IMS and RFIC Technical Sessions

Distributed Amplifier (DA) architectures have long been valued for their ability to deliver exceptionally wide bandwidths. In recent years, new design strategies and circuit techniques in various technologies have dramatically expanded their potential in applications ranging from high-speed optical and wireless communication to defense, instrumentation, radar, and sensing. This workshop will provide a comprehensive overview of recent research and development in distributed amplifiers, focusing on performance improvements across bandwidth, output power, linearity, noise, and efficiency enhancement. Emphasis will be given to implementations across multiple technology platforms including CMOS, SiGe BiCMOS, GaN, and InP technologies, highlighting the unique opportunities and challenges in each domain.

The ever-increasing demand for higher network capacity, and the volume of different devices that need connectivity, require innovative solutions. In mobile applications, this demand is addressed in 5G and 6G networks by using microwave links with massive Multiple-Input Multiple-Output (MIMO) antenna arrays to support high data-rate connectivity between large number of devices with improved coverage. However, the capacity is still limited by the available RF spectrum. Radio-over-fiber (RoF) systems combined with MIMO technology offer a flexible and powerful solution for extending the reach and improving the performance of wireless networks. In data center application, the hybrid opto-electrical links presents numerous advantages over single technology solutions. Energy efficiency, higher throughput, scalability and cost can be optimized by proper convergence of the two technologies. In this workshop, experts from industry and academia will discuss the latest developments in the convergence of the opto-electrical technology as applied to mobile networks and data center connectivity.

This workshop will present recent breakthroughs in the design of Voltage Controlled Oscillators (VCOs) and frequency multipliers, with a focus on innovations spanning the microwave, mm-wave, and sub-THz frequency bands. As these components are critical enablers in emerging communication, radar, and sensing systems, the workshop will cover both theoretical insights and practical design strategies that push the boundaries of performance, integration, and power efficiency. Bringing together leading experts from both academia and industry, the sessions will highlight state-of-the-art circuit techniques, emerging device technologies, and system-level considerations. Presentations will explore various aspects of VCO and frequency multiplier design, aiming to achieve low noise, wide tuning range, and high efficiency. The workshop will also address key challenges in scaling designs to higher frequencies and more compact integration.

The workshop takes a deep dive into systems and circuits at the forefront of the next generation wireless technology for commercial and defense applications. Bringing together leading experts from both academia and industry, the talks will highlight trade-offs in MIMO systems that motivate the use of analog, digital and hybrid beamforming with a focus on parameters like coverage, spectral and energy efficiency, bandwidth and throughput. Emerging device technologies, state-of-the-art design techniques for RF, analog and digital circuits, advanced packaging integration and thermal management will also be presented, providing a comprehensive view of the direction in which wireless systems are heading.

Generative AI and Large Language Models (LLMs) are beginning to change how electromagnetic and RF systems are specified, synthesized, and verified. Although these tools are common in software and data science, their use in microwave engineering is nascent and requires careful, physics-aware evaluation. This full-day workshop spotlights state-of-the-art methods that connect AI generation to EM reality, moving beyond proofs-of-concept toward validated models and workflows engineers can use today. Technical content centers on three pillars — (1) Inverse EM / spec-to-layout and end-to-end design: “Generative AI Methods for Wireless Propagation Prediction” (Costas Sarris) shows diffusion and GANs for real-time, generalizable indoor propagation maps and super-resolution; “AI-enabled End-to-End RF and RFIC Design” (Kaushik Sengupta) discusses inverse-design and generative AI approaches for automated synthesis of complex RF passives, multi-port elements, antennas, and spec-to-GDS RFIC flows combining reinforcement learning and inverse design; “Empowering Optimal Design of RF Devices by Generative AI” (Dominique Baillargeat and Francisco Chinesta) introduces rank-reduction autoencoders as generative surrogates for RF circuits and antennas; “An Autonomous Agentic Framework for Deep Inverse Photonic Design” (Willie Padilla) presents an agentic, autonomous inverse-design workflow for metamaterials, illustrating how AI agents can accelerate spectrum-to-structure design paradigms relevant across EM domains — (2) LLM-augmented EDA workflows and ML foundations: “Practical Considerations for Applying AI to RF and Microwave EDA Workflows” (Matthew Ozalas) and “Accelerating Innovation: AI-Driven Advances in Sigrity, Clarity, and Optimality” (Jian Liu) highlight Keysight’s and Cadence’s strategies for GenAI/LLM-aided design; Complementary talks cover attention mechanisms for non-linear circuit modeling (Qi-Jun Zhang) and multiphysics-informed, data-free ML for RFIC design (Dan Jiao) — (3) Multimodal LLMs: “Multimodal LLMs for Electromagnetic Waves” (Zhi Jackie Yao) fuses image-based EM data with text via a BLIP bridge into pretrained LLMs for EM reasoning and design assistance. Rigor and trust will be discussed throughout. Talks and discussion will cover dataset curation, generalization, solver-in-the-loop constraints (passivity/causality/manufacturability), independent EM/measurement validation, and secure integration into EDA flows, along with practical guardrails to avoid hallucinations and constraint violations. For attendees new to this intersection, the workshop includes short primers, reproducible examples, and simple evaluation checklists to separate signal from hype.

