Workshops

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Mahdi Parvizi, Bahar Jalali Farahani
Cisco
Location
23ABC
Abstract
This workshop presents the similarities and differences between wireless and wireline/optical communication along with circuit design innovations that enable the next generation of these systems. There are undeniable similarities between the systems and electronic building blocks in wireline/optical and wireless transceivers. In this event, first commonalities and differences of wireline/optical system versus an advanced wireless link will be discussed, next advanced modulation schemes to close the gap with Shannon limit in wireline links will be reviewed. Next, advanced circuit design techniques for wireless and optical transmitters, which is power amplifiers and modulator drivers will be presented. The last talk covers the optical and wireless receiver front-ends where novel circuit design techniques for low-noise, low-power LNAs and TIAs will be highlighted.
Technical Papers
Abstract
WSB-1: Wireless-Inspired Wireline Communication Systems
James F. Buckwalter
James F. Buckwalter, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara
(08:00 - 11:50)
Materials
workshops-2023/WSB_1.pdf
Abstract
WSB-2: How Close are we to the Shannon Limit? The Role of Modulation Schemes to Close the Gap
Ali Sheikholeslami
Ali Sheikholeslami, Univ. of Toronto
Univ. of Toronto
(08:00 - 11:50)
Materials
workshops-2023/WSB_2.pdf
Abstract
WSB-3: Energy Efficiency and Linearity Improvements for Next Generation of Power Amplifiers and Modulator Drivers
Munehiko Nagatani
Munehiko Nagatani, NTT
NTT
(08:00 - 11:50)
Materials
workshops-2023/WSB_3.pdf
Abstract
WSB-4: Design of Low-Power, Low-Noise Receiver Front-Ends: Wireless vs. Wireline
Behzad Razavi
Behzad Razavi, University of California at Los Angeles
University of California at Los Angeles
(08:00 - 11:50)
Materials
workshops-2023/WSB_4.pdf
Vadim Issakov, Ruonan Han
Technische Univ. Braunschweig, MIT
Location
29AB
Abstract
Integration of passive electromagnetic structures and particularly integration of antennas on silicon becomes feasible at frequencies above 100GHz due to wavelength-related size reduction. The goal of this workshop is to give inspiration on the various novel circuit techniques relying on conflation of passive and active devices. Furthermore, this workshop discusses potential emerging applications towards THz and presents the latest developments on integrated EM devices and co-design with active circuits at high mm-wave frequencies. We discuss how to realize passive on-chip components, such as transformers, coupler baluns and antennas and how to combine them with the active circuitry. Furhermore, novel techniques involving antennas to realize certain functions are discussed. Antennas can be co-designed synergistically with active circuits to realize novel hybrid antenna-electronics with “on-radiator” and near-field functions, such as power combining/splitting, impedance scaling/filtering, active load modulation, noise cancellation and reconfigurability. A significant research challenge in hybrid active circuit/electromagnetic electronics is the application of suitable multi-physics simulation tools and co-design/co-optimization methodologies. This requires 3D full-physics solutions for electromagnetic simulation. Several world renowned speakers will provide an overview on the techniques, applications and the practical design considerations on realization of these approaches. In this half-day workshop we will discuss emerging techniques for on-chip mm-wave active/passive circuit co-design and applications of these new techniques. Distinguished speakers from leading companies and academia will present a wide range of topics to cover various aspects of EM-circuit co-design. A brief concluding discussion will round-off the workshop to summarize the key learnings of aspects presented during the day.
Technical Papers
Abstract
WSD-1: Co-Design Techniques of mm-Wave Circuits with Electromagnetics and Radiation
Sensen Li, Hua Wang
Sensen Li, Univ. of Texas at Austin
Univ. of Texas at Austin, ETH Zürich
(08:00 - 11:50)
Materials
workshops-2022/WSD_1.pdf
Abstract
WSD-2: EM-to-Information Approach for Reconfigurable THz Sensors and Surfaces
Kaushik Sengupta
Kaushik Sengupta, Princeton Univ.
Princeton Univ.
(08:00 - 11:50)
Materials
workshops-2023/WSD_2.pdf
Abstract
WSD-3: Embedding Networks and Automation to Enhance Power Gain and Compression in Amplifiers Above 100GHz
James F. Buckwalter
James F. Buckwalter, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara
(08:00 - 11:50)
Materials
workshops-2023/WSD_3.pdf
Abstract
WSD-4: Advanced Circuit Techniques Using Integrated Transformers
Andrea Bevilacqua
Andrea Bevilacqua, Università di Padova
Università di Padova
(08:00 - 11:50)
Materials
workshops-2023/WSD_4.pdf
Abstract
WSD-5: Co-Design and Coupling Effect in Highly Integrated mm-Wave Systems on Chip
Fabio Padovan
Fabio Padovan, Infineon Technologies
Infineon Technologies
(08:00 - 11:50)
Materials
workshops-2023/WSD_5.pdf
Ryan Cadwell, Connor Devitt
Corning, Purdue Univ.
Location
32AB
Abstract
Engineered surfaces and materials have shown interesting qualities in electromagnetic propagation that may be useful in various applications. Characteristics such as reflection, transmission, and absorption can be designed by control of properties including metal and dielectric geometry, material permittivity or refractive index, and consideration of phenomena such as surface-waves. New or reconsidered electromagnetic design perspectives, newly enabled geometries from additive manufacturing approaches, and new material compositions including flexible or tunable (such as phase-change) materials, present emerging opportunities for investigation. These areas of exploration may yield advances in communication and sensing ranging from microwave to optical frequencies — including potential applications in 5G and 6G technology.
