GaN-Based RF Power Amplifier Multi-Chip Module Design for 5G mMIMO: Industrial Perspectives and Product Realization

This presentation addresses the design of GaN-based RF Power Amplifier (PA) multi-chip modules (MCMs) for massive MIMO (mMIMO) base-station applications, focusing on the practical challenges encountered in the industrial environment. Key aspects such as PA topology selection, circuit implementation, and form-factor optimization are discussed in the context of real-world constraints, including thermal management, mechanical design, and customer specifications. Complementing academic approaches, industry designs must balance performance, reliability, and manufacturability. The session will also showcase commercial PA module products that exemplify how theoretical design principles are implemented to meet the stringent requirements of modern 5G RFPAs. The talk provides insights relevant to both academic and industry stakeholders involved in RF PA Design.