Workshops

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IMS/RFIC
Hao Wang, Anis Ben Arfi
MediaTek, Analog Devices
Location
144AB
Abstract

The pursuit of ubiquitous connectivity and the rapid evolution of wireless communication technologies such as 5G and mm-wave have spurred a growing demand for RF front-end design that can operate across a wide frequency spectrum for various communication standards. However, achieving highly reconfigurable transceivers for multiple communication standards and frequencies presents a series of challenges. Accommodating various frequency bands necessitates multiple bulky filters in both transmitter and receiver, leading to increased form factor, cost, and insertion loss. High-speed communications typically with high peak-to-average power ratios (PAPR) require more power backoff in power amplifier (PA) for good linearity while compromising transmitter efficiency. Moreover, ultra-high-speed communications such as 5G mm-wave call for ultra-low-jitter local oscillator (LO) and clock generation with fine frequency resolutions. This workshop focuses on addressing these challenges through the approaches of RF/analog/digital hybrid design techniques. Critical circuit topologies including RF digital-to-analog converter (RFDAC), digital power amplifier (DPA), N-path filter/mixer, magnet-free circulator, and fractional-N sub-sampling all-digital phase-locked loop (ADPLL) are presented. The audiences are invited to explore the integration of these techniques to achieve unified transceiver architectures with exceptional reconfigurability. Five prominent speakers from leading institutes and companies will present their latest works and share insights on the development of advanced RF front-end design. Two speakers will delve into the design of RFDACs and DPAs in high-efficiency transmitters. Afterwards, another two speakers will discuss N-path filters and mixers, as well as magnet-free circulators, for high-selectivity receivers and full-duplex transceivers. Finally, the fifth speaker will guide our attentions to the LO and clock generation, by presenting the design of ultra-low-jitter fractional-N all-digital sampling phase-locked loops. The workshop serves as a collaborative platform, bringing together experts from academia and industry to discuss and envision the future of highly reconfigurable transceiver IC design. Through the presentations and the panel discussion session, attendees will gain valuable insights into the cutting-edge techniques driving the development of RFIC design.

Technical Papers
Abstract
WSB-1: Emerging Techniques for RF Digital-to-Analog Converter
Mike Shuo-Wei Chen
Mike Shuo-Wei Chen, Univ. of Southern California
Univ. of Southern California
Abstract
WSB-2: Reconfigurable Digital PAs for Backoff Efficiency, Output Power, Bandwidth, and Linearity Enhancement
Huizhen Jenny Qian
Huizhen Jenny Qian, Xidian Univ.
Xidian Univ.
Abstract
WSB-3: Interference Mitigation in RF and mm-Wave Circuits and Systems for Future Wireless Networks
Negar Reiskarimian
Negar Reiskarimian, MIT
MIT
Abstract
WSB-4: High Dynamic-Range Passive Mixers for Flexible mm-Wave Communications
Alyosha Christopher Molnar
Alyosha Christopher Molnar, Cornell Univ.
Cornell Univ.
Abstract
WSB-5: Low-Jitter PLLs for Advanced Wireless Transceivers
Wanghua Wu
Wanghua Wu, Samsung
Samsung
IMS/RFIC
Didier Belot, Pierre Busson
STMicroelectronics
Location
143ABC
Abstract

The 6G Telecom generation forecasts mm-wave and sub-THz applications as Fronthaul and Backhaul mm-wave and sub-THz wireless links; Reflective Intelligent Surface between mini-cell station and devices mainly in mm-wave frequency range; Short distance ultra-high data-rate mm-wave and sub-THz wireless data storage transfer; Automotive Joint communication and Sensing Radars; Health and Industrial mm-wave and sub-THz Radars and imagers; and other applications which are not yet defined. A Key challenge facing us is how to manage multi-processes dies with antennas integrated in the same object, reducing losses, and then increasing power efficiency and, at the same time targeting the cost efficiency. The workshop will discuss the trade-off Power Efficiency/Cost Efficiency of different 3D assembly strategies and will try to have a picture of the most promising research in the domain, through topics which will address as III-V GaN/Si and InP/Si, with SiGe and or CMOS Heterogeneous Integration; Wafer to Wafer; Die to Wafer, Backend of line co-integration; mm-wave sub-THz packaging, including Antenna integration, Si-Interposers, organic interposers, and other packaging 3D approach. The power efficiency can be defined as the max data rate ability, with the max distance covered by the transceiver over its power consumption, the cost efficiency is max data rate ability, with the max distance covered by the transceiver over its cost. This simple relation does not take into account the cooling equipment, if necessary, the reliability, and finally the environmental impact of the different strategies. These last points are difficult to quantify at the research level.

Technical Papers
Abstract
WSF-1: System-on-Wafer: 2D and 3D Technologies for Heterogeneous Systems
Hervé Boutry, Olivier Valorge, Christophe Dubarry
Olivier Valorge, CEA-LETI
CEA-LETI, CEA-LETI, CEA-LETI
Abstract
WSF-2: RF-Heterointegration at Wafer-Level and Panel-Level for mm-Wave Applications
Siddhartha Sinha, Nadine Collaert
Siddhartha Sinha, IMEC
IMEC, IMEC
Abstract
WSF-3: Material and Packaging Trends for High Frequency mm-Wave Applications
Tanja Braun
Tanja Braun, Fraunhofer IZM
Fraunhofer IZM
Abstract
WSF-4: Heterointegration Approaches for InP-HBT Technologies for 5G Applications and Beyond
Hady Yacoub, Wolfgang Heinrich
Hady Yacoub, FBH
FBH, FBH
RFIC
Travis Forbes, Amrita Masurkar
Sandia National Laboratories, BAE Systems
Location
147AB
Abstract

Emerging applications such as satellite-based internet, quantum computing, high-temperature sensors and communications systems, and massive Internet-of-Things (IoT) wireless networks are enabling disruptive advances in computational ability, global internet coverage, device-to-device communications, and industrial and military sensing abilities. However, all of these extreme environments require integrated circuits to operate well beyond environmental ranges and operating voltages provided by the standard Process Development Kits (PDK) and require a combination of design skills traditionally held in non-overlapping design communities. This workshop will bring together these design communities through experts from academia and industry to provide attendees with a holistic view on overcoming these challenges. Starting near zero Kelvin, the first talk will give an overview of circuit design at cryogenic temperatures including effects on devices, matching, and how to overcome these effects. Taking it hotter, the next talk will cover device effects operating well above 150C and ongoing research to enable high yield systems at these temperatures. Making the workshop RAD, the third talk will give an overview of radiation effects on CMOS circuits and ways to design RF and analog circuits to overcome these effects. Taking it out of this world, the fourth talk will cover challenges of both radiation and temperature effects found in space-based applications and design techniques to overcome these challenges. The final talk will cover dense wireless environments with high-power RF blockers pushing the limits of the supported process supply voltage and RFIC design techniques to filter and operate through this interference. To end the workshop, we will bring the experts together for cross-pollination of ideas through a panel interaction with attendees. Can this panel create a space radiation hardened, any temperature-stable, high-power handling device? … Come and find out!