Technical Papers
Abstract
WSN-1: Topology Optimization for Volumetric Meta-Optics
Conner Ballew, Goutam Chattopadhyay
Conner Ballew, Jet Propulsion Lab
Jet Propulsion Lab, Jet Propulsion Lab
(08:00 - 11:50)
Materials
workshops-2023/WSN_1.pdf
Abstract
WSN-2: Metasurface Modeling for Next Generation Wireless Communications
Viacheslav Ivanov, Andrey Kobyakov
Viacheslav Ivanov, Corning
Corning, Corning
(08:00 - 11:50)
Materials
workshops-2023/WSN_2.pdf
Abstract
WSN-3: 4D mm-Wave Metasurfaces Combining Morphing and Additive Manufacturing Techniques
Manos Tentzeris
Manos Tentzeris, Georgia Tech
Georgia Tech
(08:00 - 11:50)
Materials
workshops-2023/WSN_3.pdf
Abstract
WSN-4: Phase Change Material (PCM) Technology for Microwave and mm-Wave Applications
Raafat R. Mansour
Raafat R. Mansour, Univ. of Waterloo
Univ. of Waterloo
(08:00 - 11:50)
Materials
workshops-2023/WSN_4.pdf

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Didier Belot, Hao Gao, Pierre Busson
CEA-LETI, Technische Universiteit Eindhoven, STMicroelectronics
Location
31AB
Abstract
Wireless systems with small RF bandwidths, high-order modulations, and advanced signal-processing techniques have reached a saturation point. They run into spectrum saturation and interference troubles under the sub-6GHz frequency band. International Telecommunication Union (ITU) announced the opening of 275GHz to 450GHz for super high data-rate communication applications. 5G is becoming a reality worldwide, and 6G is in a championship worldwide. The complete paradigm change of this new generation implies the evolution from today, and one of the elements to be defined will be the revolution in the transceiver functions: The data-rate is targeted beyond 100Gbps, and the carrier frequency to support such data transfer will be in the combination of mm-wave and sub-THz. In the 6G, the mm-wave/sub-THz front-end has challenges on bandwidth, power consumption, antenna coupling, array integration, etc. In this workshop, we also dedicate attention to silicon-based building blocks’ present realizations targeting 5G to 6G evolution.
Technical Papers
Abstract
WSC-1: Revolutionary Ideas for 6G (and Next-G) Transceivers Overcoming Fundamental Limitations of Conventional Architectures
Payam Heydari
Payam Heydari, Univ. of California, Irvine
Univ. of California, Irvine
(08:00 - 17:20)
Materials
workshops-2023/WSC_1.pdf
Abstract
WSC-2: 140GHz Two-Dimensional 8×8 Phased Arrays for 6G MIMO Systems
Amr Ahmed, Gabriel M. Rebeiz
Amr Ahmed, Univ. of California, San Diego
Univ. of California, San Diego, Univ. of California, San Diego
(08:00 - 17:20)
Materials
workshops-2023/WSC_2.pdf
Abstract
WSC-3: A Channel Aggregation Architecture TX-RX in D-Band with 84Gbps Data-Rate in RFSOI Process
Jose Luis Gonzalez-Jimenez
Jose Luis Gonzalez-Jimenez, CEA-LETI
CEA-LETI
(08:00 - 17:20)
Materials
workshops-2023/WSC_3.pdf
Abstract
WSC-4: Sub-THz Base Station Radio Architecture
Rui Hou
Rui Hou, Ericsson
Ericsson
(08:00 - 17:20)
Materials
workshops-2023/WSC_4.pdf
Abstract
WSC-5: THz AI-AI: a road map to ultra-wideband THz communications enabled by AI
Cel Thys, Sofie Pollin
Cel Thys, KU Leuven
KU Leuven, KU Leuven
(08:00 - 17:20)
Materials
workshops-2023/WSC_5.pdf
Abstract
WSC-6: Silicon-Based mm-Wave Broadband RF Front-End
Hao Gao
Hao Gao, Technische Universiteit Eindhoven
Technische Universiteit Eindhoven
(08:00 - 17:20)
Materials
workshops-2023/WSC_6.pdf
Duane Howard, Fabio Sebastiano, Kevin Tien
Amazon, Technische Universiteit Delft, IBM Quantum
Location
25ABC
Abstract
The continued prevalence of microwave system techniques for interacting with superconducting transmon qubits and spin qubits have driven a resurgence of interest in cryogenic circuit and systems for quantum computing. Moreover, quantum computing applications demand low power, high scalability, and high precision in control signal generation and readout signal processing, which has led to several recent demonstrations of innovative system building blocks, as well as end-to-end control and readout chains. In this workshop, we introduce the state-of-the-art in system architectures for qubit control and readout, and then focus on the recent developments in technologies related to qubit readout. We will examine current building blocks found in high-end systems, then look at the next generation of high performance cryo-LNA technologies. Finally, we conclude with deep dives into full readout chain construction, and test and metrology for this very challenging ecosystem of components.
Technical Papers
Abstract
WSF-1: Workshop Introduction
Duane Howard, Fabio Sebastiano, Kevin Tien
Kevin Tien, IBM Quantum, Duane Howard, Amazon, Fabio Sebastiano, Technische Universiteit Delft
Amazon, Technische Universiteit Delft, IBM Quantum
(08:00 - 17:20)
Materials
workshops-2023/WSF_1.pdf
Abstract
WSF-2: Probing Spin Qubits with Radiofrequency Reflectometry
M. Fernando González-Zalba
M. Fernando González-Zalba, Quantum Motion
Quantum Motion
(08:00 - 17:20)
Materials
workshops-2023/WSF_2.pdf
Abstract
WSF-3: Readout Chains for Transmon Qubits in Production Scaled Quantum Computers
David Lokken-Toyli
David Lokken-Toyli, IBM Quantum
IBM Quantum
(08:00 - 17:20)
Materials
workshops-2022/WSF_3.pdf
Abstract
WSF-4: State-of-the-Art Cryo-LNAs in III-V Technology for Scalable Quantum Computing
Arsalan Pourkabirian
Arsalan Pourkabirian, Low Noise Factory
Low Noise Factory
(08:00 - 17:20)
Materials
workshops-2023/WSF_4.pdf
Abstract
WSF-5: Scaling Considerations for Superconducting Quantum-Limited Amplifiers
José Aumentado
José Aumentado, NIST
NIST
(08:00 - 17:20)
Materials
workshops-2023/WSF_5.pdf
Abstract
WSF-6: SiGe and CMOS Cryogenic Amplifiers for Superconducting Qubit Readout
Joseph Bardin
Joseph Bardin, UMass Amherst
UMass Amherst
(08:00 - 17:20)
Materials
workshops-2023/WSF_6.pdf
Abstract
WSF-7: Wideband-Noise-Matching Considerations for Cryo-CMOS LNAs
Leonid Belostotski
Leonid Belostotski, Univ. of Calgary
Univ. of Calgary
(08:00 - 17:20)
Materials
workshops-2023/WSF_7.pdf
Abstract
WSF-8: Panel Discussion: the Ecosystem for Cryo-LNAs — What’s Next?
