Electromagnetic Modeling and Simulation Challenges for Silicon Interposers in 2.5D/3D IC Chip Design

Chiplet packaging is progressing towards higher connection densities using micro-bumps and hybrid-bonding, which increase current densities and complicate power networks. Silicon interposers serve as crucial interfaces, providing thermal expansion matching, supporting fine pitch traces, and accommodating through-silicon vias (TSVs), thus enhancing speed and bandwidth. Despite their advantages, silicon interposers present challenges in modeling and simulation due to their complex, interconnected nature in 2.5D/3D-IC systems. This talk explores a comprehensive multiphysics analysis platform designed for 3D IC interposer development, addressing key challenges in achieving performance, integrity, and reliability. Robust simulation methodologies to effectively manage power, thermal, and electromagnetic interactions are emphasized.