Technical Papers
Abstract
WSH-1: Challenges and Approaches for Mixed-Signal Cryogenic CMOS Design
Kevin Tien
Kevin Tien, IBM
IBM
Abstract
WSH-2: Operating at the Extreme: Design of Electronics at High Temperatures
Matt Francis
Matt Francis, Ozark Integrated Circuits
Ozark Integrated Circuits
Abstract
WSH-3: Effects of Radiation on CMOS RF and Analog Circuits, and Mitigation Techniques
Samuel Palermo
Samuel Palermo, Texas A&M Univ.
Texas A&M Univ.
Abstract
WSH-4: RFIC Techniques for Deep Space Planetary Exploration
Adrian Tang
Adrian Tang, JPL
JPL
Abstract
WSH-5: Maintaining Receiver Sensitivity in the Presence of High-Power RF Blockers
Eric Klumperink
Eric Klumperink, Univ. of Twente
Univ. of Twente
IMS/RFIC
Salvatore Finocchiaro, Teerachot Siriburanon
Qorvo, Univ. College Dublin
Location
145AB
Abstract

The evolution of 5G and the need for increased capacity drive new transmitter requirements. Broadband and multiband operation requires the Power Amplifiers (PAs) to support a wider operating frequency range and high data rate require large instantaneous bandwidths, further extended by carrier aggregation, while delivering high power and maintaining high efficiency. Additionally, modern systems require complex modulation schemes exhibiting high Peak-to-Average-Power Ratio (PAPR) of more than 10dB. When operating at high Output-BackOff (OBO), Drain and Power Added Efficiency (DE and PAE) of traditional PA is typically low, with the majority of power dissipated in heat! New efficiency enhancement architectures and design techniques, from Waveform Engineering, to Load Modulation (Doherty, Outphasing and LMBA) and Supply Modulation (Envelope Tracking), have been explored in recent years. The desire for the widest possible operational bandwidth (operating frequency range) to reduce system complexity and cost is driving new broadband design techniques exploring broadband combining and broadband matching. This workshop will introduce recent trends in PA architectures, PA design and broadband matching techniques addressing the three major challenges listed above, ie wide operating bandwidth, wide instantaneous bandwidth, and large PAPR. We will look at design trade-offs to improve and maintain efficiency while satisfying system requirements which include ACLR, EVM, and other metrics for 5G New Radio (5GNR) waveforms. The concept of linearization and Digital Predistortion (DPD) will be introduced in the context of evaluating the PA performance with respect to system requirements. Experts from industry and academia that are at the frontline of these developments are invited to address these issues and inform the audience about the latest advances in this field.

Technical Papers
Abstract
WSJ-1: The Load Modulated Balanced Amplifier as a Frequency Agile PA Technique
Roberto Quaglia
Roberto Quaglia, Cardiff University
Cardiff University
Abstract
WSJ-2: Design Challenges of Broadband High-Power Load-Modulated Power Amplifiers
Luís C. Nunes
Luís C. Nunes, Instituto de Telecomunicações
Instituto de Telecomunicações
Abstract
WSJ-3: Wideband Power Amplifier Design Through Active Impedance Matching
Taylor Barton
Taylor Barton, University of Colorado Boulder
University of Colorado Boulder
Abstract
WSJ-4: Power, Efficiency, and Linearity Trade-Off in Designing GaN Solid-State Power Amplifiers (SSPAs) for SATCOM Applications
Rocco Giofrè
Rocco Giofrè, Università di Roma “Tor Vergata”
Università di Roma “Tor Vergata”
Abstract
WSJ-5: MISO Load Modulated Power Amplifiers with Digital Predistortion
Noureddine Outaleb
Noureddine Outaleb, Analog Devices
Analog Devices
Abstract
WSJ-6: mm-Wave Power Amplifiers with Wideband Efficiency, Ultra-Compactness and Built-in Sensors
Hua Wang
Hua Wang, ETH Zürich
ETH Zürich

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IMS/ARFTG
Manoj Stanley, Masahiro Horibe, Nick Ridler
NPL, AIST
Location
149AB
Abstract

The growing field of quantum computing relies on a broad range of microwave technologies and has spurred development of microwave devices and methods in new operating regimes. But despite the significant progress made in the last decade in the science, engineering and characterization of quantum computation systems, several challenges remain to be overcome before quantum computation can become practically usable. One of the most promising quantum computing technologies is the superconducting quantum computing platform, which relies on microwave waveforms and devices to control and readout quantum bits, typically at cryogenic temperatures of tens of milli-kelvin. The advancement of quantum computing implies an increase in number of qubits within or across quantum processors leading to a significant increase in microwave cabling and components operating at such cryogenic temperatures to operate the quantum processors. This puts stringent requirements on heat-load, space, and signal integrity under these extreme temperatures. The challenges of realizing such practical large-scale quantum computing systems present microwave engineers and metrologists with opportunities in cryogenic microwave modeling, design, measurement, and characterization of cryogenic semiconductor and superconductor components, circuits, systems, and networks. This workshop reviews the existing microwave measurement and engineering challenges in realizing a practical quantum computer and addresses some of these challenges. The workshop includes talks from end-users, instrument and equipment manufacturers, academia, and national measurement labs from around the world.

