad Benserhir, École Polytechniquecole Polytechnique Fédérale de Lausanne
École Polytechniquecole Polytechnique Fédérale de Lausanne, École Polytechniquecole Polytechnique Fédérale de Lausanne, University of Macau, École Polytechniquecole Polytechnique Fédérale de Lausanne, École Polytechniquecole Polytechnique Fédérale de Lausanne
(08:00 - 08:20)
Abstract
RTu1B-2: A Fully Integrated Three-Channel Cryogenic Microwave SoC for Qubit State Control in 9Be+ Trapped-Ion Quantum Computer operating at 4 K
Peter Toth, Paul Shine-Eugine, Alexander Meyer, Kaoru Yamashita, Sebastian Halama, Markus Duwe, Hiroki Ishikuro, Christian Ospelkaus, Vadim Issakov
Peter Toth, Institute for CMOS Design
Institute for CMOS Design, Institute for CMOS Design, Institute for CMOS Design, Ishikuro Laboratory, Institute of Quantum Optics, Institute of Quantum Optics, Ishikuro Laboratory, Institute of Quantum Optics, Institute for CMOS Design
(08:20 - 08:40)
Abstract
RTu1B-3: A Switchless Dual-core Triple-Mode VCO Achieving 7.1-to-15.7 GHz Frequency Tuning Range and a 202.1 dBc/Hz Peak FoM at 3.7 Kelvin
Yue Wu, Yatao PENG, Benhao Huo, Jun Yin, Rui P. MARTINS, Pui In Mak
Yue Wu, University of Macau
University of Macau, University of Macau, University of Macau, University of Macau, University of Macau, University of Macau
(08:40 - 09:00)
Abstract
RTu1B-4: A 46.7-dB Gain 9.3-K Noise Temperature 5.8-mW Two-Fold Current Reuse Dual Noise-Canceling LNA in 28-nm CMOS for Qubit Readout
Mahesh Kumar Chaubey, Yin-Cheng Chang, Po-Chang Wu, Hann-Huei Tsai, Shawn S. H. Hsu
Mahesh Kumar Chaubey, National Tsing Hua Univ.
National Tsing Hua Univ., Taiwan Semiconductor Research Institute, Taiwan Semiconductor Research Institute, Taiwan Semiconductor Research Institute, National Tsing Hua Univ.
(09:00 - 09:20)
Abstract
RTu1B-5: A Study of Total Dose Radiation Effects in Ka-Band Fractional-N PLLs in 45nm SiGe BiCMOS
David Dolt, Lauren Pelan, Samantha Mcdonnell, Shane Smith, Trevor Dean, David Reents, Will Gouty, Tony Quach, Waleed Khalil, Samuel Palermo
David Dolt, Texas A&M Univ.
Texas A&M Univ., AFRL, AFRL, Ohio State Univ., AFRL, Texas A&M Univ., AFRL, AFRL, Ohio State Univ., Texas A&M Univ.
(09:20 - 09:40)
Xun Luo
Univ. of Electronic Science and Technology of China
Zhiming Deng
MediaTek, Inc.
Location
152AB
Abstract

In this session, advanced digital PA and TX systems for 5G-NR, Wifi-7, and IoT applications are developed. Firstly, a 16-nm FinFet watt-level WiFi-7 all-digital polar TX using switched capacitor digital PA is introduced. Secondly, a SAW-less RF transmitter based on N-path switched-capacitor modulator is proposed for 5G-NR CIM3 cancellation. Thirdly, a high power quadrature complex domain Doherty PA using switched constant-current and symmetrical transformer is developed for deep PBO efficiency enhancement. Fourthly, A 5G FR2 n260/n259 phased-array transmitter front-end IC in 28-nm CMOS FD-SOI is discussed. Finally, a sub-2.4GHz transceiver with reused matching network and duty-cycle controlled Class-E PA for medical band is proposed.

