IMS and RFIC Technical Sessions

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Kamal Samanta, Caglar Ozdag
AMWT LTD, IBM Research
Location
204
Abstract

As the world rapidly embraces Artificial Intelligence (AI) and Machine Learning (ML) across various industries, the key question arises: how can we best leverage AI/ML to transform our own field? This workshop addresses this critical question by highlighting cutting-edge research from industry and academia experts who are using AI to transform microwave design. With new techniques emerging at an unprecedented pace, the workshop will shine a light on their revolutionary potential in RF and microwave engineering. The focus is on how AI is streamlining design processes, optimising results and enhancing productivity, ultimately helping engineers to navigate increasingly complex challenges in ways that were previously not possible. Our six distinguished speakers, all pioneers in their respective areas, will present a comprehensive view of AI’s role in advancing the entire spectrum of microwave engineering, including topics such as device modeling (including GaN PA), component synthesis (together with inductor, transformer and other passives), circuit (including RFIC and MMICs) and system design, performance optimisation (like PA linearisation) and electronic design automation (EDA) covering RF to THz frequencies. Attendees will gain valuable insights into how AI/ML is reshaping the future of microwave engineering, providing the tools and perspectives needed to stay ahead and empowering innovation and realisation of advanced devices to highly integrated modules/systems, enabling applications for 5G, 6G and beyond.

Technical Papers
Abstract
WSC-1: State-of-the-Art Microwave Device Modeling Enabled by Artificial Intelligence and Machine Learning
Jianjun Xu
Jianjun Xu, Keysight Technologies
Keysight Technologies
(08:00 - 11:50)
Abstract
WSC-2: Physics-Informed Machine Learning-Based Digital Predistortion of RF Power Amplifiers
Tao Yu
Tao Yu, Analog Devices
Analog Devices
(08:00 - 11:50)
Abstract
WSC-3: AI/ML Techniques Supporting the Design Automation of RF/mm-Wave Devices and Circuits
Fábio Passos
Fábio Passos, Instituto Superior Técnico
Instituto Superior Técnico
(08:00 - 11:50)
Abstract
WSC-4: AI-Enabled Discovery of New RF/mm-Wave Architectures and Synthesis of End-to-End RFICs
Kaushik Sengupta
Kaushik Sengupta, Princeton Univ.
Princeton Univ.
(08:00 - 11:50)
Abstract
WSC-5: AI-Based Algorithms in Analog Circuit Topology Generation and Beyond
Xin Zhang
Xin Zhang, IBM
IBM
(08:00 - 11:50)
Abstract
WSC-6: AI/ML for Microwave Modeling and Optimization
Qi-Jun Zhang
Qi-Jun Zhang, Carleton Univ.
Carleton Univ.
(08:00 - 11:50)
Ethan Lin
TMY Technology
Location
206
Abstract

This half-day workshop titled "Integrating FR2 OAI and Hybrid RIS: Enhanced Network Management implementing FR2 OAI, ORAN, MIMO, and RIS" is designed to address the rapidly evolving technical landscape of mm-wave (FR2) OpenAirInterface (OAI) technology and network deployment with Dynamic RIS. The workshop will showcase cutting-edge developments in FR2 OAI, including its integration with ORAN architecture, and applications in ISAC and MIMO, as well as network deployment. Participants will benefit from presentations by experts who will share insights on innovative solutions and tools that enable advanced beamforming, intelligent RAN control, and efficient resource allocation in high-frequency networks.

Technical Papers
Abstract
WSE-1: Integrating FR2 OAI and Hybrid RIS: Enhanced Network Management Implementing FR2 OAI, ORAN, and RIS
Ethan Lin
Ethan Lin, TMY Technology
TMY Technology
(08:00 - 11:50)
Abstract
WSE-2: Implementation of an Open-Source 5G SA FR2 End-to-End Testbed with the USRP
Neel Pandeya
Neel Pandeya, National Instruments
National Instruments
(08:00 - 11:50)
Abstract
WSE-3: ISaC Designs and Applications for Physiological Motion Monitoring
Yao Zheng
Yao Zheng, University of Hawai`i at Mānoa
University of Hawai`i at Mānoa
(08:00 - 11:50)
Kevin Tien, Duane Howard
IBM Quantum, Amazon
Location
308
Abstract

The development of quantum computing shows no sign of slowing down, with multiple major players in the field recently announcing impressive achievements and aggressive roadmaps towards the deployment of quantum computers able to solve impactful problems for society. Though research and improvement of the core qubit technologies and the quantum processor units (QPUs) themselves have generally dominated the discourse in the quantum computing community, the engineering challenge of actually delivering complete scaled quantum computers with a full-fledged control/interaction framework is gaining increased attention as industrial and academic teams demonstrate qubit counts that push the envelope for I/O. This is especially problematic for technologies which require cryogenic environments, such as the popular superconducting qubit family, as a significant burden is incurred in trying to deliver necessary signals from room temperature through cabling down into the cryogenic environment itself. As proposed qubit counts on roadmaps increases beyond the 5000-physical-qubit mark, it is clear that interconnects will pose a massive challenge for the community. Though cryogenic electronics can help alleviate this, it does not resolve the fundamental problem of intra-fridge wiring towards the QPU proper. This half-day workshop collects academic and industrial speakers with deep expertise in this problem for discussions of the state-of-the-art in signal delivery, both for precision measurements and at scale. Attendees will be able to interact with experts to understand both the current best practices, but also hear about the bottlenecks and opportunities for innovative solutions from the broader microwave community.