Next-generation wireless systems Beyond-5G will place unprecedented demands on radio front-ends across all frequency ranges, from sub-6GHz (FR1) to the upper mid-band (FR3) and into mm-wave spectrum. Each band presents its own trade-offs in terms of coverage, capacity, propagation, and spectrum availability, but they share common challenges: fragmented allocations, coexistence with incumbent services, and the need for spectrally agile, energy-efficient, and highly integrated transceivers. The upper mid-band (FR3, ∼6–24GHz) is a prime example. Compared to congested FR1 allocations, it offers an order of magnitude more bandwidth, while avoiding some of the severe propagation penalties of mm-wave frequencies above 28GHz. These advantages make FR3 highly attractive for wide-area enhanced broadband and low-latency applications, but also introduce stringent coexistence requirements with incumbent scientific, defense, and satellite users. The resulting emphasis on spectrum awareness and frequency agility highlights design challenges that resonate across all frequency ranges. This workshop will explore the circuit- and architecture-level innovations needed to enable broadband, reconfigurable, and spectrally agile radios. Topics include: Wideband, reconfigurable LNAs and PAs with high linearity and efficiency; Frequency-agile local oscillators and synthesizers with fast switching, low phase noise, and fine resolution; Wideband filtering and duplexing strategies using tunable, switched-capacitor, or acoustic/EM-based solutions; Digital-assisted calibration and adaptation, including ML-based techniques for resilience against PVT variations; Scalable architectures in advanced CMOS and SiGe technologies, enabling multi-band, multi-standard, and multi-antenna integration with energy efficiency. By bringing together experts from academia, industry, and government laboratories, the workshop will highlight state-of-the-art circuit techniques and cross-layer considerations — including spectrum policy, system-level trade-offs, and co-designed RF/digital intelligence — that are critical to realizing the next generation of programmable, energy-efficient, spectrally agile radios.

Are we there yet? — a world where radios and SoCs for IoT and countless other domains are truly battery free? What would it take to go beyond a smart toaster to a future with ubiquitous ambiently powered sensors that work seamlessly with the existing wireless devices and infrastructure. This workshop addresses these questions by bringing together a unique mix of top industry, research and academic speakers with expertise ranging from RFICs to SoCs. Apart from the current state of the low-power radios, the talks will discuss circuits and system architectures that have the potential to achieve 1000× improvements in energy efficiency. The workshop and concluding panel session also aims to explore salient features which the front-ends, integrated energy harvesters, and overall systems must provide to continue the evolution of ambient IoTs.

This workshop will focus on the design and implementation of FR3 Power Amplifiers. It will cover technology considerations, circuit implementation and topology consideration for PAs in this frequency range. Both Silicon, GaAs and GaN circuit examples and techniques are discussed, as well as DPD and broadband circuit techniques. The speakers are from both academia and industry.

The ever-increasing demand for high-throughput communication links and high-resolution radar sensors is driving the development of future wireless systems at higher operating frequencies, from mm-wave to sub-THz bands. The flexibility required from these systems to support multiple functionalities leads to the adoption of large phased array antennas and complex System-in-Package (SiP) Bit-to-RF or Optical-to-RF solutions. Heterogeneous technologies and vertical 3D integration will play a vital role in enhancing performance and functional density while reducing the size and cost of next-generation RF systems. However, the shift to 3DHI also introduces a new set of challenges, ranging from novel processes and substrates to RFIC/MMIC design, packaging and thermal management. This workshop brings together leading experts from academia and industry to present the latest advances and design methodologies in heterogeneous integration and advanced packaging technologies for mm-wave and sub-THz applications. The talks span a wide range of critical topics, including interposer-based system integration, advanced simulation techniques, integration of III-V technologies, SiGe and CMOS platform optimization, and co-packaged system testing and calibration.

The rapid progress in quantum computing has made microwave engineering a key enabler of nearly all major hardware platforms, including superconducting qubits, spin qubits, trapped ions, etc. Each of these technologies relies on advanced microwave techniques for control, coupling, readout, and scaling, demanding approaches that go well beyond classical electromagnetics. This creates a great opportunity for microwave engineers to make lasting contributions to the development of quantum computing and related technologies. The need for ultra-low-noise amplification, high-fidelity readout, and crosstalk suppression has stimulated novel device designs, often requiring hybrid approaches that combine electromagnetic modeling with quantum theory. Similar challenges appear in other quantum platforms; for example, trapped-ion processors demand stable and phase-coherent microwave delivery for multi-qubit gates, while spin qubits rely on advanced microwave control schemes. At the algorithmic level, quantum computing is increasingly viewed as a potential game-changer for electromagnetics and related fields. Specialized quantum algorithms promise significant acceleration for tasks such as solving integral equations, optimizing antenna radiation patterns, or addressing NP-hard problems in inverse scattering and system design. While fully fault-tolerant quantum computing remains a long-term goal, near-term noisy intermediate-scale quantum devices are already serving as valuable testbeds. Hardware-aware algorithm design, ie tailoring quantum algorithms to the specific strengths and limitations of physical devices, is becoming an essential strategy for identifying useful applications in the presence of noise and limited coherence times. This workshop will highlight state-of-the-art advances at the interface of microwave engineering, quantum hardware development, and quantum algorithm design. Contributions will cover multiple quantum platforms, emphasizing both their unique microwave engineering challenges and the unifying principles that connect them. A particular focus will be placed on industrial perspectives, including scalability, reliability, and manufacturability of microwave components for large-scale quantum systems. Industry engagement is crucial, as commercial interest and investment in quantum computing have surged dramatically, creating demand for engineers who can translate fundamental concepts into deployable technologies. To ensure accessibility, the workshop will open with a comprehensive tutorial introducing the basics of quantum theory in the language of microwave engineering. This will help participants from the RF and microwave community engage with the specialized concepts of quantum physics and better appreciate their role in quantum device design. The program will then feature a series of invited talks from leading experts in academia and industry, with topics spanning theoretical methods, quantum hardware, and algorithmic perspectives. By bringing together specialists from diverse quantum hardware platforms, algorithm developers, and industrial leaders, this workshop will provide a unique forum for exchanging ideas, identifying cross-platform synergies, and further drafting the engineering roadmap toward practical, scalable quantum computing.