Technical Papers
Abstract
RTu1C-1: A Watt level, 5-7GHz all digital polar TX based on 3.3V switched capacitor digital PA in 16nm Fin-FET for Wi-Fi7 applications
Naor Shay, Elad Solomon, Limor Zohar, Assaf Ben-Bassat, Eran Socher, Ofir Degani
Naor Shay, Tel-Aviv Univ.
Tel-Aviv Univ., Intel Corp., Intel Corp., Intel Corp., Tel-Aviv Univ., Tel-Aviv Univ.
(08:00 - 08:20)
Abstract
RTu1C-2: A SAW-less 3FLO-Suppression RF Transmitter with a Transformer-Based N-Path Switched-Capacitor Modulator Achieving -157.6dBc/Hz Output Noise and -61dBc CIM3
Gengzhen Qi, Haonan Guo, Pui-In Mak
Haonan Guo, Sun Yat-sen Univ.
Sun Yat-sen Univ., Sun Yat-sen Univ., University of Macau
(08:20 - 08:40)
Abstract
RTu1C-3: A 32.3dBm Quadrature Complex Domain Doherty Power Amplifier Based on Switched Constant-Current and Symmetrical Transformer Achieving 21.6% Average Power-Added Efficiency
Tao Wang, Lingyun Shi, Di Hua, Peng Cao, Jiawei Xu, Zhiliang Hong
Tao Wang, Fudan Univ.
Fudan Univ., Fudan Univ., Fudan Univ., Fudan Univ., Fudan Univ., Fudan Univ.
(08:40 - 09:00)
Abstract
RTu1C-4: A 5G FR2 n260/n259 Phased-Array Transmitter Front-End IC in 28-nm CMOS FD-SOI with 3-Stack Power Amplifier Employing OPA-Based Bias Scheme and Cross-Tied Inductor Topology
Jongwon Yun, Hongkie Lim, Jaeyeon Jeong, Iljin Lee, Doyoon Kim, Kyunghwan Kim, Hanwoong Choi, Geonho Park, Goeun Baek, Eun-Taek Sung, Ajaypat Jain, Foad Malekzadeh, Venumadhav Bhagavatula, Ivan Lu, Sangwon Son, Hyun-Chul Park, Joonhoi Hur, Sangmin Yoo
Jongwon Yun, Samsung Electronics, S.LSI
Samsung Electronics, S.LSI, Samsung Electronics, S.LSI, Samsung Electronics, S.LSI, Samsung Electronics, S.LSI, Samsung Electronics, S.LSI, Samsung Electronics, S.LSI, Samsung Electronics, S.LSI, Samsung Electronics, S.LSI, Samsung Electronics, S.LSI, Samsung Electronics, S.LSI, Samsung Semiconductor, Inc., Samsung Electronics, S.LSI, Samsung Electronics, S.LSI, Samsung Electronics, S.LSI, Samsung Electronics, S.LSI, Samsung Electronics Co., Ltd., Samsung Electronics, S.LSI, Samsung Electronics, S.LSI
(09:00 - 09:20)
Abstract
RTu1C-5: A 0.48mm2 Sub-2.4GHz Transceiver with Reused Matching Network and Duty-Cycle Controlled Class-E PA for Medical Band
Heng Huang, Xiliang Liu, Zijian Tang, Wei Song, Yuan Ma, Yuwei Zhang, Xiaoyan Ma, Milin Zhang, Jintao Wang, Kai Lu, Zhihua Wang, Guolin Li
Milin Zhang, Tsinghua Univ.
National Univ. of Defense Technology, Beijing Ningju Technology Ltd, Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Beijing Ningju Technology Ltd, Beijing Ningju Technology Ltd, Tsinghua Univ., Tsinghua Univ., National Univ. of Defense Technology, Tsinghua Univ., Tsinghua Univ.
(09:20 - 09:40)

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Salvatore Finocchiaro, Jeff Gengler, Markus Loerner, Florian Ramian, Wissam Saabe, Giorgia Zucchelli
Qorvo Inc., Rohde & Schwarz GmbH, AMCAD Engineering, MathWorks B.V.
Location
144C
Abstract

Communications standards such as 5G, WLAN, and SatCom as well as radar systems share the common trend towards higher frequencies and larger signal bandwidths. These trends impose tight requirements on transmitter linearity and power amplifiers efficiency. This workshop introduces a workflow to combine state-of-the-art PA measurements with behavioral models and prototypes for accelerating the design, optimization, and testing of linearization techniques. We will introduce recent trends in PA architectures and identify linearization techniques such as DPD, also taking into account load-pull effects. We will use hardware characterization and behavioral models to tradeoff design parameters and improve ACLR, EVM, and other metrics for 5GNR waveforms.