(08:00 - 17:20)
Materials
workshops-2022/WSF_8.pdf
Abstract
WSF-9: A Cryogenic CMOS RF Receiver for Multiple Spin Qubit Readout: From Specifications to Implementation and Qubit Testing
Masoud Babaie
Masoud Babaie, Technische Universiteit Delft
Technische Universiteit Delft
(08:00 - 17:20)
Materials
workshops-2023/WSF_9.pdf
Abstract
WSF-10: Scaling Measurement Methodologies Using Cryogenic TaaS Framework for Higher Quality cryo-LNAs and Reliable Qubit Readout Chains
Brandon Boiko
Brandon Boiko, FormFactor
FormFactor
(08:00 - 17:20)
Materials
workshops-2023/WSF_10.pdf
Debopriyo Chowdhury, Jennifer Kitchen
Broadcom, Arizona State Univ.
Location
33ABC
Abstract
The RF Power Amplifier (PA) is a performance bottleneck of most RF wireless transmit systems and a critical design component of any RF system. Fundamental PA design knowledge and realization expertise are highly desired and regarded skills in the RF community. With their numerous process technologies, architectures, and implementation “tricks”, the design of RF PAs may quickly become overwhelming. Moreover, the knowledge is typically acquired through years of design experience and multiple failed design attempts. This workshop jump-starts you into the world of PA design by walking you through the various aspects of RF PA design, starting from the basics and then introducing the most popular forms of advanced PA architectures. The various tutorials within the workshop will categorize the different PA design methodologies to give you a better understanding behind their motivations. Experts from industry and academia will also summarize the strengths of various process technologies, enabling you to better select processes depending on your target application. Finally, PA designers with decades of experience will provide insight into successfully implementing RF PAs, including practical design aspects (“tricks of the trade”), accounting for PA memory and thermal effects (the big “gotcha”), and effectively simulating PA designs to closely predict performance. This workshop will provide design insights not obtained from textbook reading, thus benefiting those who are new to the RF PA design field and seasoned warriors who would like a rapid refresher.
Technical Papers
Abstract
WSG-1: Introduction to the Workshop
Jennifer Kitchen, Debopriyo Chowdhury
Jennifer Kitchen, Arizona State Univ., Debopriyo Chowdhury, Broadcom
Arizona State Univ., Broadcom
(08:00 - 17:20)
Materials
workshops-2023/WSG_1.pdf
Abstract
WSG-2: Foundations of RF Power Amplifiers
Joseph Staudinger
Joseph Staudinger, NXP Semiconductors
NXP Semiconductors
(08:00 - 17:20)
Materials
workshops-2023/WSG_2.pdf
Abstract
WSG-3: Comparison of Efficiency Enhancement Techniques for RF PAs
Matthew Heins
Matthew Heins, Univ. of Texas at Dallas
Univ. of Texas at Dallas
(08:00 - 17:20)
Materials
workshops-2023/WSG_3.pdf
Abstract
WSG-4: Digital Power Amplifiers and Transmitters Based on RF Digital-to-Analog Converters
Sangmin Yoo
Sangmin Yoo, Samsung
Samsung
(08:00 - 17:20)
Materials
workshops-2023/WSG_4.pdf
Abstract
WSG-5: Envelope Tracking Systems for RF PA Efficiency Enhancement
Peter Asbeck
Peter Asbeck, Univ. of California, San Diego
Univ. of California, San Diego
(08:00 - 17:20)
Materials
workshops-2023/WSG_5.pdf
Abstract
WSG-6: The Promise of Load Modulation and Doherty Power Amplifiers
Taiyun Chi, Hua Wang
Taiyun Chi, Rice Univ.
Rice Univ., ETH Zürich
(08:00 - 17:20)
Materials
workshops-2022/WSG_6.pdf
Abstract
WSG-7: CMOS vs SOI vs GaAs — What is the Best Technology for RF and mm-Wave PA Design?
Ali M. Darwish
Ali M. Darwish, Army Research Laboratory
Army Research Laboratory
(08:00 - 17:20)
Materials
workshops-2023/WSG_7.pdf
Abstract
WSG-8: Practical Challenges in Integrated CMOS Power Amplifier Design
Ali Afsahi
Ali Afsahi, Broadcom Corp.
Broadcom Corp.
(08:00 - 17:20)
Materials
workshops-2023/WSG_8.pdf
Abstract
WSG-9: Concluding Remarks
Jennifer Kitchen, Debopriyo Chowdhury
Jennifer Kitchen, Arizona State Univ., Debopriyo Chowdhury, Broadcom
Arizona State Univ., Broadcom
(08:00 - 17:20)
Gernot Hueber, Shahriar Shahramian
United Micro Technology, Nokia Bell Labs
Location
29D
Abstract
Wireless networks have enabled socio-economic growth worldwide and are expected to further advance to foster new applications such as autonomous vehicles, virtual/augmented-reality, and smart cities. Due to limitations of further growth in capacity in the sub-6GHz spectrum, mm-wave and sub-Thz frequencies are gaining an important role in the emerging 6G and the communication-on-the-move applications. In 6G, RF/mm-wave/sub-THz front-ends have challenges on bandwidth, power consumption, antenna coupling, array integration, etc. We examine the integration technologies and packaging challenges. 6G covering from sub-10GHz to high frequency as well the complexity of systems is increasing, which demands implementations in the right technology (CMOS, SiGe, …) and integration of chipsets heterogeneously from basedband, transceiver to the antenna. The heterogeneous integration will be important with the multitude of frequency bands covered, eg 7–14GHz bands up to frequencies >100GHz.