With the operating frequencies of 6G wireless communications and next-generation automotive radars extending above 110GHz, accurate and robust on-wafer measurements are essential for enabling design, model verification, and industrialization. While a solid foundation has been established over the past decades in calibration methodologies and measurement platforms, many challenges remain as research and development move deeper into the sub-THz domain. As advanced devices, circuits, interposers/packaging technologies emerge alongside high-frequency systems, new measurement scenarios and calibration requirements continue to arise. At the same time, new methodologies such as AI-driven automation, advanced calibration algorithms, and novel calibration substrates are being developed to address these evolving needs. This full-day workshop brings together international experts from national metrology institutes, academia, and industry to address these challenges from complementary perspectives. The program begins with a focus on the fundamentals of calibration and measurement, reviewing the state-of-the-art in instrumentation, calibration techniques, and traceability at mm-wave frequencies, followed by comprehensive design guidance for calibration standards and systematic analysis of probe-induced uncertainties. These sessions lay the foundation for reliable and reproducible on-wafer measurements at sub-THz frequencies, offering both the theoretical framework and practical guidance needed for advancing calibration practices. The workshop then transitions to next-generation tools and methodologies that are extending the state-of-the-art. Topics include AI-driven nano-robotic probe stations that achieve sub-micron alignment and reproducible probe placement, calibration algorithms that go beyond conventional error models to capture mode conversion and crosstalk, and the development of GaAs impedance standard substrates supporting diverse calibration standards and measurement scenarios. Recent advances in broadband vector network analyzer technology will also be presented, including single-sweep measurements up to 250GHz and new calibration capabilities. These contributions demonstrate how innovative approaches are being translated into practical platforms, enhancing both robustness and scalability. Finally, the workshop highlights applications and industrial implementations. Talks will show how advanced calibration and measurement techniques are applied in wafer-scale silicon interposer technologies — addressing stackup choices, GSG pad design, and multimode suppression — as well as in high-volume silicon device testing for next-generation components. Presentations from industrial experts will emphasize optimizing calibration substrates, comparing methodologies such as modal versus SOLR calibration, and reducing measurement uncertainties under real manufacturing constraints. Together, these examples illustrate how academic innovation and industrial practice are converging to enable accurate and traceable measurements at scale. By covering the full spectrum from fundamentals to industrialization, this workshop offers participants both foundational insights and exposure to cutting-edge solutions. The day will conclude with an open discussion, providing a forum to exchange ideas, identify open challenges, and shape the roadmap for accurate, scalable, and robust on-wafer sub-THz measurements.

The D-band frequency range is gaining attention for both radar and communication applications due to potential system miniaturization related to smaller wavelength and the possibility of having larger bandwidth. There is an ongoing frequency regulation activity at ETSI, ECC and FCC on standardization of new frequency bands, targeting bandwidth >10GHz. Large bandwidth is beneficial for radar to achieve good range resolution, while for communication applications one can achieve higher data-rates. Pushing operation frequencies even further beyond the D-band towards 300GHz may offer even more potentially large available unregulated bandwidth. However, these high operation frequencies reach the technological limits imposed by the available CMOS processes. Operating the transistors at frequencies beyond half of the achievable ft/fmax makes it very difficult to obtain sufficient gain and power from an amplifier stage. One possible solution would be to use III-V technologies, which offer ft/fmax frequencies by far exceeding those of advanced CMOS nodes. Still, the possibility of integrating the mm-wave front-end with the digital baseband on the same chip makes CMOS very attractive despite this mentioned drawback. Another challenge that comes at higher frequencies are the higher losses of the interconnects. The packaging possibilities. Realization of antennas (on-chip or in-package?). As well, much higher propagation losses make the link budget very challenging and make it very hard to reach ranging or communication over large distances. In this full-day workshop we will address exactly these questions: (a) does it make sense to go to frequencies above 100GHz? Or shall we stay in the comfort zone below 100GHz?; (b) for which applications does it makes sense at all?; (c) what are the circuit related challenges in silicon-based technologies and how can we solve them?; (d) what are the challenges not only to build an SoC, but to actually build a system >100GHz?; (e) discuss emerging applications that might profit by very high frequencies. Level budget considerations for various mm-wave systems will be discussed. Fair and unbiased opinions will be given by experts. The workshop features distinguished speakers from leading companies and academia, who will present their view on mm-wave circuits >100GHz, as well as sharing their “best practice” on how to design mm-wave circuits. A brief concluding discussion will round-off the workshop to summarize the key learnings on the wide range of aspects presented during the day.