Minoru Fujishima
Hiroshima Univ.
Shahriar Shahramian
Bell Labs
Location
151AB
Abstract

This session will showcase cutting-edge innovations in silicon technology for wireless applications in D-band and beyond: system-in-package for 112.64Gb/s channel aggregation; 210-250GHz with integrated bow-tie antenna sliding-IF transceivers, dual ultra-wideband receivers, and scalable 128-channel phased arrays for dual-polarization MIMO communications are among the highlights.

Technical Papers
Abstract
RTu2B-1: A 210-to-250 GHz Sliding-IF Frequency-interleaved Transceiver with On-chip Bow-tie Antenna and 4th-order FIR-embedded Digital Modulator
Linjun Gu, Wei Deng, Junlong Gong, Taikun Ma, Haikun Jia, Qixiu Wu, Jiamin Xue, Dongfang Li, Hongzhuo Liu, Yaqian Sun, Baoyong Chi
Linjun Gu, Tsinghua Univ.
Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Tsinghua Univ.
(10:10 - 10:30)
Abstract
RTu2B-2: A 2x40 Gb/s Ultra-Wideband 131-173 GHz Dual Receiver for Point-to-Point Communication Systems with NF of 5.7 dB in RFSOI
Ahmed Afifi, Amr Ahmed, Gabriel Rebeiz
Ahmed Afifi, Univ. of California, San Diego
Univ. of California, San Diego, Univ. of California, San Diego, Univ. of California, San Diego
(10:30 - 10:50)
Abstract
RTu2B-3: A 112.64-Gb/s CMOS D-band Channel-Aggregation RX System-in-Package
Abdelaziz Hamani, José Luis GONZALEZ JIMENEZ, Alexandre SILIGARIS, Francesco Foglia Manzillo, Cedric DEHOS, Jean-Baptiste DAVID, Nicolas CASSIAU, Antonio CLEMENTE
Abdelaziz Hamani, Univ of Grenoble-Alpes France
Univ of Grenoble-Alpes France, Univ. Grenoble Alpes - CEA, LETI, CEA-LETI, CEA, Univ. Grenoble Alpes - CEA, LETI, Univ. Grenoble Alpes - CEA, LETI, Univ. Grenoble Alpes - CEA, LETI, Univ. Grenoble Alpes - CEA, LETI
(10:50 - 11:10)
Abstract
RTu2B-4: A D-Band Scalable 128-Channel Dual-Polarized Receive Phased-Array with On-Chip Down Converters for 2x2 MIMO Achieving 2x42 Gbps
Minjae Jung, Linjie Li, Amr Ahmed, Omar Hassan, Gabriel Rebeiz
Minjae Jung, Univ. of California, San Diego
Univ. of California, San Diego, Univ. of California, San Diego, Univ. of California, San Diego, Univ. of California, San Diego, Univ. of California, San Diego
(11:10 - 11:30)
Tolga Dinc
Texas Instruments
Aritra Banerjee
Univ. of Illinois at Chicago
Location
152AB
Abstract

This session covers PA developments in 2-40 GHz range for Satcom and other applications in CMOS, SiGe and GaN. The first paper presents a Q-band PA utilizing edge coupled-line impedance inverting balun. The next two papers cover Ku-band PAs in CMOS and SiGe with transformer area reduction techniques. The fourth paper presents an analog predistortion linearizer for a K-Band PA. The final paper demonstrates a wideband 2-18 GHz GaN reconfigurable nonuniform distributed PA.

