IMS and RFIC Technical Sessions
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This workshop presents the similarities and differences between wireless and wireline/optical communication along with circuit design innovations that enable the next generation of these systems. There are undeniable similarities between the systems and electronic building blocks in wireline/optical and wireless transceivers. In this event, first commonalities and differences of wireline/optical system versus an advanced wireless link will be discussed, next advanced modulation schemes to close the gap with Shannon limit in wireline links will be reviewed. Next, advanced circuit design techniques for wireless and optical transmitters, which is power amplifiers and modulator drivers will be presented. The last talk covers the optical and wireless receiver front-ends where novel circuit design techniques for low-noise, low-power LNAs and TIAs will be highlighted.
Integration of passive electromagnetic structures and particularly integration of antennas on silicon becomes feasible at frequencies above 100GHz due to wavelength-related size reduction. The goal of this workshop is to give inspiration on the various novel circuit techniques relying on conflation of passive and active devices. Furthermore, this workshop discusses potential emerging applications towards THz and presents the latest developments on integrated EM devices and co-design with active circuits at high mm-wave frequencies. We discuss how to realize passive on-chip components, such as transformers, coupler baluns and antennas and how to combine them with the active circuitry. Furhermore, novel techniques involving antennas to realize certain functions are discussed. Antennas can be co-designed synergistically with active circuits to realize novel hybrid antenna-electronics with “on-radiator” and near-field functions, such as power combining/splitting, impedance scaling/filtering, active load modulation, noise cancellation and reconfigurability. A significant research challenge in hybrid active circuit/electromagnetic electronics is the application of suitable multi-physics simulation tools and co-design/co-optimization methodologies. This requires 3D full-physics solutions for electromagnetic simulation. Several world renowned speakers will provide an overview on the techniques, applications and the practical design considerations on realization of these approaches. In this half-day workshop we will discuss emerging techniques for on-chip mm-wave active/passive circuit co-design and applications of these new techniques. Distinguished speakers from leading companies and academia will present a wide range of topics to cover various aspects of EM-circuit co-design. A brief concluding discussion will round-off the workshop to summarize the key learnings of aspects presented during the day.
Engineered surfaces and materials have shown interesting qualities in electromagnetic propagation that may be useful in various applications. Characteristics such as reflection, transmission, and absorption can be designed by control of properties including metal and dielectric geometry, material permittivity or refractive index, and consideration of phenomena such as surface-waves. New or reconsidered electromagnetic design perspectives, newly enabled geometries from additive manufacturing approaches, and new material compositions including flexible or tunable (such as phase-change) materials, present emerging opportunities for investigation. These areas of exploration may yield advances in communication and sensing ranging from microwave to optical frequencies — including potential applications in 5G and 6G technology.
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Wireless systems with small RF bandwidths, high-order modulations, and advanced signal-processing techniques have reached a saturation point. They run into spectrum saturation and interference troubles under the sub-6GHz frequency band. International Telecommunication Union (ITU) announced the opening of 275GHz to 450GHz for super high data-rate communication applications. 5G is becoming a reality worldwide, and 6G is in a championship worldwide. The complete paradigm change of this new generation implies the evolution from today, and one of the elements to be defined will be the revolution in the transceiver functions: The data-rate is targeted beyond 100Gbps, and the carrier frequency to support such data transfer will be in the combination of mm-wave and sub-THz. In the 6G, the mm-wave/sub-THz front-end has challenges on bandwidth, power consumption, antenna coupling, array integration, etc. In this workshop, we also dedicate attention to silicon-based building blocks’ present realizations targeting 5G to 6G evolution.