Technical Papers
Abstract
WSA-1: Device Characterization at Cryogenic Temperatures for Quantum Computing
Manoj Stanley, Nick Ridler
Manoj Stanley, NPL
NPL, NPL
Abstract
WSA-2: Measurement Techniques and Challenges for Qubit Control
Suren Singh
Suren Singh, Keysight Technologies
Keysight Technologies
Abstract
WSA-3: How to Succeed in RF and mm-Wave On-Wafer Testing at Cryogenic Temperatures?
Gavin Fisher
Gavin Fisher, FormFactor
FormFactor
Abstract
WSA-4: Cryogenic Microwave Measurements on Superconducting Circuits at PTB
Karsten Kuhlmann
Karsten Kuhlmann, PTB
PTB
Abstract
WSA-5: On-Wafer S-Parameter Measurements of Passive Planar Circuits at Cryogenic Temperatures
Xiaobang Shang
Xiaobang Shang, NPL
NPL
Abstract
WSA-6: Next-GEN Quantum Computing Supply Chain
Masahiro Horibe
Masahiro Horibe, AIST
AIST
Abstract
WSA-7: Scalable Hardware for Quantum Computing
Alirio Boaventura, Kyle Thompson
Alirio Boaventura, Maybell Quantum
Maybell Quantum, Maybell Quantum
Abstract
WSA-8: Addressing Integration Challenges in CMOS RF Circuits at Cryogenic Temperatures
James Kirkman, Grayson Noah
Grayson Noah, Quantum Motion
Quantum Motion, Quantum Motion
Abstract
WSA-9: Can Wireless Interfacing Address the Qubit Upscaling Challenge?
Chong Li
Chong Li, Univ. of Glasgow
Univ. of Glasgow
IMS
Gabriele Formicone, David Brown
Integra Technologies, BAE Systems
Location
209ABC
Abstract

This workshop gathers together world experts, research and industry leaders to report and discuss the latest RF/MW technology developments that continue to drive innovation in high-power applications in Aerospace & Defense, as well as in ISM. Specific areas of interest discussed in this workshop span from vacuum tubes (VEDs) to solid-state transistors for active devices, to circuit design and techniques, as well as specific applications that leverage the benefits of the evolving technology. This full-day workshop is geared towards practitioners in the high-power RF/MW aerospace, defense, industry, scientific and medical areas who want to gain a broader perspective on the latest technology developments as well as nuances specific to each different application. Novices and newcomers to the A&D and ISM industry will also gain a comprehensive exposure and understanding of the RF/MW landscape that drives innovation in this specific arena.

Technical Papers
Abstract
WSC-1: Traveling Wave Tube Amplifiers for Space System Transmitters
Andrew Moulthrop, Michael S. Muha
Andrew Moulthrop, Aerospace
Aerospace, Aerospace
Abstract
WSC-2: Development of High-Power Vacuum Electron Devices for Radar
Monica Blank, Mohamed D. Abouzahra, Michael MacDonald
Monica Blank, CPI
CPI, MIT Lincoln Laboratory, MIT Lincoln Laboratory
Abstract
WSC-3: High-Power RF Technology for Solid-State Radar
Nestor Lopez, Michael MacDonald, Mohamed D. Abouzahra
Nestor Lopez, BAE Systems
BAE Systems, MIT Lincoln Laboratory, MIT Lincoln Laboratory
Abstract
WSC-4: Technology Options for Phased Array Beamforming
Gijs van der Bent
Gijs van der Bent, TNO
TNO
Abstract
WSC-5: Overview of Modern High-Power Microwave (HPM) Technologies and Challenges
Feyza Berber Halmen, Travis Fields, Roy C. Allen
Feyza Berber Halmen, MIDE
MIDE, MIDE, MIDE
Abstract
WSC-6: High-Power RF Pallet and Transistor Solutions for Radar and Avionic Systems from UHF to S-Band
John Walker, James Custer, Tom Cole
Tom Cole, Integra Technologies, Inc.
Integra Technologies, Integra Technologies, Integra Technologies, Inc.
Abstract
WSC-7: High-Power RF/Microwave Systems in Medical and Agricultural Applications
Paolo F. Maccarini
Paolo F. Maccarini, Duke Univ.
Duke Univ.
Abstract
WSC-8: Solid-State Amplifiers for Noninvasive Thermo-Acoustic Imaging to Diagnose Liver Fat and Other Medical Applications
Chris Davis
Chris Davis, ENDRA Life Sciences
ENDRA Life Sciences
Abstract
WSC-9: The Role of RF Technology in MR Imaging (MRI) Systems
Daniel Myer
Daniel Myer, CPC
CPC
Abstract
WSC-10: Build-a-Radar Self-Paced Massive Open Online Course (MOOC) for Students of All Backgrounds
Kenneth E. Kolodziej
Kenneth E. Kolodziej, MIT Lincoln Laboratory
MIT Lincoln Laboratory
IMS
Naoki Shinohara, Christopher T. Rodenbeck
Kyoto Univ., U.S. Naval Research Laboratory
Location
144C
Abstract

Recently, new research projects toward Space Based Solar Power (SBSP) and related beam Wireless Power Technology (WPT) are born simultaneously in the world. The SBSP was originally called a Solar Power Satellite (SPS) and it was proposed in 1968. The SBSP is a future power station in geostationary satellite orbit and the electricity generated in space is transmitted wirelessly via microwave beam to the ground. In the past 50 years, research and development projects toward the SBSP were carried out several times in US, in Japan, and in Europe. In each R&D project, new SBSPs were designed with the latest technology at the time. What is different now is that the industrial revolution is happening in parallel. For example the commercial WPT (both coupled WPT and far-field WPT) market has started in the past 10 years. Revolutionary start-up companies for space applications are developing. Based on changes in the business market, new R&D projects toward the SBSP have now started in US, in Japan, in Europe, in China, and in other countries. In this workshop, we focus on the new technologies and new R&D projects of the SBSP and related beam WPT R&Ds. The requirements of the beam WPT for the SBSP are accurate beam forming with a huge phased array, high-efficiency microwave transmitter/generators, novel high-efficiency devices, high-efficiency rectifiers with diodes, harmonization between the WPT beam and conventional wireless systems, and suppression of interference between the WPT beam and space plasma/atmosphere, etc. ITU-R (International Telecommunication Union Radiocommunication Sector) recommends frequencies suitable for commercial WPT, especially weak-powered wide-beam WPT in 2022. The Japanese government established new radio regulation of the weak-powered wide-beam WPT in 2022. Radio regulations are under discussion for beam WPT suitable not only for the SBSP but also for WPT aided drone, etc, which is the expected 2nd step of commercial WPT in the world. The WPT technologies introduced in this session are widely applicable both to the SBSP and to 2nd step commercial WPT.

