The Role of Bondwire in Integrated Matching Networks in Power Amplifier Packaging

This talk presents the advances in wireless communication focusing on the development of high-performance front-end circuits in mature 5G-and-beyond mobile technologies. It delves into the packaging design of power amplifiers (PAs) to achieve miniaturization due to the rising demand for high data-rate applications. The technique demonstrates the utilization of bondwires for the fully integrated matching networks in PA to achieve size reduction of the die and package. The use of gallium-nitride-based transistors and high-electron-mobility transistors for fully integrated PAs is examined.