Technical Papers
Abstract
RTu2C-1: An Efficient, High Power Q-Band SiGe HBT Power Amplifier With A Compact Four-Way Wilkinson Power Combiner Balun for Emerging Very Low-Earth-Orbit SATCOM
Hanjung Lee, Insu Han, Jae Hyeon Hwang, Inchan Ju
Hanjung Lee, Ajou Univ.
Ajou Univ., Ajou Univ., Ajou Univ., Ajou Univ.
(10:10 - 10:30)
Abstract
RTu2C-2: A Compact, Highly Linear Ku-Band SiGe HBT Power Amplifier Using Shared Single Center-Tap Four-Way Output Transformer Balun for Emerging Low Earth Orbit SATCOM Phased-Array Transmitter
Byeongcheol Yoon, Insu Han, Junghyun Kim, Inchan Ju
Byeongcheol Yoon, Hanyang Univ.
Hanyang Univ., Ajou Univ., Hanyang Univ., Ajou Univ.
(10:30 - 10:50)
Abstract
RTu2C-3: An Efficient Ku-Band Two-Way Vertical-like Power-Combining Power Amplifier using Merged Inter-stage Transformers Achieving 23-23.4 dBm Psat and 45.2-46.6% Peak PAE in 65nm CMOS
Joon-Hyung Kim, Jeong-Taek Lim, Jae-Eun Lee, Jae-Hyeok Song, Jeong-Taek Son, Min-Seok Baek, Eun-Gyu Lee, Sunkyu Choi, Han-Woong Choi, Seong-Mo Moon, Dongpil Chang, Choul-Young Kim
Joon-Hyung Kim, Chungnam National Univ.
Chungnam National Univ., Chungnam National Univ., Chungnam National Univ., Chungnam National Univ., Chungnam National Univ., Chungnam National Univ., Chungnam National Univ., Chungnam National Univ., Chungnam National Univ., ETRI, ETRI, Chungnam National Univ.
(10:50 - 11:10)
Abstract
RTu2C-4: A K-Band CMOS Power Amplifier using an Analog Predistortion Linearizer with 22.1 dBm Psat and 0.9° AM-PM Distortion
Junhan Lim, Wonseob Lee, Seong-Mo Moon, Euijin Oh, Seunghun Wang, Dongpil Chang, Jinseok Park
Wonseob Lee, Chonnam National Univ.
Electronics and Telecommunications Research Institute, Chonnam National Univ., Electronics and Telecommunications Research Institute, Chonnam National Univ., Electronics and Telecommunications Research Institute, Electronics and Telecommunications Research Institute, Chonnam National Univ.
(11:10 - 11:30)
Abstract
RTu2C-5: A 2-18 GHz Frequency Reconfigurable Nonuniform Distributed Power Amplifier with 13.3W Average Power and 39% Average Efficiency
Shu Ma, Xinyan Li, Ze Yu, Dexin Shi, Xiaochen Tang, Yong Wang
Xinyan Li, Univ. of Electronic Science and Technology of China
Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China
(11:30 - 11:50)

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Kaushik Sengupta, Oren Eliezer
Princeton Univ., Samsung Semiconductor, Inc.
David Pan, Jian Yang, Michael Thompson, Silvia Zhang, Tom Kazior
Univ. of Texas at Austin, Synopsys, Inc., Cadence Design Systems, Inc., Northeastern University, Defense Advanced Research Projects Agency
Location
207AB
Abstract

The growth in generative AI has, naturally, raised the question of its impact on RFIC design. The latter has been traditionally regarded as somewhat of a black art, requiring the ‘magic’ of human intuition and creativity.
But is RFIC design really so, or will AI be able to automate large portions of the design process in the future? Are the days of hand-crafted RFIC design limited? Will AI replace design engineers or only augment their capabilities, to some extent?
This lunch time panel, with both industry and academic experts, will attempt to unentangle the impact of AI in RFIC design.

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Fouad Boueri, Dr. Larry Dunleavy, Matt Ozalas, Dr. Taylor Barton
Qorvo USA, Modelithics, Inc., Keysight Technologies, Univ. of Colorado
Location
144C
Abstract

This workshop will focus on successful model based GaN power amplifier design.  Advanced simulation approaches for achieving stable high efficiency amplifiers will be outlined.  This will include demonstration examples using Keysight Technologies’ Pathwave Advanced Design System software, along with accurate non-linear models for Qorvo GaN HEMT devices developed by Modelithics.  Tools and techniques to tackle design challenges, such as load-modulated design will be exemplified, as well as advanced stability analyses enabled by the new WS-probe, now available in ADS and embedded intrinsically in Modelithics Qorvo GaN models.