Technical Papers
Abstract
WSD-1: Terrestrial Microwave Power Beaming at Distances >1km
Christopher T. Rodenbeck
Christopher T. Rodenbeck, U.S. Naval Research Laboratory
U.S. Naval Research Laboratory
Abstract
WSD-2: Space Demonstration Experiment Towards Practical Solar Power Satellite
Koji Tanaka, Koichi Ijichi, Hiroki Yanagawa, Hidetoshi Kitabatake
Koji Tanaka, JAXA
JAXA, Japan Space Systems, Japan Space Systems, Japan Space Systems
Abstract
WSD-3: ESA’s SOLARIS Initiative and Technology Developments for Wireless Power Transmission
Sanjay Vijendran
Sanjay Vijendran, ESA
ESA
Abstract
WSD-4: Simulating Gigascale Antenna Arrays with Open Source Software
Francesco Raimondo
Francesco Raimondo, Univ. of Bristol
Univ. of Bristol
Abstract
WSD-5: Korean SBSP Pilot System and High-Powered WPT Technology
Sang-Hwa Yi
Sang-Hwa Yi, KERI
KERI
Abstract
WSD-6: (Space-Based Solar) Wireless Power Transfer: The Airbus Vision
Volker Ziegler
Volker Ziegler, Airbus
Airbus
Abstract
WSD-7: Scaled SBSP Demonstration Mission and Wireless Power Transfer for Space Applications
Matto Madi
Matto Madi, Sirin Orbital Systems
Sirin Orbital Systems
Abstract
WSD-8: Technical Advances and Market Progress Towards Intelligent Power-Beaming Microgrids
Chris Davlantes
Chris Davlantes, Reach
Reach
Abstract
WSD-9: CASSIOPeiA Antenna with Steering Scaled Indoor Experiments (CASSIE)
Neil Buchanan
Neil Buchanan, Queen’s University Belfast
Queen’s University Belfast
Abstract
WSD-10: Introduction to the Proposed High-Power Electric Generation and WPT Demonstration Mission
XinBin Hou
XinBin Hou, CAST
CAST
Abstract
WSD-11: The Development of SBSP Experimental Base and Comprehensive Research Facility
Huaiqing Zhang
Huaiqing Zhang, Chongqing Univ.
Chongqing Univ.
Abstract
WSD-12: Novel Satellite Experient by CLATEC
Ali Hajimiri
Ali Hajimiri, Caltech
Caltech
IMS
Xun Luo, Qingfeng Zhang, Sukomal Dey, Guoan Wang
UESTC, SUSTech, IIT Palakkad, Univ. of South Carolina
Location
201
Abstract

With ever-increasing advances in the fields of the modern wireless technologies (eg 6G and radar systems), the design of compact and multi-functional transceivers to meet the stringent requirements demanded by such systems remains a great challenge. In this context, multi-functional RF integrated passive components (IPCs) are considered key building circuits for their development. These components are based on novel miniaturized structures and specific technologies that can be utilized for the implementation of RF, microwave, mm-wave, and THz wireless systems. This unique workshop focuses, for the first time, on the area of IPCs and their applications in the context of 6G wireless and radar scenarios by reporting recent research findings in this exciting field. This includes current progress in miniaturized RF passive components enabling multi-functional and adaptive radios from the aspects of thin-films integration (eg ferroelectric and ferromagnetic thin films), on-chip tuning techniques (eg diodes and transistors) and novel THz (eg f-band, D-band, etc) passive components with application in active circuits will be presented. Furthermore, state-of-the-art transmission line synthesis and development will be presented. In particular, the technique of mode diversity and mode composition will be explained and discussed with a number of examples, including an emerging concept of mode selectivity. Theoretical and experimental results will be presented in an effort to explore structural integration, physical agility, multifunctional operation, and performance enhancement of integrated transmission lines. In addition, multi-functional on-chip reflectionless components (eg CMOS and SiGe passives) and integrated antenna sub-system, along with hybrid acoustic-wave lumped-element microwave resonator technologies for the realization of advanced compact microwave filtering devices are described. Finally, the latest advances in the area of RF to THz passive micro-systems for multi-functional applications in 6G, radar system, and beyond, will also be presented.

Technical Papers
Abstract
WSE-1: Exploring Structural Integration, Physical Agility, Multifunctional Operation, and Performance Enhancement through Mode-Diversity and Mode-Selectivity
Ke Wu
Ke Wu, Polytechnique Montréal
Polytechnique Montréal
Abstract
WSE-2: Multiple Functional RF Passives Enabled with Thin-Films and Techniques
Guoan Wang
Guoan Wang, Univ. of South Carolina
Univ. of South Carolina
Abstract
WSE-3: Field-Controlled Ferroelectric Film Bulk Acoustic Wave Resonators and Filters
Amir Mortazawi
Amir Mortazawi, Univ. of Michigan
Univ. of Michigan
Abstract
WSE-4: Novel F-Band, D-Band SiC Substrate-Integrated Waveguide Passive Components with Application in Active Circuits for 6G and Beyond
James Hwang
James Hwang, Cornell Univ.
Cornell Univ.
Abstract
WSE-5: Phase Change Material (PCM) Microwave and mm-Wave Reconfigurable Devices
Raafat R. Mansour
Raafat R. Mansour, Univ. of Waterloo
Univ. of Waterloo
Abstract
WSE-6: Emerging Multi-Material Additive Manufacturing Technologies for mm-Wave and Sub-THz Applications
Yang Yang
Yang Yang, UTS
UTS
Abstract
WSE-7: Empowering Multi-Band 5G/6G Wireless and Beyond from Passive Components to Active Microsystem
Xun Luo
Xun Luo, UESTC
UESTC
RFIC
Alberto Valdes-Garcia, Young-Kai Chen, Arun Paidimarri
IBM T.J. Watson Research Center, Coherent
Location
150AB
Abstract

Algorithms and processing pipelines based on Artificial-Intelligence (AI) and Machine-Learning (ML) techniques are on a solid trajectory to become an integral part of the next generation of wireless systems. While the exploration of AI/ML to RF applications started decades ago, their development has accelerated recently with the increasing availability of advanced AI knowledge, high-capacity compute infrastructure, and wireless testbeds for generation and training data sets. Nevertheless, the development of AI-enhanced wireless systems remains a challenging multi-disciplinary task, where EM, RF, IC design, signal processing, and ML expertise are all equally important. Emerging 6G wireless communications systems and mm-wave radar applications call for accelerated developments in this area. In particular, power consumption and latency requirements may require the implementation of optimized feature extraction methods in mixed-signal ICs closer to the antennas. The goal of this workshop is to bring together a set of active researchers to share their vision and expertise on these topics in order to bring a cross-disciplinary awareness and understanding among RFIC, AI, and systems communities. The speakers span academic and industrial research institutions from across the globe and the presentations will cover both wireless communications and radar.