Technical Papers
Abstract
WSH-1: The Challenges of Integration in 6G Transceiver Systems
Gernot Hueber, Shahriar Shahramian
Gernot Hueber, United Micro Technology, Shahriar Shahramian, Nokia Bell Labs
United Micro Technology, Nokia Bell Labs
(08:00 - 17:20)
Materials
workshops-2023/WSH_1.pdf
Abstract
WSH-2: Toward 6G: From New Hardware Design to Wireless Semantic and Goal-Oriented Communication Paradigms
Emilio Calvanese-Strinati
Emilio Calvanese-Strinati, CEA-LETI
CEA-LETI
(08:00 - 17:20)
Materials
workshops-2023/WSH_2.pdf
Abstract
WSH-3: 6G from System Architectures Multi-Band Transceivers and Integration
Harish Viswanathan
Harish Viswanathan, Nokia Bell Labs
Nokia Bell Labs
(08:00 - 17:20)
Materials
workshops-2023/WSH_3.pdf
Abstract
WSH-4: Antenna Integration and Packaging Challenges for 6G mm-Wave Phased Arrays
Parisa Aghdam
Parisa Aghdam, Ericsson
Ericsson
(08:00 - 17:20)
Abstract
WSH-5: THz CMOS Phased Array Transceiver for 6G
Kenichi Okada
Kenichi Okada, Tokyo Tech
Tokyo Tech
(08:00 - 17:20)
Materials
workshops-2023/WSH_5.pdf
Abstract
WSH-6: Advances in Packaging and Integration for 6G Phased Array Transceiver Systems
Hsin-Chia Lu
Hsin-Chia Lu, National Taiwan Univ.
National Taiwan Univ.
(08:00 - 17:20)
Materials
workshops-2023/WSH_6.pdf
Abstract
WSH-7: Architectures, Algorithms, and Vertical Integration for Advanced Beamforming in Next Generation 5G and 6G Systems
Alberto Valdes-Garcia
Alberto Valdes-Garcia, IBM T.J. Watson Research Center
IBM T.J. Watson Research Center
(08:00 - 17:20)
Materials
workshops-2023/WSH_7.pdf
Abstract
WSH-8: Architectures, Technology Partitioning, and Challenges for 6G Beamformers
Giuseppe Gramegna
Giuseppe Gramegna, IMEC
IMEC
(08:00 - 17:20)
Materials
workshops-2023/WSH_8.pdf
Abstract
WSH-9: Techniques for MIMO and Extreme Data-Rates at mm-Wave/Sub-THz
Harish Krishnaswamy
Harish Krishnaswamy, Columbia Univ.
Columbia Univ.
(08:00 - 17:20)
Materials
workshops-2023/WSH_9.pdf
Yahya Tousi, Vito Giannini
Univ. of Minnesota, Uhnder
Location
30AB
Abstract
The unique sensing capabilities of mm-wave radars bolstered by modern nano-scale silicon technology and advanced image processing has created the opportunity for integrated radar technology to create substantially improved image perception at a considerably lower size and cost compared to the radars of the 20th century. There is a growing effort in both academia and industry to bring this technology to fruition. In this workshop, we overview the existing opportunities in this field and the challenges that need to be overcome in order to standardize and commercialize integrated radar technology. The workshop brings together a complementary mix of top academic and industry speakers with a breadth of expertise and experience in this field ranging from the fundamental aspects of circuit design, system integration to sensor fusion, product design and testing.
Technical Papers
Abstract
WSI-1: Introduction to the mm-Wave Radar Workshop
Yahya Tousi
Yahya Tousi, Univ. of Minnesota
Univ. of Minnesota
(08:00 - 17:20)
Materials
workshops-2023/WSI_1.pdf
Abstract
WSI-2: Automotive Radar — Applications and Technology Trends
Juergen Hasch
Juergen Hasch, Robert Bosch
Robert Bosch
(08:00 - 17:20)
Materials
workshops-2023/WSI_2.pdf
Abstract
WSI-3: Imaging Radars at Scale — From Automotive to Security Applications
Sherif Ahmed
Sherif Ahmed, Stanford Univ.
Stanford Univ.
(08:00 - 17:20)
Materials
workshops-2023/WSI_3.pdf
Abstract
WSI-4: High-Performance and Low-Power mm-Wave Radar Systems: Requirements and Challenges
Krishnanshu Dandu
Krishnanshu Dandu, Texas Instruments
Texas Instruments
(08:00 - 17:20)
Materials
workshops-2023/WSI_4.pdf
Abstract
WSI-5: Phased-Array-based Real-Time 3D Radar for AI-Based Event Classification
Alberto Valdes-Garcia
Alberto Valdes-Garcia, IBM T.J. Watson Research Center
IBM T.J. Watson Research Center
(08:00 - 17:20)
Materials
workshops-2023/WSI_5.pdf
Abstract
WSI-6: A Digital-Perception Radar Platform for Automotive Safety
James Maligeorgos
James Maligeorgos, Uhnder
Uhnder
(08:00 - 17:20)
Materials
workshops-2023/WSI_6.pdf
Abstract
WSI-7: 140GHz Automotive Radar — Sense and Nonsense
Ilja Ocket
Ilja Ocket, IMEC
IMEC
(08:00 - 17:20)
Materials
workshops-2023/WSI_7.pdf
Abstract
WSI-8: THz and mm-Wave High-Resolution Imaging and Radar Sensing for Low-Power and Short-Range Applications
Omeed Momeni
Omeed Momeni, Univ. of California, Davis
Univ. of California, Davis
(08:00 - 17:20)
Materials
workshops-2023/WSI_8.pdf
Abstract
WSI-9: Soli: Radar for Intelligent Human-Computer Interactions
Jaime Lien
Jaime Lien, Google
Google
(08:00 - 17:20)
Materials
workshops-2023/WSI_9.pdf
Steven Callender, Sungwon Chung
Intel, Neuralink
Location
30DE
Abstract
There is no silver bullet power amplifier (PA) design that provides a one-size-fits-all solution for next-gen communication and sensing systems due to the diversity of applications and their associated PA specs (eg output power, linearity, bandwidth, and back-off efficiency). The goal of this workshop is to explore leading mm-wave and sub-THz applications and the associated PA specs for these systems. The applications of focus are massive MIMO and large-scale phased-arrays, sub-orbital satellite communication (SATCOM), and mm-wave radar. A balanced mix of both industry and academic perspectives will be provided, offering both a high-level familiarization of the application and associated specifications, along with deeper technical dives into PA design techniques in modern process nodes.