Technical Papers
Abstract
WSN-1: High-Density Wiring and Signal Conditioning for Scaled Quantum Computers
Damon Russell
Damon Russell, Amazon
Amazon
(08:00 - 11:50)
Abstract
WSN-2: Generators, Receivers, and Signal Delivery in Large-Scale Superconducting Quantum Computing Systems
Daniil Frolov
Daniil Frolov, IBM Quantum
IBM Quantum
(08:00 - 11:50)
Abstract
WSN-3: High-Density RF Solutions for Scaled Quantum Computing
Ozlem Sen
Ozlem Sen, Maybell Quantum
Maybell Quantum
(08:00 - 11:50)
Abstract
WSN-4: Interconnect Challenges for Scalable Quantum Computing
Bob Buckley
Bob Buckley, Google
Google
(08:00 - 11:50)
Abstract
WSN-5: Noise Measurement Challenges in Cryogenic Systems
Leo Belostotski
Leo Belostotski, Univ. of Calgary
Univ. of Calgary
(08:00 - 11:50)

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Wanghua Wu, Ahmed Elkholy, Teerachot Siriburanon, Salvatore Finocchiaro
Samsung Electronics, Broadcom, Univ. College Dublin, Qorvo
Location
201
Abstract

Frequency synthesizers are among the most critical blocks in wireless, wireline, and digital clocking applications. This workshop will cover both the fundamentals and the latest advances in frequency synthesis circuits and systems to efficiently generate LO signals with low phase noise, low spurious tones, and large modulation bandwidth. Prior-art techniques will be discussed in-depth, such as energy-efficient reference clocks, high-FOM wide-tuning range VCOs and DCOs, DPLL fundamentals, modern low-jitter fractional-N PLLs. Special attention will also be given to pulling and spur mitigation techniques, and injection-locked frequency multipliers. The workshop will be concluded by exploring FMCW generation for high-performance automotive radars.

Technical Papers
Abstract
WSA-1: Reference Oscillator Architectures and Design Considerations
Danielle Griffith
Danielle Griffith, Texas Instruments
Texas Instruments
(08:00 - 17:20)
Abstract
WSA-2: Beyond All-Digital PLL for RF and mm-Wave Frequency Synthesis
Robert Bogdan Staszewski
Robert Bogdan Staszewski, Univ. College Dublin
Univ. College Dublin
(08:00 - 17:20)
Abstract
WSA-3: Spur Analysis and Mitigation Techniques for Fractional Synthesizer
Michael Peter Kennedy
Michael Peter Kennedy, Univ. College Dublin
Univ. College Dublin
(08:00 - 17:20)
Abstract
WSA-4: Calibration-Free DSM Noise Suppression in Analog Frequency Synthesizers
Dihang Yang
Dihang Yang, Broadcom
Broadcom
(08:00 - 17:20)
Abstract
WSA-5: Design of a Low-Jitter Ring-Oscillator-Based Fractional-N Digital PLL
Jaehyouk Choi
Jaehyouk Choi, Seoul National Univ.
Seoul National Univ.
(08:00 - 17:20)
Abstract
WSA-6: (Voltage-Controlled) Oscillators with Ultra-Low Phase Noise
Andrea Mazzanti
Andrea Mazzanti, Università di Pavia
Università di Pavia
(08:00 - 17:20)
Abstract
WSA-7: Design and Performance Characterization of PLL-Based Chirp Generators for FMCW Radar Applications
Pratap Tumkur Renukaswamy
Pratap Tumkur Renukaswamy, IMEC
IMEC
(08:00 - 17:20)
Alberto Valdes-Garcia, Yahya Tousi, Oren Eliezer
IBM Research, Univ. of Minnesota, Samsung Semiconductor, Inc.
Location
203
Abstract

Integrated communication and sensing capabilities are on a strong trajectory to become an integral part of the next generation of wireless systems. While the exploration of these techniques started decades ago, their development has accelerated with the increasing availability of highly integrated Si-based transceivers, baseband compute capabilities, and wireless testbeds for experimentation, and more recently AI. Nevertheless, the development of wireless systems with efficient joint communication and sensing capabilities remains a challenging multi-disciplinary task where EM, circuit design, signal processing, and ML techniques are relevant. The goal of this workshop is to bring together a set of active researchers on these topics to share their vision and expertise and enhance the cross-disciplinary awareness and understanding between the RFIC and systems communities. The speakers span academic and industrial research institutions from across the globe and the presentations will cover circuit, algorithm, and application aspects.

Technical Papers
Abstract
WSB-1: Integrating Sensing Functionality in Mobile Communication Networks
Henrik Holter
Henrik Holter, Ericsson
Ericsson
(08:00 - 17:20)
Abstract
WSB-2: Integrated Beamforming: Where Directional Communication Meets Sensing for Seamless Connectivity and Detection
Tumay Kanar
Tumay Kanar, Renesas
Renesas
(08:00 - 17:20)
Abstract
WSB-3: Toward Integrated mm-Wave Communication and Sensing with Compressive Beam Shaping Techniques
Yasaman Ghasempour
Yasaman Ghasempour, Princeton Univ.
Princeton Univ.
(08:00 - 17:20)
Abstract
WSB-4: Sensing with mm-Wave 5G: Extracting Spatial Information Leveraging Directional Beams
Alexandra Gallyas-Sanhueza
Alexandra Gallyas-Sanhueza, IBM Research
IBM Research
(08:00 - 17:20)
Abstract
WSB-5: Joint Sensing and Communication Under Hardware Impairments
Nuria González-Prelcic
Nuria González-Prelcic, Univ. of California, San Diego
Univ. of California, San Diego
(08:00 - 17:20)
Abstract
WSB-6: Broadband mm-Wave ICs for Joint Sensing and Communication Across 30–100GHz
Kaushik Sengupta
Kaushik Sengupta, Princeton Univ.
Princeton Univ.
(08:00 - 17:20)
Abstract
WSB-7: Adaptive mm-Wave MIMO Front-Ends for Energy-Efficient Sensing
James F. Buckwalter
James F. Buckwalter, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara
(08:00 - 17:20)
Andreia Cathelin, Yann Deval
STMicroelectronics, Univ. of Bordeaux
Location
205
Abstract

The workshop will delve into the design of ultra-low and low-power RF integrated circuits, emphasizing various applications where energy efficiency is paramount. This is particularly relevant within the Internet of Things (IoT) domain, which spans multiple application fields. Given that power consumption is a critical concern for all battery-powered or always-on applications, the workshop will comprehensively address this issue.

The workshop will commence with two presentations focusing on Silicon technologies optimized for such applications, specifically FD-SOI, FinFET, and emerging technologies such as gate-all-around nanoribbon transistors. Following this, two additional presentations will explore the trade-offs associated with the most power-intensive components, namely the frequency synthesis unit and power amplifiers.

The subsequent four presentations will concentrate on architectural innovations pertinent to low and ultra-low power RFIC solutions. This segment will begin with discussions on novel sensor interface solutions, such as event-driven operation systems. The final three presentations will address comprehensive system solutions designed for wireless environments, achieving power consumption down to sub-microWatt levels, and secure biomedical applications.