Technical Papers
Abstract
WSL-1: AI/ML Empowered High-Order Modulations for 6G High Capacity Communications
Caleb Lo
Caleb Lo, Samsung
Samsung
Abstract
WSL-2: ML for Rapid Network Reconfiguration: Radar Detection using Open RAN and Multimodal Fusion for Vehicular mmWave Beamforming
Kaushik Chowdhury
Kaushik Chowdhury, Northeastern University
Northeastern University
Abstract
WSL-3: Machine-Learning Physical-Layer Receivers for Future 6G Networks
Mikko Valkama
Mikko Valkama, Tampere University of Technology
Tampere University of Technology
Abstract
WSL-4: Neural Networks and Dictionary Learning for Compressive, Phase-less, mm-Wave Beam Alignment
Danijela Cabric
Danijela Cabric, Univ. of California, Los Angeles
Univ. of California, Los Angeles
Abstract
WSL-5: Multi-Modal Sensing Front-Ends Using Wireless Above 100GHz and Lidar
James F. Buckwalter
James F. Buckwalter, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara
Abstract
WSL-6: Adaptive Analog Feature Extraction: Algorithm and Hardware Primitives
Saibal Mukhopadhyay
Saibal Mukhopadhyay, Georgia Tech
Georgia Tech
Abstract
WSL-7: High-Resolution mm-Wave Imaging and Detection for Self-Driving Cars
Jungfeng Guan, Haitham Al-Hassanieh
Jungfeng Guan, EPFL
EPFL, EPFL
Abstract
WSL-8: Concealed Object Detection with 3D Radar and DNN-Based Feature Extraction
Asaf Tzadok
Asaf Tzadok, IBM T.J. Watson Research Center
IBM T.J. Watson Research Center
Abstract
WSL-9: Deep mm-Wave Gait Analysis: Challenges and Opportunities
Amin Arbabian
Amin Arbabian, Stanford Univ.
Stanford Univ.
Abstract
WSL-10: Machine-Learning Application in Surveillance and Infrastructure Radars — Small Target Detection and Identification of Vulnerable Road Users
Simon Wagner
Simon Wagner, Fraunhofer FHR
Fraunhofer FHR
IMS/RFIC
Bahar Jalali Farahani, Mahdi Parvizi, Salvatore Finocchiaro, Ko-Tao Lee
Cisco, Qorvo
Location
151AB
Abstract

As the Moore’s law is coming to an end, separating large systems into smaller chips based on their functionality is not only a cost-benefit solution but it allows the complex system to expand beyond theoretical size limits. Although chiplet technology has been around for many years, it has not been till the rise of the AI supercomputers and the accompanied unprecedented computational demand that put the spotlight on SiPs (System in Package). There are different aspects to the design of chiplets including the packaging, the high-speed chip-to-chip interconnect and the interoperability and standardization which allow the SiP built by the combination of chips from different vendors. There are multiple benefits to the chiplet-based architectures. Breaking down the large complex systems into smaller chips based on their functionality means better yields and lower cost due to the lower probability of manufacturing defects. Cost reduction can also come with customizing the process technology for each chiplet (eg using advanced nodes for GPUs and CPUs and less expensive technologies for memories and analog interfaces). Design upgrades can also be done on certain functional blocks without the need for redesigning the whole system. To take full advantage of chiplet-based architectures, the D2D (die-to-die) interface needs to be standardized. The interoperability allows the developer to use multiple vendors. In terms of the packaging, development of 3DHI (3D Heterogeneous Integration) that enables stacking up separately manufactured components, is the perfect technology choice for chiplet-based architectures. Additionally, the ever-increasing demand for high-throughput communication links and high-resolution radar sensors is driving the development of future wireless systems at higher operating frequencies. In order to support multiple functionality, the flexibility requested to those systems, is driving the adoption of large phased array antennas. Heterogeneous technologies and vertical 3D integration will play a vital role in enhancing the performance and functional density, along with reducing the size and costs, of such RF systems. In addition to the already mentioned standardization, both on the digital and RF side, 3DHI will pose a new set of technology (processes and substrates), design (MMICS, RFIC, analog, power management, passives), packaging and thermal challenges. This workshop will address some of the challenges mentioned above both from the digital and RF point of view, combining commercial and defense perspectives with state-of-the-art research in the field. Experts from industry and academia that are at the frontline of these developments are invited to address these issues and inform the audience about the latest advances in this field.

Technical Papers
Abstract
WSM-1: Chiplets’ Central Role in Connectivity and AI Everywhere
Tony Chan Carusone
Tony Chan Carusone, Univ. of Toronto
Univ. of Toronto
Abstract
WSM-2: Chiplet Interconnect Solutions
Syrus Ziai
Syrus Ziai, Eliyan
Eliyan
Abstract
WSM-3: Package-to-Package Scale-Out Interconnect Solutions Based on In-Package Optical I/O
Miloš Popović
Miloš Popović, Ayar Labs
Ayar Labs
Abstract
WSM-4: Die-to-Die Interconnect Based on Micro-LED Arrays
Bardia Pezeshki
Bardia Pezeshki, Avicena
Avicena
Abstract
WSM-5: Vertical Stacking with Si-Cored Substrates
Steven Verhaverbeke
Steven Verhaverbeke, Applied Materials
Applied Materials
Abstract
WSM-6: Glass-Based Stitch-Chip Technologies and Advanced Packaging for mm-Wave HI
Muhannad S. Bakir
Muhannad S. Bakir, Georgia Tech
Georgia Tech
Abstract
WSM-7: Building >100GHz Phased Array Systems using Standard 3D Integration Technologies
Gabriel M. Rebeiz
Gabriel M. Rebeiz, Univ. of California, San Diego
Univ. of California, San Diego
Abstract
WSM-8: 3D Integration of ICs and Antennas for Ubiquitous mm-Wave Arrays
Arun Natarajan
Arun Natarajan, Oregon State Univ.
Oregon State Univ.
Abstract
WSM-9: Thermal Management for 3DHI and Advanced Packaging
Robert Pearson
Robert Pearson, Lockheed Martin
Lockheed Martin
Abstract
WSM-10: 3D Heterogenous Integration (3DHI) for Advanced Communications
Madhavan Swaminathan
Madhavan Swaminathan, Pennsylvania State Univ.
Pennsylvania State Univ.
RFIC
Vadim Issakov, Joseph C. Bardin
Technische Univ. Braunschweig, Google Quantum AI and UMass Amherst
Location
152AB
Abstract

Large-scale quantum computers promise to enable the solution to certain classes of problems for which no other efficient approaches are currently available. The realization of such a computer is hence a major open challenge that is being aggressively researched by academic and industrial teams across the globe. There are several types of competing qubit realizations, each offering different advantages. Yet, all of these realizations require some form of cryogenic cooling and most require RF electronics for control and potentially for readout (in several realizations the readout is optical). Moreover, integrating the control and/or readout electronics at an intermediate temperature stage within the cryostat is an attractive option. However, the circuits still need to fulfill stringent requirements on power consumption, spectral purity, noise budget etc, making their optimization challenging. As such, there is a growing opportunity for the RFIC community to influence this emerging field. In this full-day workshop the state-of-the-art in cryogenic RF circuits for various types of qubit realizations is reviewed. System considerations for various qubit modalities will be discussed, leading to the circuit-level specifications that drive the architectural considerations associated with control ICs targeting different qubit types. The talks will present different RF circuit design solutions for various types of qubits including silicon spin qubits, superconducting qubits, and trapped-ion qubits. The workshop features distinguished speakers from leading companies and academia, who will present their latest advances on cryogenic circuits for quantum computer applications. A brief concluding discussion will round-off the workshop to summarize the key learnings on the wide range of aspects presented during the day.