Tong Zhang
Google
Hsieh-Hung Hsieh
Taiwan Semiconductor Manufacturing Co., Ltd.
Location
151AB
Abstract

With the emerging RF applications of 5G and beyond 5G (B5G), it is desired to enable silicon-based RF frontend circuits for low-cost and high-level integration. In this session, RF frontend circuits including low-noise amplifiers and mixers in CMOS and SOI technologies are presented. The design techniques for wideband or multi-band operations are discussed and demonstrated, as well as the performance enhancement in terms of DC power reduction and noise minimization.

Technical Papers
Abstract
RTu3B-1: A 4.4-mW 19–46-GHz Low-Noise Amplifier with Pole-Converging Gain Flattening and Triple-Resonance Input Matching
Jiahan Fu, Changwenquan Song, Yihui Wang, Liang Wu
Jiahan Fu, Chinese University of Hong Kong - Shenzhen
Chinese University of Hong Kong - Shenzhen, Chinese University of Hong Kong - Shenzhen, Chinese University of Hong Kong - Shenzhen, Chinese University of Hong Kong - Shenzhen
(13:30 - 13:50)
Abstract
RTu3B-2: A Compact 28/39 GHz Dual-Band Concurrent/Band-Switching LNA for 5G Multi-Band Multi-Stream Applications
Depeng Cheng, Qin Chen, Jing Feng, Xin Chen, Xujun Ma, Lianming Li
Depeng Cheng, Purple Mountain Laboratories
Purple Mountain Laboratories, Southeast Univ., Southeast Univ., Southeast Univ., Télécom SudParis, Institut Polytechnique de Paris, Southeast Univ.
(13:50 - 14:10)
Abstract
RTu3B-3: A High-Gain D-Band LNA with Compact Gm-Boosting Core Based on Slow-Wave Feedback Achieving 6.1 dB NF in 40 nm CMOS
Yun Qian, Xinge Huang, Yizhu Shen, Yifan Ding, Zhenghuan Wei, Qunfei Han, Sanming Hu
Yun Qian, Southeast Univ.
Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ.
(14:10 - 14:30)
Abstract
RTu3B-4: A Multi-Band and High-IRR Down-Conversion Mixer for 5G NR FR2 Using Compact Transformer-Based Mutual-Image-Rejection Filter
Haipeng Duan, Qin Chen, Xu Wu, Dongming Wang, Lianming Li, Xiaohu You
Haipeng Duan, Southeast Univ.
Southeast Univ., Southeast Univ., National Mobile Communications Research Laboratory, National Mobile Communications Research Laboratory, National Mobile Communications Research Laboratory, National Mobile Communications Research Laboratory
(14:30 - 14:50)
Abstract
RTu3B-5: A Compact Ultra-High-Linearity 7-to-20 GHz Passive Mixer Achieving up to 37 dBm IIP3 and 25.1 dBm IP1dB in 45nm CMOS SOI
Omar Hassan, Amr Ahmed, Gabriel Rebeiz
Omar Hassan, Univ. of California, San Diego
Univ. of California, San Diego, Univ. of California, San Diego, Univ. of California, San Diego
(14:50 - 15:10)
Vadim Issakov
Technische Univ. Braunschweig
Mona Hella
Rensselaer Polytechnic Institute
Location
152AB
Abstract

This session presents the latest development in D-band and THz transmitters. The first two papers present THz transmitters. The next three papers present D/F-Band transmitters all in CMOS technology with competitive data rates.