Technical Papers
Abstract
WSD-1: Leading-edge Process Technologies for Efficient Low-power Systems
Rami Said
Rami Said, Intel Corp.
Intel Corp.
(08:00 - 17:20)
Abstract
WSD-2: FD-SOI: game changer in the IoT arena
Andreia Cathelin
Andreia Cathelin, STMicroelectronics
STMicroelectronics
(08:00 - 17:20)
Abstract
WSD-3: Design Methodologies for Low-Power Frequency Synthesizers
Asad Abidi
Asad Abidi, Univ. of California, Los Angeles
Univ. of California, Los Angeles
(08:00 - 17:20)
Abstract
WSD-4: Digital-PA: Ubiquitous from Low-to-High Power
Jeff Walling
Jeff Walling, Virginia Polytechnic Institute and State Univ.
Virginia Polytechnic Institute and State Univ.
(08:00 - 17:20)
Abstract
WSD-5: Potential of event-driven continuous-time digital signal processing for ultra-low-power applications
Antoine Frappé
Antoine Frappé, Univ. of Lille
Univ. of Lille
(08:00 - 17:20)
Abstract
WSD-6: Next-Gen End-Point Radios down to sub-µW – Enabling Ubiquitous and Friction-Less Immersion in Existing Wireless Environments
Massimo Allioto
Massimo Allioto, National Univ. of Singapore
National Univ. of Singapore
(08:00 - 17:20)
Abstract
WSD-7: Body Area Network – Connecting and Powering Things Together Around the Human Body
Jerald Yoo
Jerald Yoo, Seoul National Univ.
Seoul National Univ.
(08:00 - 17:20)
Abstract
WSD-8: Living Networks: Bioelectronic IoT and the Future of Secure, Energy-Efficient Wireless Systems
Rabia Yazicigil
Rabia Yazicigil, Boston Univ.
Boston Univ.
(08:00 - 17:20)
Yun Fang, Hao Gao, Didier Belot
Southeast Univ., Technische Univ. Eindhoven, STMicroelectronics
Location
207
Abstract

With rapid technological advances, the scope of communication systems is expanding significantly. Among the most groundbreaking developments are the use of mm-wave and sub-THz frequencies, which are poised to revolutionize wireless communication by unlocking unprecedented capabilities. This workshop will explore the transformative potential of mm-wave and sub-THz technologies, covering the frequency range from 30GHz to 300GHz. Once underutilized, these high-frequency ranges are now pivotal to major technological breakthroughs. Central to this advancement is the broadband front-end, which is crucial for effectively harnessing these frequencies for cutting-edge applications. A major focus of the workshop is the advancement of high-frequency communication technologies. Attendees will examine innovations in ultra-fast data transfer, low-latency networks, and the integration of mm-wave and sub-THz frequencies within wireless systems. These advances are reshaping connectivity, supporting the rollout of 5.5G and 6G networks, enhancing autonomous vehicles, and enabling smart cities. The workshop will also highlight the potential of 5.5G and 6G technologies to transform various industries. Additionally, the integration of Reconfigurable Intelligent Surfaces (RIS) and Radio-over-Fiber (RoF) technologies will be discussed, showcasing their critical roles in optimizing signal quality and extending network reach in the evolving landscape of 5.5G and beyond.

Technical Papers
Abstract
WSF-1: Wideband TTD Reflectarrays for Multi-Standard 5G/6G Systems
Gabriel M. Rebeiz
Gabriel M. Rebeiz, Univ. of California, San Diego
Univ. of California, San Diego
(08:00 - 17:20)
Abstract
WSF-2: mm-Wave and Sub-THz CMOS Front-Ends for 6G
Kenichi Okada
Kenichi Okada, Tokyo Tech
Tokyo Tech
(08:00 - 17:20)
Abstract
WSF-3: Challenging CMOS with Beamforming in the D-Band
Giuseppe Gramegna, Piet Wambacq
Giuseppe Gramegna, IMEC
IMEC, IMEC
(08:00 - 17:20)
Abstract
WSF-4: Vision on Phased Arrays Using Meta-Surfaces and on the Implementation of LO Phase Shifting Based on ILOs
José-Luis Gonzalez-Jimenez
José-Luis Gonzalez-Jimenez, CEA-LETI
CEA-LETI
(08:00 - 17:20)
Abstract
WSF-5: Navigating the Challenges of 300GHz CMOS Transceivers: A Comparative Analysis with Photonics-Based and D-Band CMOS Configurations
Minoru Fujishima
Minoru Fujishima, Hiroshima Univ.
Hiroshima Univ.
(08:00 - 17:20)
Abstract
WSF-6: Multi-Layer Adaptive Hybrid Beamformers for Multi-Standard and Full-Duplex MIMO Communication
Susnata Mondal
Susnata Mondal, Intel
Intel
(08:00 - 17:20)
Abstract
WSF-7: Mixed-Signal RFIC in SiGe:C BiCMOS for mm-Wave Antenna-in-Package and Antenna-in-Module Solutions
Andrea Pallotta, Didier Belot
Andrea Pallotta, STMicroelectronics
STMicroelectronics, STMicroelectronics
(08:00 - 17:20)
Abstract
WSF-8: RF frontend technology beyond 5G
Rui Hou
Rui Hou, Ericsson
Ericsson
(08:00 - 17:20)
Abstract
WSF-9: Phased Array in mm-Wave and Sub-THz for Communication and Sensing
Yun Fang, Hao Gao
Yun Fang, Southeast Univ., Hao Gao, Technische Universiteit Eindhoven
Southeast Univ., Technische Universiteit Eindhoven
(08:00 - 17:20)
Didier Belot, Pierre Busson, Salvatore Finocchiaro
STMicroelectronics, Qorvo
Location
208
Abstract

In the context of 6G and beyond, the performance demands are geared towards massive parallelization. For instance, the Non-Terrestrial-Network (NTN) is an essential component of future 6G wireless systems, and the next-generation SATCOM network will play an enabling role to support 6G NTN. High throughput, capacity, and low latency, and beamformed wireless links are the key success factors for NTN. Most existing SATCOM terminals, either on the ground or on the satellite payload, require large-sized phased array systems with 1024 elements or more per array. Such massive parallelization results in significant challenges not only in terms of integration density, but also on calibration and practical operation; a particularly challenging task in SATCOM-on-the-Move (SOTM) systems that necessitate fast beam forming and tracking. In this WS we will have an overview of potential process/circuit/system solutions addressing these challenges.