The continued prevalence of microwave system techniques for interacting with superconducting transmon qubits and spin qubits have driven a resurgence of interest in cryogenic circuit and systems for quantum computing. Moreover, quantum computing applications demand low power, high scalability, and high precision in control signal generation and readout signal processing, which has led to several recent demonstrations of innovative system building blocks, as well as end-to-end control and readout chains. In this workshop, we introduce the state-of-the-art in system architectures for qubit control and readout, and then focus on the recent developments in technologies related to qubit readout. We will examine current building blocks found in high-end systems, then look at the next generation of high performance cryo-LNA technologies. Finally, we conclude with deep dives into full readout chain construction, and test and metrology for this very challenging ecosystem of components.
The RF Power Amplifier (PA) is a performance bottleneck of most RF wireless transmit systems and a critical design component of any RF system. Fundamental PA design knowledge and realization expertise are highly desired and regarded skills in the RF community. With their numerous process technologies, architectures, and implementation “tricks”, the design of RF PAs may quickly become overwhelming. Moreover, the knowledge is typically acquired through years of design experience and multiple failed design attempts. This workshop jump-starts you into the world of PA design by walking you through the various aspects of RF PA design, starting from the basics and then introducing the most popular forms of advanced PA architectures. The various tutorials within the workshop will categorize the different PA design methodologies to give you a better understanding behind their motivations. Experts from industry and academia will also summarize the strengths of various process technologies, enabling you to better select processes depending on your target application. Finally, PA designers with decades of experience will provide insight into successfully implementing RF PAs, including practical design aspects (“tricks of the trade”), accounting for PA memory and thermal effects (the big “gotcha”), and effectively simulating PA designs to closely predict performance. This workshop will provide design insights not obtained from textbook reading, thus benefiting those who are new to the RF PA design field and seasoned warriors who would like a rapid refresher.
Wireless networks have enabled socio-economic growth worldwide and are expected to further advance to foster new applications such as autonomous vehicles, virtual/augmented-reality, and smart cities. Due to limitations of further growth in capacity in the sub-6GHz spectrum, mm-wave and sub-Thz frequencies are gaining an important role in the emerging 6G and the communication-on-the-move applications. In 6G, RF/mm-wave/sub-THz front-ends have challenges on bandwidth, power consumption, antenna coupling, array integration, etc. We examine the integration technologies and packaging challenges. 6G covering from sub-10GHz to high frequency as well the complexity of systems is increasing, which demands implementations in the right technology (CMOS, SiGe, …) and integration of chipsets heterogeneously from basedband, transceiver to the antenna. The heterogeneous integration will be important with the multitude of frequency bands covered, eg 7–14GHz bands up to frequencies >100GHz.
The unique sensing capabilities of mm-wave radars bolstered by modern nano-scale silicon technology and advanced image processing has created the opportunity for integrated radar technology to create substantially improved image perception at a considerably lower size and cost compared to the radars of the 20th century. There is a growing effort in both academia and industry to bring this technology to fruition. In this workshop, we overview the existing opportunities in this field and the challenges that need to be overcome in order to standardize and commercialize integrated radar technology. The workshop brings together a complementary mix of top academic and industry speakers with a breadth of expertise and experience in this field ranging from the fundamental aspects of circuit design, system integration to sensor fusion, product design and testing.
There is no silver bullet power amplifier (PA) design that provides a one-size-fits-all solution for next-gen communication and sensing systems due to the diversity of applications and their associated PA specs (eg output power, linearity, bandwidth, and back-off efficiency). The goal of this workshop is to explore leading mm-wave and sub-THz applications and the associated PA specs for these systems. The applications of focus are massive MIMO and large-scale phased-arrays, sub-orbital satellite communication (SATCOM), and mm-wave radar. A balanced mix of both industry and academic perspectives will be provided, offering both a high-level familiarization of the application and associated specifications, along with deeper technical dives into PA design techniques in modern process nodes.