Technical Papers
Abstract
WSJ-1: Design of D-Band PAs in Bulk-CMOS and FinFET
Patrick Reynaert
Patrick Reynaert, KU Leuven
KU Leuven
(08:00 - 17:20)
Materials
workshops-2023/WSJ_1.pdf
Abstract
WSJ-2: Distributed Power Amplifiers Circuit Techniques for Wideband RF, Millimeter-Waves and Optical Wireline
Omar El-Aassar, Gabriel Rebeiz
Omar El-Aassar, Univ. of California, San Diego
Univ. of California, San Diego, Univ. of California, San Diego
(08:00 - 17:20)
Materials
workshops-2023/WSJ_2.pdf
Abstract
WSJ-3: Generating “Efficient” D-Band Power Using Nanoscale CMOS Technology
Ali M. Niknejad
Ali M. Niknejad, Univ. of California, Berkeley
Univ. of California, Berkeley
(08:00 - 17:20)
Materials
workshops-2023/WSJ_3.pdf
Abstract
WSJ-4: Reliable mm-Wave and Sub-THz PA Design
Jefy Jayamon
Jefy Jayamon, Qualcomm
Qualcomm
(08:00 - 17:20)
Materials
workshops-2023/WSJ_4.pdf
Abstract
WSJ-5: III-V ICs for 100-300GHz wireless
Mark Rodwell, Utku Solyu, Amirreza Alizadeh, Ahmed Samir Sayed Ahmed, Ali Farid, Munkyo Seo
Mark Rodwell, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara, Univ. of California, Santa Barbara, Keysight Technologies, Cairo Univ., Intel Corp., Sungkyunkwan Univ.
(08:00 - 17:20)
Materials
workshops-2023/WSJ_5.pdf
Abstract
WSJ-7: GaN and GaAs Power Amplifier Design for Arrays
Taylor Barton
Taylor Barton, University of Colorado Boulder
University of Colorado Boulder
(08:00 - 17:20)
Materials
workshops-2023/WSJ_7.pdf
Abstract
WSJ-8: High-Efficiency Silicon PAs for mm-Wave Radar Sensors
Tolga Dinc, Krishnanshu Dandu, Swaminathan Sankaran, Brian Ginsburg
Tolga Dinc, Texas Instruments
Texas Instruments, Texas Instruments, Texas Instruments, Texas Instruments
(08:00 - 17:20)
Materials
workshops-2023/WSJ_8.pdf
Jane Gu, Wooram Lee
Univ. of California, Davis, Penn State University
Location
30C
Abstract
Interconnect bottlenecks have been a long-standing grand challenge over decades, caused by the increasing gap between exponentially growing data generation and transmission demand, and slowly-increasing supporting data bandwidth supply. Both Electrical Interconnect (EI) and Optical Interconnect (OI) have been investigated extensively to try to combat the challenge, however, both of them face their own inherent constraints. The newly emerging sub-THz/THz Interconnect (TI) aims to complement the existing EI and OI to close the interconnect gap. This workshop plans to bring experts from different domains, OI, EI, and emerging TI, to discuss the challenges, opportunities and best use scenarios of each interconnect scheme.
Technical Papers
WSK-1: Workshop Introduction
Jane Gu, Wooram Lee
Wooram Lee, Pennsylvania State Univ., Jane Gu, Univ. of California, Davis
Univ. of California, Davis, Pennsylvania State Univ.
(08:00 - 17:20)
Materials
workshops-2023/WSK_1.pdf
Abstract
WSK-2: Analog and Digital Optical Interconnects
Vladimir Stojanovic
Vladimir Stojanovic, Univ. of California, Berkeley
Univ. of California, Berkeley
(08:00 - 17:20)
Materials
workshops-2023/WSK_2.pdf
Abstract
WSK-3: High-Density, Low-Power Optical Communications for AI, Data Center, and More
Jonathan Proesel
Jonathan Proesel, Nubis Communications
Nubis Communications
(08:00 - 17:20)
Materials
workshops-2023/WSK_3.pdf
Abstract
WSK-4: Silicon Photonics-Based Optical I/O for Next-Gen XPUs
Ganesh Balamurugan
Ganesh Balamurugan, Intel
Intel
(08:00 - 17:20)
Materials
workshops-2023/WSK_4.pdf
Abstract
WSK-5: Waveguide Interconnects — D/F-Band Systems for >100Gbps Medium Reach Links
Thomas W. Brown
Thomas W. Brown, Intel
Intel
(08:00 - 17:20)
Materials
workshops-2023/WSK_5.pdf
Abstract
WSK-6: High-Speed Short-Reach Interconnects Using Dielectric Waveguide
Hyeon-Min Bae
Hyeon-Min Bae, KAIST
KAIST
(08:00 - 17:20)
Materials
workshops-2023/WSK_6.pdf
Abstract
WSK-7: Going Beyond 100Gbps with Polymer Microwave Fibers
Patrick Reynaert
Patrick Reynaert, KU Leuven
KU Leuven
(08:00 - 17:20)
Materials
workshops-2023/WSK_7.pdf
Abstract
WSK-8: A Path to 200+Gb/s Transceiver Design for Electrical Interconnects
Jihwan Kim
Jihwan Kim, Intel
Intel
(08:00 - 17:20)
Materials
workshops-2023/WSK_8.pdf
Abstract
WSK-9: Next-Generation Electrical Interconnects: Chips and Chiplets
Tod Dickson
Tod Dickson, IBM T.J. Watson Research Center
IBM T.J. Watson Research Center
(08:00 - 17:20)
Materials
workshops-2023/WSK_9.pdf
Farid Medjdoub, Keisuke Shinohara
IEMN (UMR 8520), Teledyne Scientific & Imaging
Location
24ABC
Abstract
Owing to superior electrical and thermal properties of GaN-on-SiC material systems, tremendous progress has been made on GaN-based transistor and MMIC technologies. Advanced heterostructure material designs, epitaxial growth techniques, and transistor scaling processes enabled GaN MMICs to extend their applications from microwave to mm-wave frequencies (up to W-band). Next-generation RF systems require high efficiency and high linearity for more complex modulation schemes to support very high data-rates. The traditional trade-off among efficiency, linearity, and power density imposes performance limitations on GaN MMICs, which become more pronounced at mm-wave frequencies. In this workshop, world-leading experts will discuss the present status, challenges, and future perspective of mm-wave GaN transistor and MMIC technologies, covering emerging materials and devices, device modeling, thermal management, reliability, and circuit designs.