Technical Papers
Abstract
WSG-1: Ku- and Ka-Band Beamformer with Antenna Arrays
Hua Wang, Thomas Burger, Tzu-Yuan Huang
Hua Wang, ETH Zürich
ETH Zürich, ETH Zürich, ETH Zürich
(08:00 - 17:20)
Abstract
WSG-2: Multi-Orbit SATCOM Terminals for NTN and the Components that Make These Viable
Kevin Greene, Salvatore Finocchiaro, Nitin Jain, Ryan Jennings
Kevin Greene, Qorvo
Qorvo, Qorvo, Qorvo, Qorvo
(08:00 - 17:20)
Abstract
WSG-3: SiGe BiCMOS Process for SATCOM Applications
Pascal Chevalier, Frederic Gianesello, Vincent Knopik
Frederic Gianesello, STMicroelectronics
STMicroelectronics, STMicroelectronics, STMicroelectronics
(08:00 - 17:20)
Abstract
WSG-4: Building Large-Volume SATCOM Phased Arrays Using Silicon
Gabriel M. Rebeiz
Gabriel M. Rebeiz, Univ. of California, San Diego
Univ. of California, San Diego
(08:00 - 17:20)
Abstract
WSG-5: Ka-Band CMOS TX-RX for SATCOM
Kenichi Okada
Kenichi Okada, Tokyo Tech
Tokyo Tech
(08:00 - 17:20)
Abstract
WSG-6: InGaAs LNAs for SATCOM
Fabian Thome
Fabian Thome, Fraunhofer IAF
Fraunhofer IAF
(08:00 - 17:20)
Abstract
WSG-7: SiGe LNA for SATCOM
Benjamin Blampey, Baudouin Martineau
Benjamin Blampey, CEA-LETI
CEA-LETI, CEA-LETI
(08:00 - 17:20)
Abstract
WSG-8: Low-Cost Silicon Beamformers in Ku and Ka Band Powering SATCOM User-Terminals
Naveen Yanduru
Naveen Yanduru, Renesas
Renesas
(08:00 - 17:20)
Abstract
WSG-9: Bringing Commercial Cellular Access to Space
Jeff Massman
Jeff Massman, Analog Devices
Analog Devices
(08:00 - 17:20)
Salvatore Finocchiaro, Yu Cao
Qorvo
Location
210
Abstract

The ever-increasing demand for high-throughput communication links and high-resolution radar sensors is driving the development of future wireless systems at higher operating frequencies. In order to support multiple functionality, the flexibility requested to those systems, is driving the adoption of large phased array antennas and complex System-in-Package (SiP) Bit-to-RF or Optical-to-RF solutions. Heterogeneous technologies and vertical 3D integration will play a vital role in enhancing the performance and functional density, along with reducing the size and costs, of such RF systems. 3DHI will pose a new set of technology (processes and substrates), design (MMICS, RFIC, analog, power management, passives), packaging and thermal challenges, which will be addressed by renowned experts from Academia and Industry in this workshop.

Technical Papers
Abstract
WSH-1: The Defense Advanced Research Projects Agency’s (DARPA) Next Generation Microelectronics Manufacturing (NGMM) Program
Michael Holmes
Michael Holmes, DARPA
DARPA
(08:00 - 17:20)
Abstract
WSH-2: 3D Heterogenous Integration (3DHI) for Advanced Communications
Madhavan Swaminathan
Madhavan Swaminathan, Penn State University
Penn State University
(08:00 - 17:20)
Abstract
WSH-3: Glass-Based Packaging for Bits-to-RF and 3DHI Systems-in-Package
Jeb Flemming
Jeb Flemming, 3DGS
3DGS
(08:00 - 17:20)
Abstract
WSH-4: Bits to Beams: How do You Simulate a Heterogeneously Packaged, Digitally Steered Phased Array?
Paul Mosinkskis
Paul Mosinkskis, Cadence
Cadence
(08:00 - 17:20)
Abstract
WSH-5: Waferscale RF Silicon Interposer Packaging Technology for mm-Wave Phased Arrays and Radars
Siddhartha Sinha
Siddhartha Sinha, IMEC
IMEC
(08:00 - 17:20)
Abstract
WSH-6: Development of Co-Packaged Optics Technology for Photonics Applications
Tarak Railkar
Tarak Railkar, Qorvo
Qorvo
(08:00 - 17:20)
Abstract
WSH-7: Advances in Wafer-Level Packaging (WLP) and Heterogeneous Integration for mm-Wave Phased Arrays
Dino Ferizovic
Dino Ferizovic, Northrop Grumman
Northrop Grumman
(08:00 - 17:20)
Abstract
WSH-8: TBD
Muhannad S. Bakir
Georgia Tech
(08:00 - 17:20)
Abstract
WSH-9: Progress in Commercial Realization of mm-Wave Heterogeneous Circuits
Jim Buckwalter
Jim Buckwalter, PseudolithIC, Inc.
PseudolithIC, Inc.
(08:00 - 17:20)
Tong Zhang, Song Hu
Google, Apple
Location
211
Abstract

This workshop will focus on self-interference cancellation techniques and implementations in Analog/RF, Digital, and ML domains for radar, full duplex, and frequency division duplex radio systems.