Interconnect bottlenecks have been a long-standing grand challenge over decades, caused by the increasing gap between exponentially growing data generation and transmission demand, and slowly-increasing supporting data bandwidth supply. Both Electrical Interconnect (EI) and Optical Interconnect (OI) have been investigated extensively to try to combat the challenge, however, both of them face their own inherent constraints. The newly emerging sub-THz/THz Interconnect (TI) aims to complement the existing EI and OI to close the interconnect gap. This workshop plans to bring experts from different domains, OI, EI, and emerging TI, to discuss the challenges, opportunities and best use scenarios of each interconnect scheme.
Owing to superior electrical and thermal properties of GaN-on-SiC material systems, tremendous progress has been made on GaN-based transistor and MMIC technologies. Advanced heterostructure material designs, epitaxial growth techniques, and transistor scaling processes enabled GaN MMICs to extend their applications from microwave to mm-wave frequencies (up to W-band). Next-generation RF systems require high efficiency and high linearity for more complex modulation schemes to support very high data-rates. The traditional trade-off among efficiency, linearity, and power density imposes performance limitations on GaN MMICs, which become more pronounced at mm-wave frequencies. In this workshop, world-leading experts will discuss the present status, challenges, and future perspective of mm-wave GaN transistor and MMIC technologies, covering emerging materials and devices, device modeling, thermal management, reliability, and circuit designs.
Wideband measurement and characterization techniques at microwave and mm-wave frequencies are becoming increasingly demanding to satisfy the specifications of the ever-evolving communications and radar industry. This workshop presents recent research and technology advancements from industry, research centers, and academia, by discussing relevant performance metrics and their experimental evaluation across different hardware platforms. Advanced characterization techniques are presented for transistors, power amplifiers, and beamformers, encompassing over-the-air testing, linearity, load-pull, and calibration of precision radar. The first half of the workshop is dedicated to state-of-the-art wideband device characterization techniques and load-pull. The second half of the workshop is focused on beamformers and over-the-air characterization techniques and standards. Both the morning and afternoon sessions of this workshop will end with open interactive discussions useful to outline future trends and research on these topics.
Advances in materials, fabrication, modeling, and test have enabled devices that achieve new functionality through coupling of multiple physical phenomena. These devices combine piezoelectric, ferroelectric, magnetostatic, acoustoelectric, and other physics to achieve performance beyond that of mass-produced bulk and surface-wave devices. These unique attributes provide potential for significant impact on future RF applications. Interactions between different types of physics provides coupling and exchange of energy between complementary mediums and modes. Examples include integrating piezoelectric and semiconductor materials to couple acoustic and electronic traveling waves, integrating ferromagnetic and piezoelectric materials to couple acoustic and magnetic domains, incorporating ferroelectric materials to change and tune piezoelectric orientation, and strain tuning of magnetostatic waves. Devices using these effects provide the potential for miniature high-Q tunable resonators and filters, non-reciprocal devices, and single-chip analog signal processors. This workshop will provide perspectives on the physics and application potential for these technologies.
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CMOS radios continue to evolve so as to satisfy the demands of new applications. Below 7 GHz, cellular and WiFi standards have been pushing the performance to support increasingly higher data rates while consuming less power. Such endeavors require novel architectures that also lend themselves to efficient circuit design. In addition, new radios have emerged around 30 GHz for 5G, around 60 GHz for WiGig, around 140 GHz for 6G, and around 300 GHz for sub-terahertz communications. Each of these frequency bands presents interesting and unique challenges, but a unifying principle among them is the need for beamforming.
This presentation deals with recent developments in receiver design for this broad range of applications. We examine the shortcomings of standard direct-conversion architectures and draw concepts from the state of the art to improve their performance. We also contend that heterodyne reception may outperform direct conversion in some cases. We then study beamforming techniques with emphasis on solutions that draw minimal power.
CMOS radios continue to evolve so as to satisfy the demands of new applications. Below 7 GHz, cellular and WiFi standards have been pushing the performance to support increasingly higher data rates while consuming less power. Such endeavors require novel architectures that also lend themselves to efficient circuit design. In addition, new radios have emerged around 30 GHz for 5G, around 60 GHz for WiGig, around 140 GHz for 6G, and around 300 GHz for sub-terahertz communications. Each of these frequency bands presents interesting and unique challenges, but a unifying principle among them is the need for beamforming.
