“Zero-Power” Additively Manufactured FHE-Enabled Wireless/5G+ Ultrabroadband Modules for 5G+, Digital Twins, SmartAg, Industry 4.0 and Smart Cities Applications

In this talk, inkjet-/3D-printed antennas, interconnects, “smart” encapsulation and packages, RF electronics, RFIDs, microfluidics and sensors fabricated on glass, PET, paper and other flexible substrates are introduced as a system-level solution for ultra-low-cost mass-production of mm-wave modules and metasurfaces for communication, energy harvesting and sensing applications. Prof. Tentzeris will touch on the state-of-the-art area of fully-integrated printable FHE-Enabled broadband wireless modules covering characterization of 3D printed materials up to E-band, novel printable “ramp” interconnects and cavities for IC embedding as well as printable structures for self-monitoring and anti-counterfeiting packages.