Technical Papers
Abstract
WSN-1: Control of Frequency Tunable Superconducting Processors
Juhwan Yoo
Juhwan Yoo, Google Quantum AI
Google Quantum AI
Abstract
WSN-2: Cryogenic Circuits for Superconducting Qubit-Based Quantum Computing
Daniel Friedman
Daniel Friedman, IBM T.J. Watson Research Center
IBM T.J. Watson Research Center
Abstract
WSN-3: Circuit Design for Large-Scale Quantum Controller SoC
Jae-Yoon Sim
Jae-Yoon Sim, POSTECH
POSTECH
Abstract
WSN-4: Cryogenic CMOS Mixed-Signal Circuits for Quantum Computer
Hiroki Ishikuro
Hiroki Ishikuro, Keio Univ.
Keio Univ.
Abstract
WSN-5: Circuit and System-Level Considerations Towards Scalable Trapped Ion Quantum Computer
Vadim Issakov
Vadim Issakov, Technische Univ. Braunschweig
Technische Univ. Braunschweig
Abstract
WSN-6: Multiplexed Qubit Control with Ultra-Low-Power, Base-Temperature Cryo-CMOS Multiplexer
Anton Potočnik
Anton Potočnik, IMEC
IMEC
Abstract
WSN-7: Cryo-CMOS Electrical Interfaces for Large-Scale Quantum Computers
Niels Fakkel
Niels Fakkel, Technische Universiteit Delft
Technische Universiteit Delft
Abstract
WSN-8: Cryo-CMOS Integrated Circuits Across a Silicon Qubit Quantum Computing Stack
Stefano Pellerano
Stefano Pellerano, Intel Corp.
Intel Corp.
RFIC
Debopriyo Chowdhury, Hyun-Chul Park
Broadcom, Samsung
Location
146A
Abstract

The rapid increase in data throughput in recent 5G (FR1 and FR2), Wi-Fi (6E and 7), and 6G (FR3 in the near future) requires high-efficiency, linear and wideband RF power amplifiers. However, it is extremely challenging to simultaneously enhance the linearity and efficiency of the power amplifier, especially for spectrally-efficient and wide modulation bandwidths (eg 320MHz for Wi-Fi 7, 100MHz for 5G FR1, and >400MHz for FR2). Higher order constellations like 4k-QAM for Wi-Fi 7, 256-QAM for FR2 make PA design a challenging task. This workshop will cover the “practical” and “most promising” linearity and efficiency improvement techniques for RF power amplifiers and transmitters. Several techniques like wideband envelope tracking, Doherty power amplifiers, digital transmitters, mm-wave power amplifiers etc, will be covered in a tutorial type fashion, with emphasis on practical aspects of the design.

Technical Papers
Abstract
WSO-1: Power Amplifiers for High Peak-to-Average-Ratio Signals — Architectures and Tradeoffs of Efficiency, Linearity and Bandwidth
Peter Asbeck
Peter Asbeck, Univ. of California, San Diego
Univ. of California, San Diego
Abstract
WSO-2: Design Techniques for Doherty Power Amplifiers to Enable Deep Backoff Efficiency Enhancement and Wide Modulation Bandwidth
Taiyun Chi
Taiyun Chi, Rice Univ.
Rice Univ.
Abstract
WSO-4: Design, Characterization and Linearization of Wideband Outphasing Power Amplifiers Operating within the Doherty-Chireix Continuum
Patrick Roblin
Patrick Roblin, The Ohio State University
The Ohio State University
Abstract
WSO-5: Efficiency Enhancement Techniques for Digital Power Amplifiers
Yun Yin
Yun Yin, Fudan Univ.
Fudan Univ.
Abstract
WSO-6: Efficient Wideband Digital Predistortion for Power Amplifier Linearization
Paul Draxler
Paul Draxler, MaXentric Technologies
MaXentric Technologies
Abstract
WSO-7: Highly Efficient and Linear mm-Wave Power Amplifiers for 5G FR2 Communication
Joonhoi Hur
Joonhoi Hur, Samsung
Samsung
Abstract
WSO-8: Recent Progress on Wideband Integrated SOI CMOS Power Amplifiers for Mobile and Wi-Fi Applications
Ayssar Serhan
Ayssar Serhan, CEA-LETI
CEA-LETI
RFIC
Didier Belot, Wanghua Wu, Hao Gao
STMicroelectronics, Samsung, Technische Universiteit Eindhoven
Location
146B
Abstract

With technological advancement, the spectrum of possibilities within the realms of communication and sensing is expanding astonishingly. One of the most exciting frontiers in this domain is the utilization of mm-wave and sub-THz frequencies, offering a gateway to revolutionary advances in wireless communication and sensing. The workshop collects the transformative capabilities of mm-Wave and Sub-THz technologies, which collectively span the frequency range from 30GHz to 300GHz. This previously underutilized spectrum is now at the forefront of technological breakthroughs. At the heart of this paradigm shift lies the broadband front-end, a critical component that enables the seamless harnessing of mm-Wave and Sub-THz frequencies for applications that were once considered futuristic. One of the central themes of the workshop is the advancement of high-frequency communication technologies. Explore the latest developments in ultra-fast data transfer, low-latency networks, and the mm-wave and Sub-THz spectrum integration in wireless systems. Witness how these innovations reshape the connectivity landscape, enabling applications like 6G, autonomous vehicles, smart cities, etc. The workshop takes participants on a journey through the diverse applications of mm-wave and Sub-THz sensing, from radar systems that can revolutionize wireless communication to high-resolution imaging techniques that can potentially transform human life.