This presentation deals with recent developments in receiver design for this broad range of applications. We examine the shortcomings of standard direct-conversion architectures and draw concepts from the state of the art to improve their performance. We also contend that heterodyne reception may outperform direct conversion in some cases. We then study beamforming techniques with emphasis on solutions that draw minimal power.
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Ultra-Low-Power (ULP) wireless communication technology provides many unique features over conventional wireless communication such as high energy efficiency, low cost, small form factor, large scale deployments, reconfigurability and simple architecture. This workshop will bring together experts from academia and industry to highlight recent works and applications in this exciting technology. In the first topic, we are going to review the industry impacts on the most successful and large-scale commercialization using ULP wireless communication technologies such as RFID and Near-Field Communication (NFC). After that, we are going to shift our focus to recent research advances in using RF backscattering techniques in Reconfigurable Intelligent Surface (RIS) and WLAN/BT connectivity solutions. In the last topic of this workshop, we will discuss recent advances from medical, industrial and academic fields in biomedical implants with technologies such as co-optimizing antenna and RFIC to miniaturize radio module volume. Unconventional wireless propagation methods are also introduced, such as body channel communication, Magnetoelectric, ultrasound, etc.
Thanks to the extended body biasing feature, FD-SOI process has enabled new system and circuit design techniques to improve the RF and mmW system performance drastically. Tremendous industry collaboration efforts have committed to bring up the FDSOI to higher volumes of production to serve the wireless, IoT, and automotive market in near future. This workshop includes an overview introductory presentation followed by 4 talks on FDSOI technology and its design examples for RF and mmW applications. The introduction provides the overview on FDSOI technology and its benefits for analog/RF/mmW circuit design, focusing on technology perspective. The following three talks demonstrate RF and mmW system design examples using FDSOI technology, for 5G as well as for ULP IoT. The last talk reveals the advanced FDSOI process design roadmap and what is to expect in near future.
This workshop will cover various recently developed technologies and the state-of-the-art performance in wafer-level integration and packaging technologies and manufacturing techniques with challenges and possible future directions and solutions. In particular, it will highlight the latest advances in the areas such as embedded wafer-level ball grid array (eWLB) technology for system integration with high Q interconnects and passives in thin-film Re-Distribution Layers (RDL), wafer-level heterogeneous integration of different substrates, BiCMOS embedded TSVs, sub-THz on-chip antenna integration, innovative Fan-Out technologies for wafer-level package, RF IPD, and FOSiP, and embedding various chips within the silicon Metal-Embedded Chip/Chiplet Assembly. Further, the workshop will present the practical realization of highly integrated systems, including 60GHz and 77GHz eWLB transceiver modules with integrated antennas, 3D wafer-level packaging for mm-wave and sub-mm-wave space systems, and hetero-integration technology solutions to enable a full 2D array of phased array systems above 120GHz.
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This session presents the latest advances in state-of-the-art optical receivers, dielectric waveguide links, and high-speed converters.
This session discusses state-of-the-art silicon-based front-ends and building blocks from sub-6GHz to sub-mm-wave frequency range.
This session presents four transceivers and beamforming RFICs for 5G and mm-wave applications. The first paper is a V-Band 4-channel transmitter beamformer in 28nm CMOS with an OP1dB of 10.8dBm. The second paper is a dual-band 28/37GHz reconfigurable beamforming RFIC in 28nm FDSOI. The third paper is a 4×2 2D Butler matrix switched-beam chipset for 5G application in 28nm CMOS and the final paper is a phased array receiver front-end in 28nm FDSOI with a NF of
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RF Power Amplifiers (PAs) play a dominant role in the system performance of wireless transmitters. PA designers are faced with the intractable goal of providing simultaneous high linearity and efficiency, as communications standards adopt ever higher modulation orders and bandwidths. Traditional PA design begins with a non-linear transistor model based on CW measurements. When the PA is measured under the desired modulated signals, degraded performance compared to simulation is commonly observed. Commercial adoption of phased arrays increases the disparity between traditional simulation and realistic measurements; coupling between antenna elements affects the PA performance in ways not accounted for in simulation. This workshop presents the next steps in improving design using modulation characterization to optimize global realistic performance of a system of PAs. The goal is to provide theoretical and practical background that can be applied directly at the lab bench. The workshop includes a practical demonstration using a commercial GaN device.
