RF-Optimized Silicon Interposer for mm-Wave and Sub-THz Applications — Technology, Design and System Considerations

This talk focuses on IMEC’s RF-interposer technology for above-100GHz applications. The drawbacks of traditional PCB-based solutions for higher frequencies will be explained. Then the talk would focus on the different building blocks and features that need to be developed for above-100GHz applications and how waferscale integration can provide a solution. A special focus will be on Antenna, CMOS (complexity), III-V (power/efficiency) integration and thermal management of highly scaled solutions.