Technical Papers
Abstract
WSI-1: Lab-to-Fab Transition of CMOS Simultaneous Transmit and Receive (STAR) Research
Harish Krishnaswamy
Harish Krishnaswamy, Columbia Univ.
Columbia Univ.
(08:00 - 17:20)
Abstract
WSI-2: Transceiver Techniques for FDD and Full-Duplex Wireless
Emanuel Cohen
Emanuel Cohen, Technion
Technion
(08:00 - 17:20)
Abstract
WSI-3: Integrated Self-Interference Cancellers at RF for Communication and Radar
Arun Natarajan
Arun Natarajan, Oregon State Univ.
Oregon State Univ.
(08:00 - 17:20)
Abstract
WSI-4: Self-Interference Cancellation Techniques in Frequency Division Duplexing Receiver Front-Ends
Danilo Manstretta
Danilo Manstretta, Università di Pavia
Università di Pavia
(08:00 - 17:20)
Abstract
WSI-5: GHz to Sub-THz In-Band Full-Duplex Operations in CMOS Based on Wave Frequency and Mode Conversions
Ruonan Han
Ruonan Han, MIT
MIT
(08:00 - 17:20)
Abstract
WSI-6: Antenna Interfaces with Built-In Self-Interference Cancellation for Future Communication and Sensing Systems
Negar Reiskarimian
Negar Reiskarimian, MIT
MIT
(08:00 - 17:20)
Abstract
WSI-7: Opportunities and Challenges on the Next Generation Concurrent Reconfigurable Multi-Radio IoT Devices
Sai-Wang Rocco Tam
Sai-Wang Rocco Tam, NXP Semiconductors
NXP Semiconductors
(08:00 - 17:20)
Abstract
WSI-8: Integrated Self-Interference Cancelers for Fully-Duplex Radios
Aravind Nagulu
Aravind Nagulu, Northeastern University
Northeastern University
(08:00 - 17:20)
Abstract
WSI-9: Intelligent Self-Interference Mitigation for Integrated Radios
Jacques C. Rudell
Jacques C. Rudell, Univ. of Washington
Univ. of Washington
(08:00 - 17:20)
Alexandre Giry, Jennifer Kitchen
CEA-LETI, Arizona State Univ.
Location
215
Abstract

As the demand for high-speed wireless communication continues to grow, efficient PA design becomes critical for supporting modern communications network infrastructure, especially in the sub-20GHz spectrum (FR1 and FR3 bands). This workshop will delve into comprehensive design and development of power amplifiers (PAs) for sub-20GHz base station applications. The latest processes and technologies will be covered, focusing on semiconductor advances that drive power handling, linearity, and efficiency. Participants will explore theory and modeling principles to predict performance and optimize PA designs for various operational scenarios. The session will also emphasize architecture and design techniques, addressing key challenges such as linearity, efficiency, and bandwidth. Finally, the workshop will cover module design and integration, where participants will learn about packaging considerations and thermal management to ensure optimal performance in real-world deployments. This workshop is ideal for RF engineers, circuit designers, and researchers aiming to enhance their expertise in cutting-edge PA technology for wireless infrastructure. Participants will gain an in-depth understanding of key PA architecture and design techniques through interactive sessions with practical case studies.

Technical Papers
Abstract
WSJ-1: Gallium Nitride on Silicon Carbide Technologies for Sub-20GHz Applications
Kimon Vivien
Kimon Vivien, UMS
UMS
(08:00 - 17:20)
Abstract
WSJ-2: From Component Modeling for Circuit Design to Circuit Modeling for System Design
Wissam Saabe
Wissam Saabe, AMCAD Engineering
AMCAD Engineering
(08:00 - 17:20)
Abstract
WSJ-3: Understanding the Harmonic Balance Simulation Technique for use in the Waveform Engineering of Advanced GaN Power Amplifiers
Damon Holmes
Damon Holmes, Macom
Macom
(08:00 - 17:20)
Abstract
WSJ-4: Load-Modulated PA Architecture Comparison Using Non-Linear Embedding
Patrick Roblin, Dominic Mikrut
Patrick Roblin, The Ohio State University
The Ohio State University, The Ohio State University
(08:00 - 17:20)
Abstract
WSJ-5: Antenna-VSWR-Resilient Load-Modulated Balanced Amplifier (LMBA) for Massive MIMO Communications
Kenle Chen
Kenle Chen, Univ. of Central Florida
Univ. of Central Florida
(08:00 - 17:20)
Abstract
WSJ-6: How to Ensure Flexible and Efficient Use of Spectrum, from Advanced 5G Doherty Power Amplifiers to Digitally Assisted Wideband PA for 6G BTS
Emmanuel Gatard, Peter Abdelmalak, Stéphane Dellier, Shuichi Sakata, Takuma Torii, Shintaro Shinjo
Stéphane Dellier, Wupatec, Shuichi Sakata, Mitsubishi Electric
Wupatec, Wupatec, Wupatec, Mitsubishi Electric, Mitsubishi Electric, Mitsubishi Electric
(08:00 - 17:20)
Abstract
WSJ-7: A Fully Integrated Power Amplifier Module with Bias Controller to Tackle 5G mMIMO Basestation Applications at 3.5GHz
Stephan Maroldt
Stephan Maroldt, Ampleon
Ampleon
(08:00 - 17:20)
Abstract
WSJ-8: PA and Transmitter Architectural and Process Developments to Support Next-G Wireless Infrastructure (TBC)
(08:00 - 17:20)
Xiaobang Shang, Jeffrey Hesler
NPL, Virginia Diodes
Location
305/309
Abstract

This workshop provides an opportunity for presenters to share their work in addressing the challenges of unlocking the potential of the THz spectrum for future wireless communications and radar sensing applications. The presenters come from diverse backgrounds — including instrumentation manufacturing, metrology institutes, industry, and academia — offering a wide range of perspectives. Topics covered in this workshop include THz electronics, novel integration approaches for THz systems, interconnections and packaging technologies, photonics-based THz generation for communications, on-chip and waveguide antennas, design and characterization of high electron mobility transistors, and recent advances in testing and measurements up to 1THz and beyond.

