III-V ICs for 100-300GHz wireless

We will describe 140, 200, and 270 GHz transmitter and receiver IC, module, and MIMO array design in InP HBT and combined CMOS plus InP HBT technologies, with a particular emphasis on power amplifier design, including efficient power combining techniques, electrothermal stabilization, DC bias regulation of HBT class AB and class B power amplifiers, and engineering of gain compression characteristics.