Technical Papers
Abstract
WSL-1: N-Polar GaN Devices for Efficiency and Linearity
Matthew Guidry, Umesh Mishra
Matthew Guidry, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara, Univ. of California, Santa Barbara
(08:00 - 17:20)
Materials
workshops-2023/WSL_1.pdf
Abstract
WSL-2: High-Efficiency High-Robustness mm-Wave AlN/GaN Transistors
Farid Medjdoub
Farid Medjdoub, IEMN (UMR 8520)
IEMN (UMR 8520)
(08:00 - 17:20)
Materials
workshops-2023/WSL_2.pdf
Abstract
WSL-3: Progress in Highly Linear and Efficient mm-Wave GaN HEMTs and MMICs
Jeong-sun Moon
Jeong-sun Moon, HRL Laboratories
HRL Laboratories
(08:00 - 17:20)
Materials
workshops-2023/WSL_3.pdf
Abstract
WSL-4: Polarization-Engineered III-N mm-Wave Transistors for Linearity, Efficiency, and Reconfigurability
Patrick Fay
Patrick Fay, Univ. of Notre Dame
Univ. of Notre Dame
(08:00 - 17:20)
Materials
workshops-2023/WSL_4.pdf
Abstract
WSL-5: Broadband mm-Wave GaN MMICs: Technology Aspects and Design Examples
Fabian Thome
Fabian Thome, Fraunhofer IAF
Fraunhofer IAF
(08:00 - 17:20)
Materials
workshops-2023/WSL_5.pdf
Abstract
WSL-6: GaN Transistor Reliability Drivers — Temperature and Electric Fields
Martin Kuball
Martin Kuball, Univ. of Bristol
Univ. of Bristol
(08:00 - 17:20)
Materials
workshops-2023/WSL_6.pdf
Abstract
WSL-7: The Interplay Between Deep Level Effects and Reliability in Deep Submicron-Gate GaN HEMTs for RF Applications
Enrico Zanoni
Enrico Zanoni, Università di Padova
Università di Padova
(08:00 - 17:20)
Materials
workshops-2023/WSL_7.pdf
Abstract
WSL-8: N-Polar GaN HEMT Technology for mm-Wave Amplifiers using Commercial 4-inch Wafer Process Facilities
Kozo Makiyama
Kozo Makiyama, Sumitomo Electric
Sumitomo Electric
(08:00 - 17:20)
Materials
workshops-2023/WSL_8.pdf
Abstract
WSL-9: ScAlN/GaN Heterostructure Field Effect Transistors for Ultra-High-Power and Wide-Band MMICs
Eduardo Chumbes
Eduardo Chumbes, Raytheon
Raytheon
(08:00 - 17:20)
Materials
workshops-2023/WSL_9.pdf
Abstract
WSL-10: GaN Transistor Designs for mm-Wave Applications
Keisuke Shinohara
Keisuke Shinohara, Teledyne Scientific & Imaging
Teledyne Scientific & Imaging
(08:00 - 17:20)
Materials
workshops-2023/WSL_10.pdf
Gian Piero Gibiino, Nicholas C. Miller
Univ. of Bologna, AFRL
Location
31C
Abstract
Wideband measurement and characterization techniques at microwave and mm-wave frequencies are becoming increasingly demanding to satisfy the specifications of the ever-evolving communications and radar industry. This workshop presents recent research and technology advancements from industry, research centers, and academia, by discussing relevant performance metrics and their experimental evaluation across different hardware platforms. Advanced characterization techniques are presented for transistors, power amplifiers, and beamformers, encompassing over-the-air testing, linearity, load-pull, and calibration of precision radar. The first half of the workshop is dedicated to state-of-the-art wideband device characterization techniques and load-pull. The second half of the workshop is focused on beamformers and over-the-air characterization techniques and standards. Both the morning and afternoon sessions of this workshop will end with open interactive discussions useful to outline future trends and research on these topics.
Technical Papers
Abstract
WSM-1: Load-Pull Techniques with Wideband Modulated Signals: State-of-the-Art and Future
Mauro Marchetti
Mauro Marchetti, Maury Microwave
Maury Microwave
(08:00 - 17:20)
Materials
workshops-2023/WSM_1.pdf
Abstract
WSM-2: Innovations in Characterizing and Modeling Active Devices under Modulated Operating Conditions
Jan Verspecht
Jan Verspecht, Keysight Technologies
Keysight Technologies
(08:00 - 17:20)
Materials
workshops-2023/WSM_2.pdf
Abstract
WSM-3: Advanced Characterization Techniques for mm-Wave Antenna Arrays Using Active Load-Pull and Over-The-Air Verification Using Realistic Modulated Signals
Koen Buisman
Koen Buisman, Univ. of Surrey
Univ. of Surrey
(08:00 - 17:20)
Materials
workshops-2023/WSM_3.pdf
Abstract
WSM-4: Accurate Characterization and Linearization of Wideband mm-Wave Transmitters Using Advanced Non-Linear Measurement Techniques
Christian Fager
Christian Fager, Chalmers Univ. of Technology
Chalmers Univ. of Technology
(08:00 - 17:20)
Materials
workshops-2023/WSM_4.pdf
Abstract
WSM-5: Wideband Multiport Measurements for MIMO and Beamforming Hardware
Olof Bengtsson, Christoph Schulze
Olof Bengtsson, FBH
FBH, FBH
(08:00 - 17:20)
Materials
workshops-2023/WSM_5.pdf
Abstract
WSM-6: Millimeter and Sub-Millimeter Measurement Capabilities at Northrop Grumman
William Deal
William Deal, Northrop Grumman
Northrop Grumman
(08:00 - 17:20)
Materials
workshops-2023/WSM_6.pdf
Abstract
WSM-7: System Concepts and Algorithms for Radar Distance Measurements with Micrometer Precision
Nils Pohl, Lukas Piotrowsky
Nils Pohl, Ruhr-Universität Bochum
Ruhr-Universität Bochum, Ruhr-Universität Bochum
(08:00 - 17:20)
Materials
workshops-2023/WSM_7.pdf
Abstract
WSM-8: Traceable mm-Wave Modulated-Signal Source for Over-The-Air Device Characterization
Paritosh Manurkar
Paritosh Manurkar, Univ. of Colorado
Univ. of Colorado
(08:00 - 17:20)
Materials
workshops-2023/WSM_8.pdf
Abstract
WSM-9: Measurements of Phased Array Beamforming Dynamics and Transients at mm-Wave Frequencies
Jon Martens
Jon Martens, Anritsu
Anritsu
(08:00 - 17:20)
Materials
workshops-2023/WSM_9.pdf
Abstract
WSM-10: Recent Advances in Frequency-Multiplier-Based Transmission of mm-Wave Modulated Signals
Slim Boumaiza
Slim Boumaiza, Univ. of Waterloo
Univ. of Waterloo
(08:00 - 17:20)
Materials
workshops-2023/WSM_10.pdf
Christopher Nordquist, Roy H. Olsson
Sandia National Laboratories, Univ. of Pennsylvania
Location
29C
Abstract
Advances in materials, fabrication, modeling, and test have enabled devices that achieve new functionality through coupling of multiple physical phenomena. These devices combine piezoelectric, ferroelectric, magnetostatic, acoustoelectric, and other physics to achieve performance beyond that of mass-produced bulk and surface-wave devices. These unique attributes provide potential for significant impact on future RF applications. Interactions between different types of physics provides coupling and exchange of energy between complementary mediums and modes. Examples include integrating piezoelectric and semiconductor materials to couple acoustic and electronic traveling waves, integrating ferromagnetic and piezoelectric materials to couple acoustic and magnetic domains, incorporating ferroelectric materials to change and tune piezoelectric orientation, and strain tuning of magnetostatic waves. Devices using these effects provide the potential for miniature high-Q tunable resonators and filters, non-reciprocal devices, and single-chip analog signal processors. This workshop will provide perspectives on the physics and application potential for these technologies.