Technical Papers
Abstract
WSK-1: THz Integrated Circuits Beyond 500GHz: Challenges and Opportunities
Jae-Sung Rieh
Jae-Sung Rieh, Korea Univ.
Korea Univ.
(08:00 - 17:20)
Abstract
WSK-2: Substrateless Platform: A Promising Route to THz Integration
Withawat Withayachumnankul
Withawat Withayachumnankul, Univ. of Adelaide
Univ. of Adelaide
(08:00 - 17:20)
Abstract
WSK-3: Photonics-Based THz Generation for THz Communication Testing and System-Level Demonstrations
Guillaume Ducournau
Guillaume Ducournau, Université de Lille
Université de Lille
(08:00 - 17:20)
Abstract
WSK-4: THz Semiconductor Electronics
Jan Stake
Jan Stake, Chalmers Univ. of Technology
Chalmers Univ. of Technology
(08:00 - 17:20)
Abstract
WSK-5: BiCMOS Interconnections and Wafer-Level Packaging Technologies for Sub-THz Communication and Sensing Applications
Matthias Wietstruck
Matthias Wietstruck, IHP
IHP
(08:00 - 17:20)
Abstract
WSK-6: THz Electronics for Sensing and Communication Applications
Chun-Hsing Li
Chun-Hsing Li, National Taiwan Univ.
National Taiwan Univ.
(08:00 - 17:20)
Abstract
WSK-7: Antennas and Packaging for a Sub-THz Wireless Point-to-Multipoint Link
Akanksha Bhutani
Akanksha Bhutani, KIT
KIT
(08:00 - 17:20)
Abstract
WSK-8: Characterization and Modeling of HEMTs Beyond 110GHz
Chong Li
Chong Li, Univ. of Glasgow
Univ. of Glasgow
(08:00 - 17:20)
Abstract
WSK-9: Trends in mm-Wave and THz Test Equipment
Jeffrey Hesler
Jeffrey Hesler, Virginia Diodes
Virginia Diodes
(08:00 - 17:20)
Abstract
WSK-10: Non-Contact On-Wafer Probing for mm-Wave and THz Metrology
Kubilay Sertel
Kubilay Sertel, The Ohio State University
The Ohio State University
(08:00 - 17:20)
Abstract
WSK-11: On-Wafer Measurement of Planar Circuits at mm-Wave and Sub-THz Frequencies
Xiaobang Shang
Xiaobang Shang, NPL
NPL
(08:00 - 17:20)
Aritra Banerjee, Susnata Mondal
Univ. of Illinois at Chicago, Intel
Location
306
Abstract

The power amplifier is one of the most critical blocks in the transceiver and obtaining the desired performance from the PA at sub-THz frequencies remains a challenge. At sub-THz frequencies, transistors suffer from reduced gain impacting the performance of the PA. Designing sub-THz PAs with improved power added efficiency (PAE), output power, and linearity is an active area of research. SiGe and III-V technologies such as InP and GaN demonstrate higher fT and fmax than CMOS and as a result, sub-THz PAs designed in these technologies outperform their CMOS-based counterparts. On the other hand, CMOS can achieve better yield and higher level of integration compared to III-V technologies. In this workshop, the speakers will present recent developments in sub-THz PA design in CMOS, SiGe, and III-V technologies demonstrating their comparisons and trade-offs.

Technical Papers
Abstract
WSL-1: InP HBT Technologies for Sub-THz Amplifiers
Miguel Urteaga
Miguel Urteaga, Teledyne Scientific & Imaging
Teledyne Scientific & Imaging
(08:00 - 17:20)
Abstract
WSL-2: 100–300GHz Power Amplifiers: Transistor Limits, Circuit Topologies
Mark Rodwell, Amirreza Alizadeh, Ahmed Samir Sayed Ahmed, Yuya Nemoto, Utku Soylu, Miguel Urteaga
Mark Rodwell, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara, Keysight Technologies, Cairo Univ., Univ. of California, Santa Barbara, Univ. of California, Santa Barbara, Teledyne Scientific & Imaging
(08:00 - 17:20)
Abstract
WSL-3: Transformer-Based mm-Wave PA Design in CMOS, InP and GaAs
Patrick Reynaert
Patrick Reynaert, KU Leuven
KU Leuven
(08:00 - 17:20)
Abstract
WSL-4: High-Power and Highly Efficient Power Amplifiers for D-Band Applications in Silicon
Omeed Momeni
Omeed Momeni, Univ. of California, Davis
Univ. of California, Davis
(08:00 - 17:20)
Abstract
WSL-5: mm-Wave High Efficiency, High Linearity GaN HEMT, GaAs and InP HBT Power Amplifiers
Andrea Arias-Purdue
Andrea Arias-Purdue, HRL Laboratories
HRL Laboratories
(08:00 - 17:20)
Abstract
WSL-6: E- and D-Band Common-Base Power Amplifiers in SiGe-BiCMOS with Performance Enhanced by Current Clamping and Device Stacking
Andrea Bilato, Andrea Mazzanti
Andrea Bilato, Università di Pavia
Università di Pavia, Università di Pavia
(08:00 - 17:20)
Abstract
WSL-7: Sub-THz SiGe HBT Cascode Power Amplifiers with Capacitive Feedback and its Use in a Supply Modulated RF Transmitter Front-End
Suprovo Ghosh, Haidong Guo, Kenneth K. O
Suprovo Ghosh, Texas Instruments
Texas Instruments, ams-OSRAM, Univ. of Texas at Dallas
(08:00 - 17:20)
Abstract
WSL-8: Stacked-FET CMOS Power Amplifier for mm-Wave and Sub-THz Applications
Kyunghwan Kim
Kyunghwan Kim, Samsung Electronics
Samsung Electronics
(08:00 - 17:20)
Bahar Jalali Farahani, Mahdi Parvizi
Cisco Systems
Location
307
Abstract

According to Global Market Insights Inc., the optical communication and networking market is expected to grow at a compound annual growth rate (CAGR) of 8.6% from 2024 to 2031, reaching $61.92 billion by 2031. The significant revenue comes from emerging technologies such as IoT (Internet of Things), machine-to-machine networks, AI, cloud-based services, and web-based applications. Driven by this demand, many innovations are underway to enhance optical communication systems. In this full-day workshop, we will learn about the latest advancements in the field of wireless and wireline optical networks.
The morning session of this workshop covers four talks on OWC (Optical Wireless Communication) and applications for Free Space Optics. The afternoon session focuses on wireline optical communication systems, with some talks elaborating on the circuit design techniques for high-speed transceivers.

