Fan-Out Packages Enabling Pivotal mm-Wave Performance

RF packages are typically lead-frame or substrate-based with various structures to meet demanding RF performance needs. This presentation will discuss innovative fan-out technologies — Wafer Level Package, RF IPD and FOSiP, describing how the needs are achieved with higher precision, smaller form factor and enhanced electrical performance, so very essential for the new decade’s mm-wave, radar and Beyond-5G applications.