Technical Papers
Abstract
WSP-1: 28GHz, 60GHz and 140GHz mm-Wave Phased Arrays for Communication and Sensing Systems: a Common Platform
Gabriel M. Rebeiz
Gabriel M. Rebeiz, Univ. of California, San Diego
Univ. of California, San Diego
Abstract
WSP-2: 6G Architectures and Technology Partitioning for Communication and Sensing
Yang Zhang, Giovanni Mangraviti
Yang Zhang, IMEC
IMEC, IMEC
Abstract
WSP-3: Energy Efficient Communication and Sensing Front-Ends Enabled by Innovative Frequency Generation Techniques
Jose-Luis Gonzalez-Jimenez
Jose-Luis Gonzalez-Jimenez, CEA-LETI
CEA-LETI
Abstract
WSP-4: Pioneering Ultrahigh-Speed Terahertz Communication for 6G: Challenges and Opportunities
Minoru Fujishima
Minoru Fujishima, Hiroshima Univ.
Hiroshima Univ.
Abstract
WSP-6: SiGe: BiCMOS Technology is Enabling D-Band Link with Active Phased Antenna Array
Andrea Pallotta, Didier Belot
Andrea Pallotta, STMicroelectronics, Didier Belot, STMicroelectronics
STMicroelectronics, STMicroelectronics
Abstract
WSP-7: The Impact of Joint Communication and Sensing to Radio Front-End
Rui Hou
Rui Hou, Ericsson
Ericsson
Abstract
WSP-8: The Evolution of Automotive Radar Circuits — from Gunn Diodes to CMOS SoCs
Christoph Wagner
Christoph Wagner, Silicon Austria Labs
Silicon Austria Labs
Abstract
WSP-9: Broadband mm-Wave Front-End Design Methodology for Radar and Wireless Communication
Hao Gao
Hao Gao, Technische Universiteit Eindhoven
Technische Universiteit Eindhoven
IMS/RFIC
Rocco Tam, Oren Eliezer, Jin Zhou, Kostas Doris
NXP Semiconductors, Samsung, MediaTek
Location
146C
Abstract

The reliance on digital beamforming and large arrays in mm-wave is increasing as communication and sensing systems migrate to higher frequency bands and occupy wider bandwidths. In this workshop experts in communications, automotive radar/sensing, antennas and silicon and packaging technologies will share their related experience and vision and discuss various challenges and solutions at the system, circuit, and technology levels.

Technical Papers
Abstract
WSQ-1: Re-Thinking the mm-Wave MIMO Radar Architecture for Future Automotive Radars
Kostas Doris
Kostas Doris, NXP Semiconductors
NXP Semiconductors
Abstract
WSQ-2: Integrated mm-Wave (IMMW) Wi-Fi
Carlos Cordeiro
Carlos Cordeiro, Intel
Intel
Abstract
WSQ-3: Design of Advanced mm-Wave Phased Array Modules
Bodhisatwa Sadhu
Bodhisatwa Sadhu, IBM T.J. Watson Research Center
IBM T.J. Watson Research Center
Abstract
WSQ-4: ICs and Transceivers for 100–300GHz Wireless (Comm and Sensing)
Mark Rodwell
Mark Rodwell, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara
Abstract
WSQ-5: True-Time-Delay Large Scale Array for Next-Generation Wireless
Subhanshu Gupta
Subhanshu Gupta, Washington State Univ.
Washington State Univ.
Abstract
WSQ-6: Emerging Devices and Heterogeneous Integration for Future mm-Wave Systems
Nadine Collaert
Nadine Collaert, IMEC
IMEC
Abstract
WSQ-7: Beamforming Challenges in 5G FR-2 Base Stations
Yuuichi Aoki
Yuuichi Aoki, Samsung
Samsung
Abstract
WSQ-8: Architecture, Design and Deployment Challenges of E-Band and D-Band Communication Systems
Shahriar Shahramian
Shahriar Shahramian, Nokia Bell Labs
Nokia Bell Labs
IMS/RFIC
Zeshan Ahmad, Matt Markel
Cambridge Terahertz, Spartan Radar
Location
204ABC
Abstract

Sensing modalities are enabling technologies for the ongoing revolution in autonomy. This is evident from the global sensor market that was valued at B in 2019 and is projected to reach over B by 2028. Camera, LiDAR, and RADAR dominate the autonomy field, and IR/thermal is now emerging as an important modality in that space. However, today none of the sensing modalities alone can solve the abundant challenges needed for robust, reliable, and trust-worthy autonomy in difficult environments. To that end, this workshop brings together a unique mix of top industry, academic, and regulatory body speakers to discuss these challenges, the current solutions, and what we can expect today’s research to bring for tomorrow. The speakers bring a breadth of expertise and experiences ranging from electronics to photonics, integrated systems to sensor fusion, and OEMs to regulators; this insight comes together in a workshop-concluding panel discussion that dives deep into key forces pushing us towards — and holding us back from — autonomy.

Technical Papers
Abstract
WSR-1: Brief Workshop Introduction
Zeshan Ahmad
Zeshan Ahmad, Cambridge Terahertz
Cambridge Terahertz
Abstract
WSR-2: Software Defined Radars with the Resolution of Lidar
Antonio Puglielli
Antonio Puglielli, Zendar
Zendar
Abstract
WSR-3: Navigating Frequencies — A Comprehensive Exploration of Radar Applications and Beyond
Francisco Salmeron
Francisco Salmeron, A4Radar
A4Radar
Abstract
WSR-4: Digital Radar for Convergence of Sensing and Communications
Jungah Lee
Jungah Lee, Aura Intelligent Systems
Aura Intelligent Systems
Abstract
WSR-5: Silicon Photonics for Solid-State LiDAR and Beyond
Jelena Notaros
Jelena Notaros, MIT
MIT
Abstract
WSR-6: From IoT (Internet-of-Things) to AoT (Autonomy-of-Things)
Sabbir Rangwala
Sabbir Rangwala, Patience Consulting
Patience Consulting
Abstract
WSR-7: Advanced Sensing for Autonomy
Abdullah Zaidi
Abdullah Zaidi, Rivian
Rivian
Abstract
WSR-8: Enhanced Pedestrian Safety with 3D Thermal Ranging using AI for ADAS/AV Applications
Chuck Gershman
Chuck Gershman, Owl Autonomous Imaging
Owl Autonomous Imaging
Abstract
WSR-9: How are AVs regulated?
Sam Loesche
Sam Loesche, Waabi
Waabi
Abstract
WSR-10: Panel Discussion
Matt Markel
Matt Markel, Spartan Radar
Spartan Radar

-

IMS/RFIC
Huizhen Jenny Qian, Jeffrey Walling, Austin Chen
Xidian Univ., Virginia Tech, Peraso, Inc.
Location
143ABC
Abstract

Advanced CMOS technologies enable direct bits-to-RF conversion, which provides higher energy-efficiency and more compact die area, especially for sub-7GHz. Meanwhile, such digital intensive transmitters, with highly reconfigurable nature are well adapted for multifunction and intelligent communication systems. When the operation bands extend to mm-wave to meet the increasing data streaming requirements of modern communication systems (eg 5G, 6G, etc), digital intensive transmitters also exhibit potential advantages compared to traditional Cartesian transmitters. This workshop discusses techniques of digital intensive transmitters operating from sub-7GHz to mm-wave with continuous evolution of higher output power, efficiency, data-rate, and multi-functions such as distortion self-calibration, multi-band, multi-mode, etc.