Technical Papers
Abstract
WSM-1: VLC/LiFi for NextG Wireless
Hany Elgala
Hany Elgala, University at Albany (UAlbany) - State University of New York (SUNY)
University at Albany (UAlbany) - State University of New York (SUNY)
(08:00 - 17:20)
Abstract
WSM-2: 6G Optical Wireless Networks
Michael Crisp
Michael Crisp, Univ. of Cambridge
Univ. of Cambridge
(08:00 - 17:20)
Abstract
WSM-3: Photonics: The Key to Building Commercial Quantum Computers
Hossein Hodaei
Hossein Hodaei, PsiQuantum
PsiQuantum
(08:00 - 17:20)
Abstract
WSM-4: Will Light Communication be the coming 6G?
Farid Bichareh
Farid Bichareh, AASA Inc.
AASA Inc.
(08:00 - 17:20)
Abstract
WSM-5: Future of optical and wireline transceiver
Cathy Liu
Cathy Liu, Broadcom
Broadcom
(08:00 - 17:20)
Abstract
WSM-6: Sub-pJ/bit Optical Connectivity for AI Clusters
Keren Bergman
Keren Bergman, Columbia
Columbia
(08:00 - 17:20)
Abstract
WSM-7: In-Package Silicon Photonic Transceivers for Next-Gen AI/HPC Systems
Ganesh Balamurugan
Ganesh Balamurugan, Celestial AI
Celestial AI
(08:00 - 17:20)
Sorin P. Voinigescu, Vadim Issakov
Univ. of Toronto, Technische Univ. Braunschweig
Location
310-312
Abstract

This workshop will cover the latest industry developments and research trends in the design, large volume manufacturing, and characterization of superconducting, ion-trap, and semiconductor spin qubits along with the associated quantum processor architectures. We will start with a systematic and comprehensive comparison of the different qubit families, RF hardware realization challenges and their unique features. Presentations will also delve into cryogenic modeling, packaging, on-die small-signal and noise measurements and calibration at microwave and mm-wave frequencies of CMOS and SiGe HBT technologies needed in the control and readout electronics of these qubit families. We will end with the latest examples of such cryogenic control and readout circuits.

Technical Papers
Abstract
WSO-1: Superconducting Qubits: Wiring up Quantum Entanglement
Irfan Siddiqi
Irfan Siddiqi, Univ. of California, Berkeley
Univ. of California, Berkeley
(08:00 - 17:20)
Abstract
WSO-2: Progress in Control Electronics for Scalable Trapped-Ion Quantum Computing
Jules Stuart
Jules Stuart, IonQ
IonQ
(08:00 - 17:20)
Abstract
WSO-3: Circuit Design for Large-Scale Trapped Ions
Jae-Yoon Sim
Jae-Yoon Sim, POSTECH
POSTECH
(08:00 - 17:20)
Abstract
WSO-4: Design, Modeling and Control of Spin Silicon Qubits: from Confinement to Characterization
Elena Blokhina
Elena Blokhina, Univ. College Dublin
Univ. College Dublin
(08:00 - 17:20)
Abstract
WSO-5: High Throughput Manufacturing and Testing of Semiconductor Spin Qubit Quantum Processors
Frank Badets
Frank Badets, CEA-LETI
CEA-LETI
(08:00 - 17:20)
Abstract
WSO-6: SiGe HBT Compact Modeling for Circuit Design at Cryogenic Temperatures
Michael Schröter
Michael Schröter, Technische Universität Dresden
Technische Universität Dresden
(08:00 - 17:20)
Abstract
WSO-7: MOSFET Modeling with the sEKV Model for the Design of Cryo-CMOS Circuits
Christian Enz
Christian Enz, EPFL
EPFL
(08:00 - 17:20)
Abstract
WSO-8: On-Wafer LNA Noise Measurements for Cryogenic LNAs
Joseph Bardin
Joseph Bardin, UMass Amherst
UMass Amherst
(08:00 - 17:20)
Abstract
WSO-9: FDSOI Platform for Quantum Computing
Tristan Meunier
Tristan Meunier, Quobly
Quobly
(08:00 - 17:20)
Abstract
WSO-10: Engineering Quantum Computers for the FTQC Era: A Little About a Lot!
Imran Bashir
Imran Bashir, Equal1
Equal1
(08:00 - 17:20)
Abstract
WSO-11: Progress in Cryogenic Circuits for Superconducting Qubit-Based Quantum Computing
Daniel Friedman
Daniel Friedman, IBM T.J. Watson Research Center
IBM T.J. Watson Research Center
(08:00 - 17:20)

-

Shahriar Shahramian
Bell Labs
Location
212-214
Abstract

Abstract:
Advancements in instrumentation and metrology over the past decade have been extraordinary, blurring the boundaries between measurement domains. We rely on these tools as windows into reality, yet the increasing complexity of measurement setups, abstraction of instrument functions, and limited user experience (often) result in erroneous characterizations. Faulty measurements not only risk reputational damage within the scientific community but can also lead to costly failures, potentially causing millions of dollars in losses during productization. This lecture celebrates the ingenuity of modern test equipment while also highlighting their limitations and the challenges of accurate DUT characterization.

Biography:
Shahriar Shahramian (SM ’06) received his Ph.D. degree from University of Toronto in 2010 where he focused on the design of mm-wave data converters and transceivers. Shahriar has been with the Bell Laboratories – Nokia since 2009 and is currently the Lab Leader (Director) of the RFIC & Packaging Research Lab. His research focus includes the design of mm-wave wireless and wireline integrated circuits and systems. Shahriar is a Bell Labs Fellow and leads the design and architecture of several state-of-the-art ASICs for optical coherent and wireless backhaul products. Shahriar has served as the chair mm-Wave & THz subcommittee of IEEE BCICTS & mm-Wave SoCs at IEEE RFIC and member of the technical program committee IEEE ISSCC. He has also served as the guest Editor of the IEEE Journal of Solid-State Circuits (JSSC).

Shahriar has been the recipient of Ontario Graduate Scholarship & University of Toronto Fellowship, and the best paper award at the CSICS & Symposium in 2005, 2015 and RFIC Symposium in 2015, 2020, 2022 and ISSCC& in 2018. Shahriar is also the recipient of the IEEE MTT Young Engineer Award in 2020. He holds an Adjunct Associate Professor position at Columbia University, has received several teaching awards and is the founder and host of The Signal Path educational video series. Shahriar has also presented short courses and workshops at the IEEE CSICS, BCTM, BCICTS, RFIC/IMS and ISSCC conferences.