Technical Papers
Abstract
WSP-1: DARPA Traveling Wave Energy Enhancement Devices (TWEED)
David K. Abe
David K. Abe, DARPA
DARPA
(08:00 - 17:20)
Materials
workshops-2023/WSP_1.pdf
Abstract
WSP-2: Non-Reciprocity and Non-Linearity in Hybrid Magnetoacoustic Devices
Derek A. Bas, Roman Verba, Piyush Shah, Serhiy Leontsev, Abbass Hamadeh, Michael Wolf, Andrew Franson, Alexei Matyushov, Michael Neuburger, Philipp Pirro, Mathias Weiler, Nian Sun, Vasyl Tyberkevych, Andrei N. Slavin, Michael Page
Derek A. Bas, AFRL, Michael Page, AFRL
AFRL, NASU Institute of Magnetism, AFRL, AFRL, Technische Universität Kaiserslautern, AFRL, AFRL, Northeastern Univ., AFRL, Technische Universität Kaiserslautern, Technische Universität Kaiserslautern, Northeastern Univ., Oakland Univ., Oakland Univ., AFRL
(08:00 - 17:20)
Materials
workshops-2023/WSP_2.pdf
Abstract
WSP-3: Zero-Quiescent Power Tuning of Magnetostatic Wave RF Filters by Strain-Induced Magnetocrystalline Anisotropy Field
Renyuan Wang
Renyuan Wang, BAE Systems
BAE Systems
(08:00 - 17:20)
Abstract
WSP-4: Acousto-Electric Device Physics and Applications
Matt Eichenfield
Matt Eichenfield, Univ. of Arizona
Univ. of Arizona
(08:00 - 17:20)
Materials
workshops-2023/WSP_4.pdf
Abstract
WSP-5: Frequency-Scaling Acoustic Resonators into mm-Wave Using Periodically Poled Piezoelectric Thin-Film Lithium Niobate
Ruochen Lu
Ruochen Lu, Univ. of Texas at Austin
Univ. of Texas at Austin
(08:00 - 17:20)
Materials
workshops-2023/WSP_5.pdf
Abstract
WSP-6: A Manufacturable AlScN Periodically Polarized Piezoelectric Film Bulk Acoustic Wave Resonator (AlScN P3F BAW) Technology
Rama Vetury, Abhay Kochhar
Abhay Kochhar, Akoustis Technologies, Rama Vetury, Akoustis Technologies
Akoustis Technologies, Akoustis Technologies
(08:00 - 17:20)
Materials
workshops-2023/WSP_6.pdf
Abstract
WSP-7: Emerging Nitride and Fluorite Ferroelectrics for Configurable cm- and mm-Wave Microwave Acoustic Components
Roozbeh Tabrizian
Roozbeh Tabrizian, Univ. of Florida
Univ. of Florida
(08:00 - 17:20)
Materials
workshops-2023/WSP_7.pdf
Abstract
WSP-8: Acousto-Electric Signal Processing: Moving Beyond Passive Micro-Acoustic Filters in Piezoelectric/Semiconductor Platforms
Hakhamanesh Mansoorzare, Reza Abdolvand
Hakhamanesh Mansoorzare, Univ. of Central Florida
Univ. of Central Florida, Univ. of Central Florida
(08:00 - 17:20)
Materials
workshops-2023/WSP_8.pdf

-

Sai-Wang Rocco Tam, Yao-Hong Liu, Oren Eliezer, Minyoung Song
NXP Semiconductors, IMEC, Samsung
Location
23ABC
Abstract
Ultra-Low-Power (ULP) wireless communication technology provides many unique features over conventional wireless communication such as high energy efficiency, low cost, small form factor, large scale deployments, reconfigurability and simple architecture. This workshop will bring together experts from academia and industry to highlight recent works and applications in this exciting technology. In the first topic, we are going to review the industry impacts on the most successful and large-scale commercialization using ULP wireless communication technologies such as RFID and Near-Field Communication (NFC). After that, we are going to shift our focus to recent research advances in using RF backscattering techniques in Reconfigurable Intelligent Surface (RIS) and WLAN/BT connectivity solutions. In the last topic of this workshop, we will discuss recent advances from medical, industrial and academic fields in biomedical implants with technologies such as co-optimizing antenna and RFIC to miniaturize radio module volume. Unconventional wireless propagation methods are also introduced, such as body channel communication, Magnetoelectric, ultrasound, etc.