The evolution of communication technologies in recent years has required more and more performing subsystems and devices. The proposed workshop is focused on the latest solutions devised for the filtering subsystems required in the latest generation of communication systems. Developing these subsystems is challenging, expensive and increases time-to-market for new equipment. The scope of the workshop is to show how a synthesis-based approach may beneficially affect the development of new filters (as an alternative to brute-force optimization of full-wave models). In the first part of the workshop, five presentations show novel synthesis solutions for filters used in modern and future communication systems. In the second part, the goal is to involve interactively the audience showing the synthesis of some previously introduced filters, using an in-house developed software. This interactive moment is conceived to highlight the benefits of a synthesis-based design approach and familiarize attendees with this technique.
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Artificial Intelligence (AI) and Machine Learning (ML) have transformed technologies across all sectors and are offering solutions to many complex problems. In RF design, many AI/ML-based solutions have been proposed. This workshop brings researchers from both academia and industry to discuss how the newly developed AI/ML algorithms can be used in RF Power Amplifier (PA) design and Digital Pre-Distortion (DPD). The topics include using multi-dimensional search algorithms to automate matching network synthesis, post-layout generation using fully automated optimization methods, AI-based signal control technology and deep learning based inverse design in mm-wave PAs. We will also discuss the latest development of DPD algorithms using machine learning, including DPD model simplification, long term memory effect compensation, model extraction data selection, closed-loop adaptation and neural networks based DPD for linearizing multi-band MIMO phased array transmitters.
Availability of high-volume, extremely low-noise transistor VLSI technologies with minimum noise figures as low as 0.2dB (Te, min 14K) at Cellular, WiFi and SATCOM frequencies challenge existing noise metrology practice. State-of-the-art device noise metrology systems are unable to provide system architects and technology developers the ability to clearly discern performance of one device technology over another at these low noise levels. Recent investments by the EU and the US governments in semiconductor manufacturing including RF, microwave and mm-wave applications underscore the need and opportunity for further public-private collaboration in this area. This workshop begins with the motivation for extremely low minimum noise figure technology from applications such as LEO SATCOM and remote sensing, followed by technology developers’ experience with existing metrology practice, culminating with discussions on ways forward from commercial vendors and NIST.
This workshop will provide a comprehensive overview of the latest results on sensing, monitoring and characterization capability of RF/microwave-based devices operating from 30MHz to 300GHz. Microwave-based sensors have demonstrated great potential for non-destructive and non-ionizing monitoring of physical parameters and characterization of materials in liquid and solid phases. The main advances and results in this multi-disciplinary field, involving chemistry, material science and microwave engineering, will be illustrated. Microwave resonator sensors, RFID sensors, and antenna-based sensors for non-destructive, non-ionizing and contactless sensing and characterization applications will be covered, to provide the audience with an in-depth understanding of the subject, and of the potential synergies among different approaches.
Microwaves have a vital role to play in a diverse collection of emerging application areas far beyond wireless communications and conventional microelectronics, spanning from quantum computing to energy storage to medical diagnostics. To unlock these potential applications, reliable microwave measurements are critical. Quantitative, functional data is required at each step of development to transform conceptual designs into fully engineered, validated, and optimized products. While microwave measurement techniques are generally well-established, new applications that are emerging today present new measurement challenges. This workshop will explore the current state-of-the-art in microwave metrology techniques that are extended to new and novel measurement environments and scenarios. The event will bring together researchers from across academia, industry, and government laboratories who work in varied application spaces. While these emerging applications may appear disparate, convening experts for detailed discussions of their microwave measurement challenges may uncover previously unseen connections and commonalities.
