In-Package Silicon Photonic Transceivers for Next-Gen AI/HPC Systems

Data movement has become a key bottleneck to meet the rapidly escalating performance demands of AI/HPC systems. Integrating silicon photonic (SiPh) transceivers in the ASIC package can address this challenge by combining the superior power and bandwidth density of electrical I/O with the channel bandwidth and reach afforded by pluggable optics. This talk will cover two possible realizations of SiPh-based optical I/O – one delivered by chiplets, and another using a SiPh interposer. For both approaches, compact thermally stable optical modulators are key. A GeSi electro-absorption modulator (EAM)-based solution will be described and compared with one using micro-ring modulators. Design considerations for key electronic and photonic elements in the optical link will be highlighted with illustrative examples. Finally, recent system-level demonstrations of in-package SiPh transceivers and opportunities for future work will be outlined.