Metal-Embedded Chip/Chiplet Assembly (MECA) Platform for High-Frequency RF Subsystems

New specifications for communication (eg 5G) and radar (eg automotive) applications at mm-wave frequencies have fostered the development of new packaging solutions for circuit and subsystem manufacturing. This workshop will give an overview on two 2.5D packaging technologies developed at HRL Laboratories which leverage electroplated copper to embed chips/chiplets into passive interposers: RF MECA and MECAMIC. We will review detailed process flows, development of Process Design Kits (PDKs), electrical results, cost considerations, yield improvements, and reliability of the integration.