Advances in Wafer-Level Packaging (WLP) and Heterogeneous Integration for mm-Wave Phased Arrays

mm-Wave phased arrays offer highly attractive capabilities for next generation communication and radar systems. The high operating frequency and highly scaled nature of these systems pose significant challenges in achieving excellent RF performance, thermal and mechanical stability, and attractive manufacturing and screening costs. Advances in wafer-level packaging and heterogenous integration capabilities are overcoming challenges with RF performance, 3D interconnects, and integration interfaces. Challenges in thermal management, electrical and reliability screening, and lack of mature process and assembly design kits continue to persist and will be discussed.