Fundamentals of Signal Integrity for High-Speed Applications and Advances in Packaging Technology

This talk will explore the fundamentals of signal integrity (SI) in high-speed applications, focusing on frequency and time-domain analysis. Attendees will gain a foundational understanding of how signal loss, crosstalk, and reflections impact system performance at high data-rates. Additionally, we will cover recent advances in packaging techniques for broadband applications, including chiplets and advanced interconnects, highlighting how these innovations address challenges in high-frequency designs. The session will provide a comprehensive overview, bridging the gap between SI fundamentals and modern packaging technologies for broadband systems.