Waferscale RF Silicon Interposer Packaging Technology for mm-Wave Phased Arrays and Radars

This talk focuses on imec’s 300mm RF Silicon Interposer packaging technology for mm-wave applications. Key modules of the technology will be introduced with advantages over both HDI PCB technology and IC backends. Hetero-integration of CMOS (complexity), III-V (power/efficiency), Antennas as well as thermal management will be addressed.