Technical Papers
Abstract
WSG-1: Highly Efficient, Wideband, Frequency-Agile Digital Transmitters
Masoud Babaie, Marco Spirito, Leo de Vreede, Morteza S. Alavi
Masoud Babaie, Technische Universiteit Delft
Technische Universiteit Delft, Technische Universiteit Delft, Technische Universiteit Delft, Technische Universiteit Delft
Abstract
WSG-2: Data-Rate Enhancement Techniques for Digital Transmitters
Huizhen Jenny Qian
Huizhen Jenny Qian, Xidian Univ.
Xidian Univ.
Abstract
WSG-3: Versatile RF-DACs, from RF-to-mm-Wave, to Enable the Sixth Generation of Wireless Communication
Jeffrey Walling
Jeffrey Walling, Virginia Tech
Virginia Tech
Abstract
WSG-4: Design of Digital-Intensive Wireless Transmitters
Yun Yin
Yun Yin, Fudan Univ.
Fudan Univ.
Abstract
WSG-5: Road to Digitally Intensive Transmitter Architectures at mm-Waves
Khaled Khalaf
Khaled Khalaf, Pharrowtech
Pharrowtech
RFIC
Joseph Cali, Bichoy Bahr, Oren Eliezer
Raytheon, Texas Instruments, Samsung
Location
147AB
Abstract

Are you a student or a professional researcher seeking insights into the process of productizing ideas? Perhaps you are an experienced designer keen on understanding how fellow professionals have surmounted challenges during product development. If so, this workshop is tailored for you! Industry experts representing high-volume commercial integrated circuit (IC) companies, IP developers, aerospace, and defense sectors will share their experiences of navigating the journey from conceptualization to fielded product. Engaging discussions will encompass a diverse array of topics, spanning high-speed analog to digital converters, digital to analog converters, mm-wave packaging, multi-antenna beam steering calibration, RF front-ends and the benefits of RF/packaging co-simulation. During the developmental phase of prototypes, constraints related to budgets and schedules often hinder thorough validation, verification, and testing procedures. Consequently, this limitation can lead to the emergence of latent defects that remain undetected until later stages of productization. In these scenarios, research teams and start-ups may be primarily focused on core innovations and transformative concepts, only to encounter obstacles when the company aims to expedite the implementation of these ideas. For instance, in startup environments lacking dedicated facilities for environmental testing, issues like low-temperature oscillations (which are unobservable during simulations) may go unnoticed until far too late. The instances discussed within this workshop serve as valuable examples that can form the basis of a comprehensive checklist, enabling a smoother transition from the prototype phase to the final product. We hope this workshop could potentially prevent the need for extensive reiterations, saving both time and resources for you and your colleagues.

Technical Papers
Abstract
WSI-1: mm-Wave LGA and BGA Package Design and Assembly Challenges
Joel Dobler, Prabir Saha, Sukhjinder S. Deo, Vincent Bu, Eamon Nash
Eamon Nash, Analog Devices
Analog Devices, Analog Devices, Analog Devices, Analog Devices, Analog Devices
Abstract
WSI-2: mm-Wave and RF Data Converter Design Challenges
Farhan Adil, Joseph Cali
Farhan Adil, Raytheon
Raytheon, Raytheon
Abstract
WSI-3: High Frequency IC/Package Co-Design using Integrated Toolsets
Paul Mosinkskis
Paul Mosinkskis, Cadence
Cadence
Abstract
WSI-4: Transitioning RF SiGe Designs from R&D into Production for Defense Systems
Gregory M. Flewelling
Gregory M. Flewelling, BAE Systems
BAE Systems
Abstract
WSI-5: Phased Array Calibration: Overcoming Productization Challenges in CMOS Analog Beamforming Arrays
Viduneth Ariyarathna, Oren Eliezer
Oren Eliezer, Samsung
Samsung, Samsung
IMS/RFIC
Subhanshu Gupta, Antoine Frappé, Najme Ebrahimi
Washington State Univ., IEMN (UMR 8520), Univ. of Florida
Location
145AB
Abstract

With global networking data traffic predicted to reach petabytes in the next few years, mm-wave wireless communications enabled by silicon-based phased arrays is poised as a game-changer for new infrastructure applications. Emergence of untethered space constellations such as low-earth orbit (LEO) satellite communications approximately lying between 500km to 800km altitude such as Amazon Kuiper (590–630km), SpaceX Starlink (550–750km), OneWeb (1200km), and Telesat Lightspeed (1015–1325km) will further benefit global connectivity. By utilizing the fallow spectrum at mm-wave, it is expected to provide gigabits-per-second data rates to multiple users including under-served and remote areas. While planar mm-Wave phased arrays have cemented their position in communication systems, the future of satellite constellation hosting thousands of antenna elements is dependent on the choice of frequency, application, field-of-view, and form factor. Conformal phased arrays, which encompass mechanically flexible, foldable, or stretchable arrays, are one of the promising new frontiers of array development. Conformal antennas provides multiple degrees of freedom to the scan angle that is typically limited by antenna aperture. Recent works have demonstrated new viable research directions at the antenna-RF interface with the adaptive control that will be presented in this workshop.

Technical Papers
Abstract
WSK-1: Shape-Morphing Origami-Based Microwave Arrays for Reconfigurable Computational Imaging
Kaushik Sengupta
Kaushik Sengupta, Princeton Univ.
Princeton Univ.
Abstract
WSK-2: A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
Atom Watanabe
Atom Watanabe, IBM T.J. Watson Research Center
IBM T.J. Watson Research Center
Abstract
WSK-3: Additively Manufactured Flexible Tile-Based Massively Scalable Phased Arrays for 5G+ Enabled Smart Skins and Reconfigurable Intelligent Surfaces
Manos M. Tentzeris
Manos M. Tentzeris, Georgia Tech
Georgia Tech
Abstract
WSK-4: Large-Aperture Flexible Phased Array with CMOS Beamformer for Small Satellites
Kenichi Okada
Kenichi Okada, Tokyo Tech
Tokyo Tech