Diamond-Metal Composite Package for High-Power RF Device

GaN device technologies have been increasing in power and voltage to give end users an advantage in total system cost and performance for Aerospace and Defense applications, including radar and electronic warfare systems. As the power levels increase there is a greater burden placed on the package to dissipate heat out of the die and into the surrounding environment or heat sink. This presentation will show the research conducted to identify a diamond composite material with significantly improved thermal properties and compatibility with GaN-SiC die, form the material into a flange and integrate this into a functional package to enable very high-power RF devices.