Scaled antenna arrays that support multiple simultaneous beams can enable significant throughput improvements and new capabilities for both communications and sensing applications. These benefits provide the form-factor and spectral efficiencies required for next generation wireless systems. However, beam scaling also scales up traditional design challenges and creates new implementation hurdles. For example, handling the signal distribution and processing for hundreds of antennas and tens of beams quickly results in stages that are power and thermally infeasible. Innovations in multi-beam array architectures are indispensable to overcoming these challenges for emerging satellite communications, radar, and 6G applications. To succeed in real-world deployments these innovations must be developed with resilience, cost-effectiveness, and hardware scalability considerations in mind. This workshop explores specifically multi-beam topics with an array of experts presenting their work on re-imagining how to architect and build point-to-multi-point arrays at scale. Approaches for beam-scaling in frequency, space, and time will be explored and hardware implementations that range from RF-centric to mostly digital will be covered. The goal is to provide attendees with an in-depth overview of this emerging area of antenna array design, and cast light on trade-offs and future directions.

Increasing demand for continuous information flow and uninterrupted connectivity requires next-generation communication and sensing systems to support higher data-rates and wideband operation. As a result, wireless systems are moving to higher frequencies, offering wider bandwidth and higher channel capacity, while simultaneously reducing the system size. Although lower mm-wave bands, such as V-band (40–75GHz), have been explored as a potential solution to meet the demand for high-speed connectivity, the elevated levels of atmospheric attenuation create an additional challenge for maintaining signal power in wireless transmission over long distances. On the other hand, the upper portion of the mm-wave spectrum at 110–300GHz, also known as G-band, offers a promising path to achieve higher data-rates in point-to-point links, defense applications, localization, ranging, and other multi-user communication scenarios as the underutilized portion of the EM spectrum, while enabling higher resolution in radars and other sensing systems for biomedical or security screening and also reducing the size of all these systems. The sub-THz spectrum above 200GHz is of particular interest due to lower atmospheric attenuation. However, building high-performance integrated circuits and systems at G-band poses significant disadvantages due to the lower available gain of the transistors and higher noise contribution from components, leading to higher power consumption and reduced sensitivity at these sub-THz frequencies. Therefore, a combination of advanced circuit design techniques and system-level innovations, state-of-the-art high-speed devices harnessing the properties of compound semiconductors, heterogeneous integration, and co-design with packaging is essential to overcome the inherent challenges of the G-band design space. This workshop provides a comprehensive and in-depth review of the latest academic and industrial research on innovative techniques and cutting-edge technologies for realizing high-data-rate wireless communication and radar systems at 110–300GHz across SiGe, scaled-CMOS, InP, and GaN platforms, with particular focus on designs above 200GHz in the upper G-band. First, novel circuit techniques and topologies to enable high-power generation with maximum power efficiency, advanced high-speed device design and optimization in compound semiconductor processes, as well as III-V RF front-ends and hybrid InP/CMOS phased arrays above 200GHz, will be presented. State-of-the-art SiGe BiCMOS transceiver arrays across the entire G-band will be showcased with an emphasis on ultra-compact design and 2D scalability, along with multiple demonstrations of modular beamforming ICs supporting up to 200Gbps wireless transmission, wideband radar transceiver chips for integration in large MIMO arrays, and upper G-band MMICs enabling radar systems with multi-target resolution down to a few millimeters while maintaining an absolute ranging accuracy on the order of 1µm. In addition, system- and circuit-level design considerations for record-low-power CMOS radar sensor systems will be reviewed. Finally, co-design and co-integration of sub-THz ICs in SiGe and SOI with glass interposer technology and 3-D Heterogeneous Integrated (3DHI) phased arrays incorporating an antenna on glass, GaN-on-SiC MMICs, a silicon interposer, and a silicon Beam Forming Integrated Circuit (BFIC) will be presented as a pathway toward end-to-end communication modules in G-band for commercial and defense applications.

Emerging applications such as Low Earth Orbit (LEO) satellite-based internet and geolocation services are rapidly expanding, driven by commercial efforts to deliver low-cost satellite connectivity to consumers. However, space environments present unique challenges not encountered in terrestrial systems, including radiation-induced errors, extreme temperature fluctuations, and limited power availability. Systems operating beyond LEO face even more severe higher levels of environmental degradations. This workshop will bring together leading experts from academia and industry, spanning both LEO SATCOM and traditional space-based systems, to provide a comprehensive overview of the key design challenges and state-of-the-art techniques required for reliable RF system performance in space.

Next-generation communications and sensing systems operating in the mm-wave range require a collaborative effort among the various components that make up the subsystems to enhance performance and reduce production costs. This workshop will bring together leading researchers from different fields of mm-wave phased arrays to discuss the key requirements and challenges relevant to their areas of expertise. The half-day workshop will kick off with a unique perspective on mm-wave phased arrays from industry and government representatives, providing context for the challenges and requirements in this field. The remainder of the workshop will feature internationally renowned speakers specializing in transistors, integrated circuits, packaging, and heterogeneous integration, as well as phased arrays. Interactive discussions will be prioritized throughout the event to encourage engagement among participants.

The frontier of next-generation radar is shaped by advances in mm-wave, UWB, and AI-assisted phased array technologies. In the D-Band, SiGe implementations enable instantaneous bandwidths up to 56GHz, delivering millimeter-level resolution and unlocking applications in imaging, non-destructive testing, and metrology. In parallel, UWB radar provides low-power, high-precision sensing for presence detection, vital-sign monitoring, and in-cabin safety. Complementing these developments, AI-driven phased arrays are emerging as enablers of adaptive beamforming, joint radar-communications (ISAC), and scalable multi-antenna architectures. This talk will highlight circuit and system design challenges, analog front-end techniques, and prototype results, illustrating how SiGe mm-wave, UWB, and AI-enhanced phased arrays together define the future of high-resolution radar.