Technical Papers
Abstract
RTu3C-1: A 360 GHz Single-element Multi-mode Orbital Angular Momentum Cavity Antenna-based Transmitter in 90nm SiGe BiCMOS
Wei Sun, Sidharth Thomas, Aydin Babakhani
Wei Sun, Univ. of California, Los Angeles
Univ. of California, Los Angeles, Univ. of California, Los Angeles, UCLA
(13:30 - 13:50)
Abstract
RTu3C-2: A 300-GHz-Band 40-Gb/s 2D Phased-Array CMOS Transmitter with Near-Half-Wave Antenna Pitch
Kyoya Takano, Shun Beppu, Hayato Yagi, Yoshiki Sugimoto, Kunio Sakakibara, Shinsuke Hara, Mohamed Mubarak, Akifumi Kasamatsu, Shunichi Kubo, Kosuke Katayama, Satoshi Tanaka, Takeshi Yoshida, Shuhei Amakawa, Minoru Fujishima
Kyoya Takano, Tokyo University of Science
Tokyo University of Science, Tokyo University of Science, Tokyo University of Science, Nagoya Institute of Technology, Nagoya Institute of Technology, National Institute of Information and Communications Technology, National Institute of Information and Communications Technology, National Institute of Information and Communications Technology, THine Electronics, Inc., National Institute of Technology, Tokuyama College, Hiroshima Univ., Hiroshima Univ., Hiroshima Univ., Hiroshima Univ.
(13:50 - 14:10)
Abstract
RTu3C-3: A 110-to-170-GHz OOK Transmitter with 40-Gb/s Data Rate and 40-dB On-Off Ratio in 28-nm CMOS
Chun Yang, Dawei Tang, Peigen Zhou, Zhe Chen, Jixin Chen, Wei Hong
Chun Yang, Southeast Univ.
Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ.
(14:10 - 14:30)
Abstract
RTu3C-4: A CMOS Fully Integrated 120-Gbps RF-64QAM F-band Transmitter with an On-Chip Antenna for 6G Wireless Communication
Zisong Wang, Huan Wang, Youssef Hassan, Payam Heydari
Zisong Wang, Univ. of California, Irvine
Univ. of California, Irvine, Qualcomm Technologies, Inc., Univ. of California, Irvine, Univ. of California, Irvine
(14:30 - 14:50)
Abstract
RTu3C-5: A 56Gb/s Zero-IF D-Band Transmitter for a Beamformer in 22nm FD-SOI
Yang Zhang, Kristof Vaesen, Giovanni Mangraviti, Sehoon Park, Zhiwei Zong, Piet Wambacq, Giuseppe GRAMEGNA
Yang Zhang, IMEC
IMEC, IMEC, IMEC, IMEC, IMEC, IMEC, IMEC
(14:50 - 15:10)

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Markus Lörner, Vince Mallette, Bryan Hosein, Sajjad Ahmed, Andre Engelmann, Marco Dietz
Rohde & Schwarz, MPI Corp., Focus Microwaves, Friedrich-Alexander-Univ. Erlangen-Nürnberg, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT
Location
144C
Abstract

This workshop offers a deep dive, how precise load pull measurements support the optimization of RF power amplifiers in the D-band, a frequency range gaining momentum with its growing range of applications. Our session will center around a latest multi-stage power amplifier design operating in D-band. We will explore the distinctions and applications of passive versus hybrid load pull techniques, highlighting their roles in advanced measurement scenarios.
Collaborating with Friedrich Alexander Universität, we aim to present a comprehensive view of D-Band measurement challenges and solutions, addressing the practical and theoretical aspects vital for advancing in this evolving technology sphere.

Raja Pullela
MaxLinear, Inc.
Vito Giannini
UHNDER Inc
Location
151AB
Abstract

This session explores innovative circuit techniques and system applications at mm-wave and higher frequencies. The first paper discusses circuit techniques aimed at achieving wide-band performance in FMCW radars. The second paper outlines a circuit technique that achieves outstanding on/off modulation ratio in a 200G radar transmitter. The subsequent paper describes a radiometer that achieves the highest-frequency radiometer in an integrated silicon-based solution at 280GHz. The session concludes with a DAC-based cancellation scheme to attenuate spillover in radars utilized in automotive applications.