In recent years significant advances have been made in quantum computing, quantum sensing, and quantum communications. Circuit quantum electrodynamical models provide tools for modeling quantum devices. Superconducting electronics exhibit special quantum properties and, when monolithically integrated, extend the possibilities for integrated microwave circuits and devices, deeply rooted in microwave engineering, to a quantum level. For RF microwave engineers, this signifies an extension and transfer of microwave engineering concepts to the quantum realm. Using quantum circuit electrodynamics, key devices in microwave quantum engineering can be modeled. On the other hand, within quantum computing (QC), new quantum-based algorithms can harness problem-solving also in electromagnetics. In recent years, the remarkable progress made in QC hardware has defined a new, Noisy Intermediate-Scale Quantum (NISQ), QC era. By exploiting fundamental properties of quantum mechanics, these QC systems have the potential to deliver significant speedup against classical computing hardware for solving hard electromagnetic problems.
Reflectarrays, invented in the 1980s, have been predominantly used for satellite communications, high-speed imaging systems at 24GHz (airport security systems) and for mm-wave radars. Recently, they have been proposed as programmable reflect surfaces for 5G communication systems, and renamed as “Intelligent Reflect Surfaces” or IRS. This workshop presents the previous work in this area, and the new work being done from 24GHz to 300GHz. Some of the new work is geared towards large reflect surfaces for 5G/6G, some towards THz imaging systems, and some towards space applications. What is important is that with new low-loss silicon technologies and the high level of integration offered by silicon, one can now demonstrate large, low-power, low-loss reflect surfaces. The new reflectarrays are expanding this classic steerable antenna technology to a wide range of application areas spanning 5G, 6G, FMCW radars and THz systems.
The complexity of the requirements in advanced 5G and forthcoming scenarios has a direct impact in the design of acoustic wave filters. Latest developments have pushed acoustic technology to an unprecedented situation that requires facing the incoming challenges from different perspectives. Taking this into account, the workshop aims to present the latest developments related to synthesis methodologies, linear and non-linear modeling, reconfigurability, and new orthogonal markets that may consider the use of acoustic wave resonators. The affiliation of the presenters will give the talks a more industrial focus, but also with an academic approach which may contribute to a more enriching discussion.
This workshop will address a timely subject of low-phase-noise and high-stability microwave oscillators that are key building blocks of virtually any RF/microwave system. State-of-the-art low-noise and high-stability microwave oscillators are particularly important in high-speed telecommunications, wireless spectrum management and high-resolution imaging systems. Overall performance of most microwave subsystems depends on, and is often limited by, phase noise fluctuations in oscillators. In respect to phase noise and stability performance, designers primarily rely on ovenized crystal oscillators. However, recent advances in using other physical principles and materials are expected to enable oscillators with performance never imagined before. Various oscillator types, techniques, new materials along with their main characteristics will be reviewed.
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In this session, GaN FET modeling using artificial neural network as well a paper comparing various industry GaN models will be covered. A new T-gate RFSOI device method is explored for improved LNA device. Finally, layout tradeoffs using ALIGN software tool will be presented.
This session discusses state-of-the-art III-V front-ends and building-blocks including GaN wideband switches and front-end modules along with a InP sub-mm-wave receiver.
This session covers RF and mm-wave systems that span applications in space technology, D-band communications, all the way to biomedical implants. The session starts with an invited paper from NASA JPL on CMOS-based mm-wave spectrometer for performing scientific studies in space. The second paper covers scalable wafer-scale TX/RX phased array at 140GHz, while the third paper presents a baseband to D-band transmit module. The session wraps with an innovative millimeter-sized implantable glucose sensor using a fluorescent hydrogel.