The exponential demands for higher power densities, broader frequency coverage, and enhanced reliability in microwave systems have exposed fundamental limitations in conventional thermal design approaches. As next-generation applications push beyond traditional thermal boundaries — from 5G/6G infrastructure to automotive radar and space-based communications — the industry faces a critical inflection point where incremental improvements in thermal management are essential to meet performance requirements. This workshop addresses these challenges through a comprehensive exploration of advanced thermal characterization, materials innovation, and holistic design methodologies that span from fundamental materials science to industrial-scale implementation. The program brings together leading researchers, and industry practitioners to present breakthrough approaches that are reshaping thermal management across the RF and microwave ecosystem. The technical foundation begins with the innovations in wide-bandgap materials presented by Prof. Srabanti Chowdhury of Stanford University, whose pioneering work on ultra-wide bandgap materials demonstrates how diamond integration with Beta-Gallium Oxide enables unprecedented reduction in thermal boundary resistance while maintaining RF performance. These materials advances provide the essential building blocks for next-generation thermal management solutions, particularly in high-power RF applications where conventional thermal interface materials reach fundamental limitations. Oscar D. Restrepo offers industrial thermal modeling and characterization perspectives from GlobalFoundries, where a unique combination of theoretical expertise in phonon transport and practical TCAD thermal simulation experience bridges fundamental physics with manufacturing-scale implementation. His work spans from first-principles calculations of defect formation energies to real-world thermal assessments across advanced technology nodes, including 22FDX and 12LP platforms. Building upon materials foundations, the workshop explores state-of-the-art thermal characterization techniques through both academic research and commercial implementation. Advanced thermoreflectance imaging, POSH-TDTR technology, and emerging measurement approaches demonstrate how nanosecond temporal resolution combined with submicron spatial accuracy reveals previously inaccessible thermal phenomena in operating RF devices. These characterization advances enable predictive thermal design that was previously impossible with conventional measurement techniques. Standards and validation methodologies receive dedicated attention through participation by the National Institute of Standards and Technology (NIST), which presents traceable thermal measurement techniques and validation protocols essential for industry adoption. NIST’s gate resistance thermometry methods and RF power metering standards provide the measurement foundation necessary for reliable thermal characterization across different technology platforms. The workshop culminates in a holistic design philosophy that integrates materials innovation, advanced characterization, and system-level optimization. Live demonstrations showcase how this integrated approach enables thermal-electromagnetic co-design, abandoning traditional component-level optimization in favor of system-wide performance optimization. Real-world case studies span from mm-wave antenna-in-package modules to high-power GaN amplifiers, illustrating a direct correlation between materials properties, thermal imaging data, and system performance. Interactive sessions throughout the workshop foster direct dialogue between materials researchers, device designers, and manufacturing engineers. These discussions address practical implementation challenges while exploring emerging opportunities that could reshape thermal management approaches over the next decade. The format emphasizes knowledge transfer and collaborative problem-solving rather than traditional presentation-only formats.

In recent years tremendous advances have been made in electronics and photonics device technologies for the generation, modulation, radiation, and detection of THz signals and the time is now right to exploit these advances to build and deploy THz systems. IEEE defines the THz band as frequencies ranging from 300 to 3000GHz, however, for most use cases frequencies extending from about 100GHz to 10THz is considered as the sub-THz and THz bands. The focus of this workshop is on the research and development of components and systems for THz wireless communications and sensing. In the THz band, the available bandwidth is very vast, and this feature can be leveraged for multi-Gbps wireless communications leading to terabits per second throughput in a multi-channel system. Besides communications, THz waves can be used for sensing the reflection, transmission, absorption, and scattering of materials which in turn can be exploited for detecting, imaging, and analyzing materials with high spectral resolution. Furthermore, the wavelength of THz waves is small and on the order of 30 microns to 3.0mm, which along with polarization of the signal can be exploited for precise position and orientation of objects, within a specific location. All the above features are crucial for 6G communications, self-driving vehicles, and industrial Internet-of-Things. Accordingly, the workshop includes presentations from individuals and organizations across the globe highlighting the THz components and systems that they have developed and their application to communications and sensing.