-

Travis Forbes, Subhanshu Gupta
Sandia National Laboratories, Washington State Univ.
Location
204
Abstract

While much of RFIC design works in the linear time invariant regime where blocks such as amplifiers provide a constant response during all time, linear time variant circuits bring time variance through clocking and/or mixing to enable significant performance advances. These advances are already showing promise in applications such as increased throughput in phased arrays, enabling full-duplex communication systems, and filtering of RF blockers for high bandwidth receivers. This workshop will bring together multiple research areas of linear periodic time variant (LPTV) circuit techniques from experts in industry and academia to provide attendees with both the theory of operation and the circuit and system implementation. Beginning with theory, the first talk will overview the theory of operation and analysis of LTV circuits with intuitive time-frequency domain analysis for mixing and filtering operations suited towards software-defined radios. The second talk will overview non-uniform sampling and engineering the clock to realize time-approximation filters for mixed-signal receiver implementations. The third talk will discuss sharp filtering through sampling aliases in LPTV filtering applications. The fourth talk will present advances in discrete-time true-time delay technologies and non-reciprocal components for use in full-duplex systems and circulators. The final talk will show significantly increased phased array throughput using joint phase and time array using an LPTV true-time delay as a key component. To end the workshop, we will bring the experts together for cross-pollination of ideas through a panel interaction with attendees.

Technical Papers
Abstract
WSP-1: Highly Linear Time-Variant Mixers/Filters: Operation and Analysis
Eric Klumperink
Eric Klumperink, Univ. of Twente
Univ. of Twente
(13:30 - 17:20)
Abstract
WSP-2: Fully Integrated, Time-Varying Non-Reciprocal Components for RF and mm-Wave Systems
Aravind Nagulu
Aravind Nagulu, Northeastern University
Northeastern University
(13:30 - 17:20)
Abstract
WSP-3: Sharp Filtering using Sampling Aliases: Basics, Benefits, and Challenges
Sudhakar Pamarti
Sudhakar Pamarti, Univ. of California, Los Angeles
Univ. of California, Los Angeles
(13:30 - 17:20)
Abstract
WSP-4: Advanced RFIC Techniques using Non-Uniform Sampling and Time-Approximation Filters
Mike Shuo-Wei Chen
Mike Shuo-Wei Chen, Univ. of Southern California
Univ. of Southern California
(13:30 - 17:20)
Abstract
WSP-5: Next Generation mm-Wave Technology: Beamforming with Joint Phase and Time Array
Navneet Sharma
Navneet Sharma, Samsung Electronics
Samsung Electronics
(13:30 - 17:20)
Charles Baylis, Matthew Ozalas
Baylor Univ., Keysight Technologies
Location
206
Abstract

Despite the automation of many processes in the engineering world, microwave circuit design still remains very much an "art" rather than a "science". However, recent developments in intelligent algorithms, artificial intelligence, and machine learning make the automation of microwave circuit design a potential breakthrough of epic proportions. The ability to automatically design circuits meeting goal specifications would allow improved designs and more efficient use of designer time. This workshop discusses facets of automated circuit design, including the motivation for automated microwave design, the limitations of artificial intelligence, how automation can be placed in the design workflow, and applications of automated design to different potential microwave application spaces. The workshop will conclude with a panel session of all speakers to discuss the way forward in microwave design automation.

Technical Papers
Abstract
WSQ-1: Audience Interaction: Challenges and Motivations for Microwave Design Automation
(13:30 - 17:20)
Abstract
WSQ-2: Applications and Benefits of Design Automation
Charles Baylis
Charles Baylis, Baylor Univ.
Baylor Univ.
(13:30 - 17:20)
Abstract
WSQ-3: What AI Algorithms Can Do, and What They Can’t
Robert J. Marks
Robert J. Marks, Baylor Univ.
Baylor Univ.
(13:30 - 17:20)
Abstract
WSQ-4: Automation in the Design Workflow
Matthew Ozalas
Matthew Ozalas, Keysight Technologies
Keysight Technologies
(13:30 - 17:20)
Abstract
WSQ-5: Accelerating High-Frequency Circuit Design Using Advanced AI Algorithms
Linda Katehi
Linda Katehi, Texas A&M Univ.
Texas A&M Univ.
(13:30 - 17:20)
Abstract
WSQ-6: Multi-Objective Visualization for Power Amplifier Design
Zoya Popović, Stefan Stroessner
Zoya Popović, University of Colorado Boulder
University of Colorado Boulder, University of Colorado Boulder
(13:30 - 17:20)
Abstract
WSQ-7: Harnessing AI for Unlocking Novel RF Designs with Enhanced Performances
Peng Wen Wong
Peng Wen Wong, FILPAL
FILPAL
(13:30 - 17:20)
Abstract
WSQ-8: Panel Session of Speakers: The Way Forward in Automated Microwave Design
(13:30 - 17:20)
Naoki Hasegawa
SoftBank
Location
308
Abstract

With the widespread use of mobile phones and smartphones, the contract for communication lines has shifted from being household-based to device-based. The wireless and mobile transformation of communication lines has improved communication speed and convenience, bringing significant changes to our society. However, electricity contracts remain at the household level and are limited to wired supply. The advancement of social implementation, such as DX (Digital Transformation), is predicted to significantly increase the number of sensors and IoT devices. In recent years, the development of 5G (fifth-generation mobile communication system) has aimed to establish a communication infrastructure capable of managing high volumes of traffic. However, significant challenges still persist regarding power supply methods for devices. To build a communication infrastructure capable of accommodating the increasing number of devices, wireless power supply methods to simplify battery replacement and charging are essential. This workshop focuses on research and development projects related to the integration of communication and power transmission. The requirements for research on the fusion of communication and power transmission include additive methods for incorporating wireless power transmission functionality into communication systems, power supply systems for communication purposes, mechanisms for simultaneous communication and power reception, device development for efficient conversion of radio waves into electrical energy, and the development of high-efficiency and cost-effective high-gain antennas. Wireless power transmission has recently been institutionalized in Japan and has begun commercial use. In the future, this theme will be of great importance in collaboration with Beyond-5G and 6G. The technologies presented in this session have the potential to significantly transform our energy utilization practices.

Technical Papers
Abstract
WSR-1: Design of 28GHz Wireless Power Transfer Phased Array in Beyond-5G/6G Networks
Bo Yang, Naoki Shinohara
Bo Yang, Kyoto Univ.
Kyoto Univ., Kyoto Univ.
(13:30 - 17:20)