Technical Papers
Abstract
RTu4B-1: A 90-98-GHz FMCW Radar Transceiver Supporting Broadband Modulation in 65nm CMOS
Shengjie Wang, Jiangbo Chen, Jiabing Liu, quanyong li, Qizhou Yang, Xiaopeng Yu, Chunyi Song, Jane Gu, Zhiwei Xu
Shengjie Wang, Zhejiang Univ.
Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., Zhejiang Univ., Univ. of California, Davis, Zhejiang Univ.
(15:40 - 16:00)
Abstract
RTu4B-2: A 200-GHz Modulable Transceiver With 35-dB TX ON/OFF Isolation and 16Gb/s Code Rate for MIMO Radar in 130nm SiGe Process
Rui Zhou, Jixin Chen, Siyuan Tang, ZeKun Li, Dawei Tang, Peigen Zhou, Feng Xie, Zhe Chen, Wei Hong
Rui Zhou, Southeast Univ.
Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ., Southeast Univ.
(16:00 - 16:20)
Abstract
RTu4B-3: An On-Chip Antenna-Coupled Preamplified D-Band to J-Band Total Power Radiometer Chip in 130 nm SiGe BiCMOS Technology
Janusz Grzyb, Marcel Andree, Holger Rücker, Ullrich Pfeiffer
Marcel Andree, Univ. of Wuppertal
Univ. of Wuppertal, Univ. of Wuppertal, IHP GmbH, Univ. of Wuppertal
(16:20 - 16:40)
Abstract
RTu4B-4: An E-Band FMCW Radar Receiver Achieving 38dB Cancellation for Arbitrary-Path Spillover Up to -10dBm and 5.7dB NF in 65nm CMOS
Bolin Chen, Zhirui Zong
Bolin Chen, Hong Kong University of Science and Technology (Guangzhou)
Hong Kong University of Science and Technology (Guangzhou), Hong Kong University of Science and Technology (Guangzhou)
(16:40 - 17:00)
Teerachot Siriburanon
Univ. College Dublin
Rocco Tam
NXP Semiconductors
Location
152AB
Abstract

This session presents circuit building blocks operating in the 100 - 200 GHz frequency range. The first paper proposes a high output power, energy-efficient Gilbert-cell-based frequency doubler with 25% duty cycle technique using 55nm BiCMOS. The second paper presents a 120GHz passive subharmonic mixer with multiphase LO distribution in 28nm CMOS. The third paper proposes a wideband 200GHz LNA which leverages the use of an active balun input stage in 16nm FinFET. The session ends with a D-band bidirectional common-gate amplifier with current-reuse technique in 45nm RFSOI.

Technical Papers
Abstract
RTu4C-1: 110 - 170 GHz 25% Duty-cycle Gilbert-cell Frequency Doubler with 6.5 dBm Peak Output Power in BiCMOS 55 nm Technology
Lorenzo Piotto, Guglielmo De Filippi, Andrea Mazzanti
Lorenzo Piotto, Univ. of Pavia
Univ. of Pavia, Univ. of Pavia, Univ. of Pavia
(15:40 - 16:00)
Abstract
RTu4C-2: A Low Conversion Loss 120 GHz Passive IQ Down-ConversionSubharmonic Mixer with Multiphase LO Distribution in 28 nm CMOS
Sarah Koop-Brinkmann, Victor Lasserre, Michele Caruso, Daniele Dal Maistro, Giovanni Volpato, Christian Ziegler, Finn Stapelfeldt, Vadim Issakov
Sarah Koop-Brinkmann, Technische Univ. Braunschweig
Technische Univ. Braunschweig, Technische Univ. Braunschweig, Infineon Technologies Austria AG, Infineon Technologies Austria Ag, Infineon Technologies Austria Ag, Technische Univ. Braunschweig, Technische Univ. Braunschweig, Technische Univ. Braunschweig
(16:00 - 16:20)
Abstract
RTu4C-3: A 200 GHz Wideband and Compact Differential LNA Leveraging an Active Balun Input Stage in 16nm FinFET Technology
Ethan Chou, Nima Baniasadi, Ali Niknejad
Ethan Chou, Univ. of California, Berkeley
Univ. of California, Berkeley, Apple, Inc., Univ. of California, Berkeley
(16:20 - 16:40)
Abstract
RTu4C-4: A D-band Bi-directional Current-Reuse Common-Gate Amplifier in 45nm RFSOI
Syed Mohammad Ashab Uddin, Liwen Zhong, Wooram Lee
Syed Mohammad Ashab Uddin, Pennsylvania State Univ.
Pennsylvania State Univ., Pennsylvania State Univ., Pennsylvania State Univ.
(16:40 - 17:00)

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Location
207AB
Abstract

Join us for an engaging discussion (and food!) at the RFIChat event. Students and experts from academia, industry, and research will converge for an open discussion on RFIC careers and future trends. Bring your questions and come learn how to kickstart, advance, and optimize your career path for variables such as innovation, work-life balance, positive impact, financial stability and more. Our panelists promise to offer invaluable insights (secrets!?) into the unique landscapes of academia and industry, so come meet them and have a chat!