In RF device characterization, understanding and utilizing phase information is crucial for achieving accurate measurements. This workshop is designed for engineers, technicians, and researchers who seek to deepen their knowledge of phase references and their applications in vector network analyzers (VNAs) and vector signal analyzers/generators (VSAs/VSGs). The primary goal of this workshop is to emphasize the significance of phase information in RF measurements. We introduce the concept of a “signal comb” as a phase reference and a tool for enhancing measurement accuracy. Participants will gain insights into how a comb generator works and how phase references can improve the reliability of amplitude and phase measurements across various RF applications. Key Topic #1 — Understanding Phase Information: • Introduction to phase information and its relevance in RF measurements; • Discussion of the limitations of traditional amplitude measurements and the often-overlooked phase references. Key Topic #2 — The Role of Signal Comb: • Explanation of what a signal comb is and its function in RF testing; • How a signal comb acts as a “Swiss army knife” for calibration and broadband verification; • Design overview of a comb generator and its traceability. Key Topic #3 — Benefits of Phase References: • Detailed exploration of how aligning VNAs and VSAs/VSGs to a known phase reference enhances measurement accuracy; • The importance of traceable calibration for establishing transfer standards in amplitude and phase uncertainties. Key Topic #4 — Practical Applications: • Hands-on examples demonstrating the application of phase calibration in real-world scenarios; • Case studies including time domain transformation and frequency-converting circuit measurements. Key Topic #5 — Advanced Measurement Techniques: • Techniques for aligning multi-port VSAs in amplitude, phase, and time using phase references; • Over-the-air measurement of group delay in low-noise block downconverters (LNBs) and pulse response determination of amplifiers at optimized operating points. Who Should Attend — This workshop is ideal for RF engineers, measurement technicians, and researchers involved in RF device characterization and testing. Whether you are a seasoned professional or new to the field, this workshop will provide valuable insights and practical skills to enhance your measurement capabilities. Format — The workshop will feature a combination of presentations, interactive discussions, and hands-on demonstrations. Participants will have the opportunity to engage with experts in the field and collaborate with peers to solve measurement challenges. Join us for this comprehensive workshop to unlock the full potential of phase information in your RF measurements. By the end of the session, you will have a solid understanding of phase references, the utility of signal combs, and advanced measurement techniques that can save you time and improve the accuracy of your RF testing endeavors. Don’t miss this opportunity to elevate your measurement skills and ensure precision in your RF applications.

The transition to all-digital RF transceivers marks a transformative shift in wireless system design, promising unprecedented levels of flexibility, scalability, and integration. This workshop brings together leading researchers and practitioners from academia and industry to explore the current state, challenges, and future directions of all-digital transceivers, covering a broad spectrum of topics from foundational architectures to application-driven innovations. All-digital transceivers replace traditional analog-intensive RF front-ends with fully digital architectures, where signal generation, modulation, transmission, and reception are primarily handled in the digital domain. This approach leverages high-speed digital-to-analog and analog-to-digital converters (DACs/ADCs), direct digital synthesis, and reconfigurable digital logic to create highly adaptable, software-defined systems that support multi-standard and multi-band operation. The workshop will begin with an overview of the architectural principles of all-digital transceivers, highlighting key building blocks, including pulsed modulators, up/down conversion architectures, filters, amplifiers and other fundamental building blocks. A comprehensive exploration of cutting-edge advances in digital and RF front-end technologies for next-generation wireless systems is presented. The first sessions focus on Delta-Sigma Modulation (DSM) for high-performance All-Digital RF Transmitters (ADTs). After revisiting key principles, advanced techniques for high-speed operation, out-of-band noise management, and hybrid DSM architectures are discussed, alongside emerging concepts such as spatial DSM for massive MIMO. Building on this, the relevance of ADTs as digital replacements for conventional RF chains is examined, highlighting their advantages in frequency agility, scalability, and integration with programmable platforms. Subsequent talks review progress in agile and scalable ADT architectures, including FPGA-based implementations and single-bit transmitters for direct antenna array driving. The benefits and trade-offs of wideband, multi-band, and multi-element operation are analyzed, providing participants with a clear perspective on the opportunities and limitations compared to analog-intensive designs. Extending the all-digital paradigm to the complete transmission–reception chain, another session introduces a Pulse-Width Modulation (PWM) approach for receivers, demonstrating how the combination of DSM-based transmitters and PWM receivers supports low-power, high-performance wireless architectures. The workshop also addresses digital transmitters for 5G and 6G, focusing on GaN-based amplifiers up to 6GHz, their role in boosting efficiency, and prospects for scaling digital architectures beyond 100GHz. This is complemented by advances in RF/microwave filter design, where new approaches achieve quasi-flat group-delay responses beyond the 3dB transmission band, thereby improving signal integrity without sacrificing selectivity. Emerging system-level concepts are also presented. A Distributed MIMO (D-MIMO) testbed based on all-digital radio-over-fiber is showcased, demonstrating practical solutions for sub-6GHz and mm-wave implementations and addressing synchronization challenges inherent to distributed architectures. Finally, the role of LEO satellite communications in the Q/V band is explored through digital beamforming and compact RF front-ends leveraging high-order Nyquist zones, enabling flexible beam generation for next-generation constellations. This workshop provides a unique platform for attendees to engage in in-depth technical discussions, exchange ideas, and foster collaborations that advance the frontier of all-digital RF systems. Together, these seven talks provide an integrated perspective on the transition to fully digital RF front-ends, offering insights into architectures, components, and system-level innovations that will shape future 5G, 6G, and non-terrestrial networks.

RF Power Amplifiers (PAs) play a critical role in modern wireless and satellite communications, radar, and electronic systems, requiring a deep understanding of both fundamental principles and cutting-edge innovations. This advanced course is designed for PhD students and professional researchers seeking to expand their expertise in RF PAs design, analysis, and optimization. Starting from solid-state power amplifiers fundamentals, the course will cover theoretical concepts, including PA classes of operation, their Figures of Merit, stability considerations and efficiency enhancement techniques. Special emphasis will be placed on advanced PA architectures, including Doherty PA, Envelope Tracking and other PA architectures, which are critical for next-generation wireless and satellite communication systems. The course will also address broadband design challenges and emerging trends in integrated PAs for large-scale phased array applications. Linearization strategies, including digital predistortion (DPD), will be discussed as essential tools to mitigate distortion and improve spectral efficiency. Several design examples based on commonly used semiconductor technologies (eg GaN, GaAs etc) will be presented to highlight the link between theory and practical implementation. Through a combination of theoretical foundations, practical case studies, and research-driven discussions, attendees will gain the expertise needed to design, model, and optimize cutting-edge RF power amplifiers. By the end of the course, participants will be well-equipped to contribute to breakthrough innovations in PA technology, bridging the gap between academic research and industrial applications.

