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Integrated Passive Device Platform for RF Interposers and Multi-Chip Module Integration
This presentation presents high-resistivity silicon-based integrated passive device (IPD) platform optimized especially for RF applications. Technology is suitable for the realization of RF passives such as filters and matching circuits supporting multi-chip RF front-end modules. Examples of realized high performance components and modules are presented as well as a path towards sub-mm-wave/THz packaging and integration.