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Augmented-reality contact lenses, cochlear implants, AI-aided earbuds, and thought-activated prosthetics have already demonstrated the restoration and enhancement of human capabilities, and the incorporation of artificial intelligence (AI) into these technologies can further increase their potential.
This lunchtime panel will host academia researchers and industry pioneers who are developing these technologies and will debate how they will affect our near- and long-term lifestyles.
In all lunchtime panel sessions the audience will be able to submit questions and be polled via Slido.com. You may also submit questions ahead of time for a particular session by using the code that is associated with that session.
The Sli.do code for this session is: #2728204
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The session focus is on reference clock and Phase-Locked Loop (PLL) design techniques for RF and mm-wave applications, starting with the introduction of a novel current-reuse coupled mixer phase detector, followed by design techniques for radiation hardened PLLs, then a fast-startup reference oscillator based on phase-aligned clock is introduced, and to conclude, a transformer-coupled BAW oscillator with very low jitter is presented.
This session discusses state-of-the-art silicon-based mm-wave reconfigurable/wideband and sub-mm-wave gain-boosted/wideband low-noise amplifiers (LNAs).
The session presents high-performance systems and circuits operating above 140GHz. A 140GHz OOK transceiver shows 26Gb/s data-rate in 28nm CMOS and a 400GHz system presents a multi-Gb/s link using PIN diodes in 90nm SiGe. A gain-boosted amplifier achieves high gain per stage at 190GHz in 65nm CMOS and a multiplier/amplifier chain transmitter demonstrates high output power and efficiency at 320GHz in 130nm SiGe.
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Active array antennas have become mature technology in communication and radar applications. The spatial radiation characteristics are typically measured “over the air” using anechoic chambers and positioning gear to perform far- or near-field measurements. These approaches have long been used by engineers to characterize classic, passive antennas while measurements of RF front-ends and baseband circuitry could be performed conductively, bypassing the antenna. As frequencies continue to increase to sub-THz, designers need to integrate antennas with beamforming chips, making a separate characterization of antennas and RF chips impossible. Additionally, the classical methods do not scale well to test the high volumes that will come with active antennas becoming more ubiquitous. The classical methods are slow, large and mechanically challenging, all driving up the test cost significantly. This workshop highlights key advances in alternative multi-probe testers, near-field sockets, and quantum-sensing probes to overcome these limitations.
Applications of microwave power span an increasing number of research and industrial sectors. They include the widely known microwave heating, cooking, sterilization, vulcanization, etc. Microwave sintering of particulate materials, microwave plasma generation, microwave acceleration of chemical reactions for applications such as waste treatment are among the new disciplines showing the potential for new efficient technologies. Additionally, traditional S-band magnetron high-power sources are being challenged by semiconductor technologies that have some advantages, but are still more costly. The workshop has speakers from industry who will compare existing technologies, discuss the most recent applications, and multiphysics tools used to address them. One academic talk will discuss the main fundamental challenges on a few examples such as pyrolysis of mixed waste.
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This session presents recent advances in CMOS frequency multiplication techniques for mm-wave applications. The first two papers discuss circuit solutions to improve the power efficiency of mm-wave frequency doublers. The last two papers present techniques for harmonics rejection applied to a tripler and a quadrupler for E- and W-band applications.
Techniques in this session represent advances in wireless connectivity for NB-IoT and WiFi radios. For NB-IoT radios, advances in the state-of-the-art are presented with a sub-mm-wave receiver. For WiFi radios, this session presents a multi-beam phased array receiver in C-Band, a tri-band transceiver supporting 4096-QAM modulation, and a transmitter utilizing a 2-duty cycle harmonic rejection mixer for C-IMD3 linearization while consuming only 20mW of power.