Low-noise receivers are crucial system components for Earth observation and satellite communication. The complexity of such systems is growing, where today’s spacecraft range from large satellite missions such as MetOp-SG, to smaller systems such as the Arctic Weather Satellite, to CubeSats such as TROPICS (Time-Resolved Observations of Precipitation structure and storm Intensity with a Constellation of Smallsats). One of the most important building blocks are low-noise amplifiers. Over the years, corresponding technologies have improved substantially and provided excellent noise temperatures. Furthermore, the linearity and robustness of receivers is also an important characteristic, which adds another level of complexity. This requires new technologies, such as GaN HEMTs, with the necessity of different system architectures. This workshop gives an overview of the design of low-noise amplifiers and corresponding technologies. Furthermore, several aspects of the design and performance of receiver architectures will be discussed. Rarely discussed topics, such as in-system calibration targets or the reliability testing of critical components, will also be presented. The workshop starts with aspects of low-noise receiver systems and gives examples of several satellite missions and a background to the topic. Subsequently, best practices for the design of low-noise amplifiers and receivers are presented. An overview of recent advances in low-noise transistor technologies and the reliability testing is included as well. The remaining talks focus on different possibilities of low-noise calibration approaches for satellite systems.

This workshop surveys a materials-to-systems roadmap for reconfigurable apertures spanning sub-6GHz, FR3 (≈7–24GHz), mm-wave, and THz. Highlights include dual-polarized RFSOI-switched reflectarrays at 3–6GHz and 13–15GHz with true-time-delay or ultra-short phase shifters, achieving ±60° all-plane scanning and 1.5% EVM with 64-QAM. A 28GHz origami “eggbox” phased array merges electronic beam steering with controlled shape morphing to deliver near-360° azimuth coverage, multibeam and quasi-isotropic patterns, and additively manufactured foldable interconnects with ∼0.02dB/mm insertion loss. At higher frequencies, phase-transition and phase-change materials (VO₂, W:VO₂, GeTe) enable optically addressable, nonvolatile metasurfaces for broadband modulation, beam control, and tunable lensing in the sub-THz/THz regime, while plasmonic-nanoantenna platforms yield compact, high-SNR THz spectroscopy and imaging for sensing and security. CMOS-integrated, tile-scalable programmable metasurfaces and RIS architectures support resilient links and massive MIMO; electromagnetically consistent models and optimization frameworks extend to holographic surfaces and near-field ISAC. New multi-beam transmissive/reflective surface architectures up to 140GHz, OTA calibration and range-reduction methods for large reconfigurable arrays, and binary-coded genetic optimization of pixelated multiband antennas complete the program. Collectively, the sessions chart a path to low-loss, wide-angle, and highly programmable apertures that unify communications, sensing, and localization while remaining manufacturable, scalable, and verifiable.

Superconducting qubits have emerged as a leading platform for scalable quantum computing, offering robustness, manufacturability, and seamless integration with microwave engineering techniques. This workshop presents a comprehensive journey from the foundational principles of superconducting quantum systems to advanced microwave design strategies that enable scalable architectures. We begin by exploring the physics of Josephson junctions — the non-linear inductive elements that form artificial atoms — and their integration into quantum circuits. Participants will gain insights into the design and simulation of qubit-resonator networks, quantum amplifiers, and cryogenic microwave systems operating within dilution refrigerators at millikelvin temperatures. Key engineering challenges will be addressed, including resonance frequency tuning, qubit-resonator coupling, and quantum parameter optimization (eg anharmonicities, cross-Kerr effects). The workshop will also examine the role of quantum amplifiers in enhancing readout fidelity and the importance of scalable microwave layouts for multi-qubit systems. Using real-world examples and simulation workflows, we will demonstrate how to accelerate development cycles and improve design accuracy. Attendees will leave with a clear understanding of how microwave engineering principles intersect with quantum hardware design, paving the way for scalable quantum computing architecture.

Digital manufacturing technologies are transforming RF design, packaging, and integration, leading to new capabilities and use cases for high-frequency RF components and systems. The potential to digitally manufacture RF components, alongside new materials and integration processes, offers unprecedented opportunities for improving performance, reducing size/weight, and enhancing sustainability across the lifecycle of microwave systems. However, significant challenges remain in design, the realization of digitally-processed materials and manufacturing methods, and the seamless integration of individual components to full RF systems. This workshop aims to bring together advanced RF component design methodologies, manufacturing techniques, and practical RF/microwave applications. It will provide a comprehensive overview of new design, integration, and packaging techniques for microwave, mm-wave, and THz RF systems. Specifically, the workshop will give a detailed overview of novel materials, sustainable manufacturing methods, and scalable integration schemes that facilitate the realization of high-performing, highly-functional, and highly-miniaturized RF components. The workshop will bring forward recent advances in these fields by presenting the research of leading researchers and industry experts in the fields of RF component development, digital additive manufacturing, multi-material integration, and microwave materials engineering. Discussions will include cross-disciplinary advances involving manufacturing technologies, material development, and new design methods (ie design-for-print), opening new directions for materials-enabled innovation in wireless communication, sensing, and high-frequency electronics.

