Die-Embedded Glass Packaging Technology

The novel die-embedded glass packaging technology integrates a 140GHz InP power amplifier (PA) into a glass substrate using micro-vias for interconnects, eliminating assembly and achieving less than 1.04dB loss per interconnect from 110–170GHz. This approach addresses electrical and thermal challenges at high frequencies, with copper electroplated on the die’s backside for efficient heat dissipation. This technology offers significant potential for developing wireless modules in the D-band and higher frequencies, enhancing both performance and thermal management.