Technical Papers
Abstract
WSA-1: Recent Circuit and System Architecture Design Advances in RFID/NFC Products
Peter Thüringer
Peter Thüringer, NXP Semiconductors
NXP Semiconductors
(13:30 - 17:20)
Materials
workshops-2023/WSA_1.pdf
Abstract
WSA-2: Recent Advances in Reconfigurable Intelligent Surfaces (RIS) and Backscatter Communication
Manos Tentzeris
Manos Tentzeris, Georgia Tech
Georgia Tech
(13:30 - 17:20)
Materials
workshops-2023/WSA_2.pdf
Abstract
WSA-3: Enabling Low-Power yet Standards Compatible Wireless Communication via Wake-Up Receivers and Backscatter Circuits
Patrick Mercier
Patrick Mercier, Univ. of California, San Diego
Univ. of California, San Diego
(13:30 - 17:20)
Materials
workshops-2023/WSA_3.pdf
Abstract
WSA-4: Circuit Techniques for Wirelessly Powered Sensors and Actuators
Aydin Babakhani
Aydin Babakhani, Univ. of California, Los Angeles
Univ. of California, Los Angeles
(13:30 - 17:20)
Materials
workshops-2023/WSA_4.pdf
Abstract
WSA-5: Magneto-Electric Power and Data Transfers to Millimetric Bioelectronic Implants
Kaiyuan Yang
Kaiyuan Yang, Rice Univ.
Rice Univ.
(13:30 - 17:20)
Materials
workshops-2023/WSA_5.pdf
Andreia Cathelin, Wanghua Wu
STMicroelectronics, Samsung
Location
29AB
Abstract
Thanks to the extended body biasing feature, FD-SOI process has enabled new system and circuit design techniques to improve the RF and mmW system performance drastically. Tremendous industry collaboration efforts have committed to bring up the FDSOI to higher volumes of production to serve the wireless, IoT, and automotive market in near future. This workshop includes an overview introductory presentation followed by 4 talks on FDSOI technology and its design examples for RF and mmW applications. The introduction provides the overview on FDSOI technology and its benefits for analog/RF/mmW circuit design, focusing on technology perspective. The following three talks demonstrate RF and mmW system design examples using FDSOI technology, for 5G as well as for ULP IoT. The last talk reveals the advanced FDSOI process design roadmap and what is to expect in near future.
Technical Papers
Abstract
WSE-1: Benefits of FD-SOI Technology for Analog/RF/mm-Wave Circuits
Andreia Cathelin
Andreia Cathelin, STMicroelectronics
STMicroelectronics
(13:30 - 17:20)
Materials
workshops-2023/WSE_1.pdf
Abstract
WSE-2: 5G FR2 UE Phased Array Transceiver Solution Using 28nm CMOS FD-SOI
Xiaohua Yu
Xiaohua Yu, Samsung
Samsung
(13:30 - 17:20)
Materials
workshops-2023/WSE_2.pdf
Abstract
WSE-3: Ultra-Low-Power IoT Frequency Synthesis Solutions Based on FD-SOI Technology
Yann Deval, David Gaidioz, Andres Mauricio Asprilla Valdes, Denis Michael Flores Pazos, Andreia Cathelin
Yann Deval, IMS (UMR 5218)
IMS (UMR 5218), STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics
(13:30 - 17:20)
Materials
workshops-2023/WSE_3.pdf
Abstract
WSE-4: mm-Wave Front-End Circuits for 5G and 6G Applications Using FD-SOI
Yang Zhang
Yang Zhang, IMEC
IMEC
(13:30 - 17:20)
Materials
workshops-2023/WSE_4.pdf
Abstract
WSE-5: 22FDX Platform and Features Optimized for Demanding RF Applications Ranging from WiFi Connectivity and mm-Wave Cellular to Auto Radar
Andreas Knorr, Tianbing Chen, Shafi Syed, Randy Wolf, Zhixing Zhao, Mingcheng Chang, Steffen Lehmann, Peter Javorka, Shih Ni Ong, Amit Kumar Sahoo, Jen Shuang Wong, Wai Heng Chow, Kok Wai Johnny Chew, Nicholas Comfoltey, Farzad Michael David Inanlou, Stephen Moss, Julio Costa
Andreas Knorr, GLOBALFOUNDRIES
GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES
(13:30 - 17:20)
Materials
workshops-2023/WSE_5.pdf
Kamal Samanta, Kevin Xiaoxiong Gu
AMWT LTD, Metawave
Location
32AB
Abstract
This workshop will cover various recently developed technologies and the state-of-the-art performance in wafer-level integration and packaging technologies and manufacturing techniques with challenges and possible future directions and solutions. In particular, it will highlight the latest advances in the areas such as embedded wafer-level ball grid array (eWLB) technology for system integration with high Q interconnects and passives in thin-film Re-Distribution Layers (RDL), wafer-level heterogeneous integration of different substrates, BiCMOS embedded TSVs, sub-THz on-chip antenna integration, innovative Fan-Out technologies for wafer-level package, RF IPD, and FOSiP, and embedding various chips within the silicon Metal-Embedded Chip/Chiplet Assembly. Further, the workshop will present the practical realization of highly integrated systems, including 60GHz and 77GHz eWLB transceiver modules with integrated antennas, 3D wafer-level packaging for mm-wave and sub-mm-wave space systems, and hetero-integration technology solutions to enable a full 2D array of phased array systems above 120GHz.
Technical Papers
Abstract
WSO-1: Developments in Wafer-Level Packaging for mm-Wave Communication and Radar System
Maciej Wojnowski, Klaus Pressel
Maciej Wojnowski, Infineon Technologies
Infineon Technologies, Infineon Technologies
(13:30 - 17:20)
Materials
workshops-2023/WSO_1.pdf
Abstract
WSO-2: Advanced Packaging and Heterogeneous Integration Technologies for mm-Wave and THz Applications
Mehmet Kaynak
Mehmet Kaynak, IHP
IHP
(13:30 - 17:20)
Materials
workshops-2023/WSO_2.pdf
Abstract
WSO-3: Fan-Out Packages Enabling Pivotal mm-Wave Performance
Jarris Kuo
Jarris Kuo, ASE Group
ASE Group
(13:30 - 17:20)
Materials
workshops-2023/WSO_3.pdf
Abstract
WSO-4: Metal-Embedded Chip/Chiplet Assembly (MECA) Platform for High-Frequency RF Subsystems
Souheil Nadri
Souheil Nadri, HRL Laboratories
HRL Laboratories
(13:30 - 17:20)
Materials
workshops-2023/WSO_4.pdf
Abstract
WSO-5: Wafer-Level Packaging for High Frequency Applications at Northrop Grumman Space Systems
Matthew Laurent
Matthew Laurent, Northrop Grumman
Northrop Grumman
(13:30 - 17:20)
Materials
workshops-2023/WSO_5.pdf