Phase-Change Material (PCM) RF switches are emerging as a breakthrough technology for reconfigurable microwave and mm-wave circuits. With their non-volatile operation, low insertion loss, and high power-handling capability, PCM switches offer distinct advantages over conventional alternatives. These properties make them ideal for use in phase shifters, impedance tuners, reconfigurable filters and switchable antenna arrays. At mm-wave frequencies, their scalability and fast response unlock new possibilities in adaptive beamforming, dynamic spectrum access, and next-generation 5G/6G wireless, satellite, and radar systems. This workshop will bring together leading experts from industry and academia worldwide to present recent advances and future directions in PCM-based RF technologies including coverage of device concepts, circuit integration, and application case studies. It aims to foster cross-disciplinary dialogue and broaden the community’s understanding of this promising technology for future mm-wave communication platforms.

Modern RF, mm-wave, and sub-THz systems stitch together multiple propagation media — microstrip, CPW/GCPW, SIW, ridge and rectangular waveguide, superconducting multilayers, and emerging flexible and additive platforms — because no single line technology satisfies bandwidth, loss, power, packaging, and cost targets simultaneously. This full-day workshop brings leading researchers and practitioners to present field-based design rules, validated topologies, and measurement workflows for high-performance transitions and interconnects across these media. Foundational talks cover the evolution of planar↔waveguide links and state-of-the-art SIW transitions (including compact, broadband launchers and thick–thin stackup integration). Practical sessions compare microstrip, GCPW, and SIW on a common process, detail ridge/ridge-gap waveguide connections, and treat transmission-line choices for high-speed/high-frequency ICs. Materials and manufacturing frontiers are addressed via MXenes for printable conductors, flexible hybrid electronics for ultra-low-cost modules, and multilayer superconducting devices for ultra-low-loss front-ends. A methodological block demonstrates AI/ML-assisted EM optimization (adjoint sensitivities, surrogates, active DOE) that reduces simulation burden while improving insertion/return loss and mode control. Throughout, speakers emphasize tolerance and variability, packaging and interposers, vertical/horizontal launches, and over-the-air and on-wafer verification. Attendees leave with implementable recipes and performance bounds that shorten development cycles and raise first-pass success for integrated communications, sensing/ISAC, and imaging hardware.

The market for integrated active electronically scanned arrays (AESA) and multiple-input multiple-output (MIMO) wireless systems is rapidly growing for ground-based and satellite telecommunications, as well as for automotive and aerospace and defense applications. Engineers, accustomed to traditional conductive characterization of RF front-ends, are increasingly confronted with over-the-air (OTA) interfaces, which makes their jobs more difficult in designing the test setups and measurement techniques while keeping measurement uncertainties small. Besides the wide use of anechoic chambers, reverberation chambers have been researched and explored for the past years to characterize different aspects of AESA / MIMO systems OTA with the focus on their active or electronic behavior, ie separate from the antenna characteristics. The goal of the workshop is to inform engineers about the state-of-the-art in reverberation measurement techniques, how they differ from those of anechoic chambers and how one may gain certain insights into the electronic behavior behind the antenna, similar to what traditional conducted measurements provided. The concepts and some exciting results will be demonstrated to make it more tangible. Attendees will learn how to make better tradeoffs related to selecting the proper characterization and test methods in every stage of AESA / MIMO product development, ie from characterizing the first design, to design validation and production.

Integrated Sensing And Communication (ISAC) applications have become a key emerging area in the next-generation wireless evolution. The role of ISAC will vary, ranging from tasks such as radar coordination, context awareness for communication to enhanced security and improving the trustworthiness/resilience of future networks. ISAC has the potential to transform current technologies by introducing context awareness, enabling breakthroughs in applications such as connected driving and next-generation mobile communications. The investigation of hardware enablers and emerging techniques considering different signal processing aspects will play an important role in the near future to realize the full potential of ISAC, leading to faster deployments. This half-day workshop will highlight these technologies and enablers featuring both applied and academic researchers working in hardware, signal processing, and system integration/demonstration aspects of ISAC targeting various applications. RF hardware design approaches that enable sharing components between both sensing and communication functions will be the key to faster deployment. The workshop talks will cover opportunistic sensing using existing communication infrastructure as well as dedicated approaches for sharing resources while achieving ISAC. Two talks will focus on antenna arrays for ISAC and one exploring special electromagnetic beams carrying orbital angular momentum. The presentations will include results from hardware supporting the feasibility of the proposed concepts.

Power Amplifiers (PAs) are key elements in every communication link, and their performance strongly impacts a system’s data throughput, power consumption, size, and reliability. With the transition from a small number of GEO satellites to large-scale constellations in LEO and MEO, driven by commercial and defence applications, there is increasing pressure to rethink PA architectures. Efficiency, bandwidth, and linearity remain central figures of merit, but the trade-offs between them acquire new dimensions in the context of satellite communications, where cost per bit, scalability, and long-term reliability are critical. This workshop will bring together perspectives from MMIC designers and system engineers to explore how solid-state PAs are evolving to meet these demands. Presentations will cover advances in GaN technology, thermal and reliability challenges, efficiency enhancement techniques, and integration. Looking ahead, the workshop will also highlight areas where new approaches could shift the current landscape: highly integrated front-end modules, thermal management, and new characterisation methods for devices at mm-wave and sub-THz frequencies. The intended outcome is to provide participants with a snapshot of current best practices and a clear view of the open challenges that will define the next steps in SATCOM PA research.