Diamond as an Active Ultra Wide Bandgap Semiconductor for RF and Power Devices

Although diamond’s unique material properties—its high breakdown field, thermal conductivity, and carrier mobility—have long been understood, translating these properties into current-carrying devices has historically been held back by manufacturing and design challenges. Those challenges are rapidly being addressed, resulting in new all-diamond components on the verge of commercialization. We’ll examine recent advances in diamond diodes, transistors and even integrated circuits, and the challenges yet to be solved. Case studies will highlight how these new components can be integrated into government and commercial systems. Finally, I will discuss the manufacturing roadmap for scaling diamond component production.