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Robert Dandaraw, Judy Chui, Nico Blase
Analog Devices Inc.
Location
144C
Abstract

Join us in this workshop as we delve deep into the unique capabilities of the 20GSPS Apollo MxFE designed to enable high performance applications in X-Band Radar, Electronic Defense, and Instrumentation.  Learn how to leverage the on-chip hardened DSP feature set to add significant performance and lower power.  We will move beyond theory and share real world performance data, link to specific applications, and demonstrate the tangible impact on your next generation design.

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GAVIN FISHER
FORMFACTOR
Location
144C
Abstract

This talk will provide practical guidance on how best carry out full over temperature testing over multiple bands from 10 MHz all the way up to 1.1 THz using Wincal 5.0 software. 



We discuss benefits of a range of calibration techniques to optimise for test time and accuracy out and approaches to fully automate the data acquisition process. 



Recent techniques will be shown including Load pull to 170 GHz / 220 GHz and modulated testing with the Vector Component Analyser also to 170 GHz.



Workshop examples using Python / Wincal 5.0 will be provided along with supporting videos.

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Fabricio Dourado, Lei Xu
Rohde & Schwarz GmbH & Co KG, Fujikura Ltd.
Location
144C
Abstract

Phased array antenna modules (PAAM) need to operate at highest efficiency and still meet emissions and EVM requirements. A very high number of tests in power, frequency, waveform type, and modes are required. We will explain EVM impairments, techniques to diagnose root causes, and how to minimize the influence of test equipment. Then, review fundamentals of linearization, how to estimate if DPD is recommended, and present linearization results with gap analysis. The device under test will be a PAAM with at least 64 elements. Metrics include ACLR, EVM with and without demodulation, AMAM, AMPM, frequency response, and group delay.

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Michael Thompson, Sanam Vakili, Claudia Rosch, Kerry Judd, Ron Pongratz
Cadence Design Systems
Location
144C
Abstract

Simulation, DRC, LVS, ERC, EM, PI, Thermal, Minimal Routing, Performance, Price, and Manufacturability all complicate and restrict design space. Increasing design and system complexity require designers to consider individual designs within the larger system earlier in the design flow to maximize system performance. Cadence’s complete design flow with EM and Thermal Analysis is the backbone infrastructure needed for the next generation of designs. In this workshop, we will review the complete flow and introduce the audience to the ML capabilities within the Virtuoso flow to aid designers in satisfying increased requirements and exploring additional solutions.

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Nathan Altaffer
Keysight Technologies
Location
144C
Abstract

What happens to your chip’s performance when it is placed in the package?  How close is "too close" when placing multiple chips next to each other?  Does the loop height of that bondwire impact your RF output?  Does the void in board below your chip impact the operating bandwidth?  Wouldn't you like to know BEFORE you go to manufacturing?  Now you can! Here is a design flow that is built to do 3D Heterogenous Integration and it can be easily integrated with several EDA tools including ADS, Virtuoso, Custom Compiler, and Tanner.  

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Luc Langlois, Fabrício Dourado, Yoshiharu Fujisaku, Noam Levine
Avnet, Rohde & Schwarz GmbH & Co KG, Fujikura Ltd., The MathWorks
Location
144C
Abstract

Ever increasing demand for high throughput, low latency, and ultra reliability in wireless transmission requires accurate channel estimation under impairment conditions including Doppler shifts and noise. Traditional techniques for channel estimation in 5G NR involve known pilot sequences inserted into the transmission from which the rest of the channel response can be interpolated across all sub-carriers. 
 
This workshop will demonstrate a convolutional neural network (CNN) for channel estimation using OTA measurements through mmWave PAAM and AMD RFSoC-based 5G NR receiver in a CATR chamber. Training is accelerated by combining MATLAB with hardware-based channel impairments including AWGN and variable carrier-frequency offsets.