This session will present four power amplifiers for the 5G mm-wave frequency range. The first two papers improve the bandwidth of the Doherty operation by using novel power-combining techniques. The first paper, implemented in 45nm SOI, implements a role-exchange of different main and auxiliary PAs over frequency. The second paper, implemented in 40nm CMOS, synthesizes a broadband Doherty combining network. The third paper in the session highlights the layout challenges for output combiners and presents 256-QAM measurements in 65nm SOI. The last paper achieves very low AM-PM by utilizing varactors and second harmonic traps in 40nm CMOS.
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Mobile cellular subscribers reached more than 6 billion in 2022 and 5G NR brings high data capacity as low latency using sub-6GHz and mm-Wave spectrum. The proliferation of worldwide smartphones has been in part possible due to increase computational power of CMOS in 3nm/5nm nodes. There is a shift in terms of what parts of the RF system are portioned in advanced CMOS nodes and what blocks are left and integrated in a RF front end module (RFFEMs). The workshop presents RFFEM architectures currently used and the challenges for the 5G deployment as well the evolution to 6G.
Most designs cannot justify s small node processes, nodes
This session presents LO generation solutions spanning from RF to THz frequencies, implemented in a wide diversity of silicon technologies. The first paper demonstrates a 15.6GHz multi-core VCO in 8nm FinFET achieving excellent phase noise and wide tuning range. The second paper presents a 10.8–14.5GHz 8-Phase LO Generator with Automatic Phase-and-Duty-Cycle Calibration for N-path receivers in 28nm CMOS. The third paper brings in a high fundamental rejection inductor-less frequency-doubler, operating from 2 to 20GHz in 45nm RF-SOI CMOS. The last paper discusses a 0.4THz single-element radiator in 90nm SiGe BiCMOS, based on integrated PIN diode excitation at 100GHz.
Several novel techniques for self-interference mitigation are presented, including cancellation of interference caused by one transmitter to another in a dual-radio SoC, a distributed cascode power amplifier for full-duplex wireless, advances in frequency-domain-equalization-based wideband self-interference cancellation, and low-noise self-interference cancellation in a receiver.
This session reports circuits and systems advances in the mm-wave and sub-THz bands, covering topics from radar sensing to metrology. We start with three papers on advances in the 76–81GHz radar sensors. The first paper showcases a 5.5dB NF radar receiver in a 16nm FinFET followed by a wirelessly synchronized mono-/multi-static radar system. An 8dB NF mixer-first radar receiver with -5dBm IP1dB is also presented. We close with a focus on sensing advances at 160GHz operating frequency detailing a 0.05% resolution permittivity sensor at a 14µs integration window utilizing a whispering gallery resonator and multifold noise reduction techniques in 28nm CMOS, followed by an 18GHz tuning range 130nm SiGe/BiCMOS full-duplex radar transceiver.
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The roll-out of 5G networks is in full swing, academia and key industry players already look into what may become the next generation of wireless communication, aka 6G. The support of THz frequencies is one of the revolutionary aspects that dominate current research worldwide. The hunger for higher data rates demands access to wider bandwidths, which causes the research community and industry to push into the (sub-)THz regime. The D-Band (110 to 170 GHz) is a first hot candidate.
The proposed workshop focuses on actual research activities looking at semiconductor technologies, RF transceiver design and test approaches.
Analog Devices and Richardson RFPD are designing .01-20GHz, small, multiport, network analyzer signal chains for industrial, portable and production test applications. .01-20GHz network analyzers are complicated, which translates to being large and expensive. ADI has released the ADL5960; a .01-20GHz, integrated vector network analyzer front end on a chip, which enables small network analyzers. The design accelerators include all components necessary for a network analyzer; including highspeed converters, FPGA, signal generation, and the ADL5960. The designs goal was to remove our customers risk and reduce their design time. We will be discussing and demonstrating the designs at the workshop.
This session shows the application of CMOS technology in several emerging applications. Within quantum technologies, an RF transmitter enabling magnetic sensing employing NV centers in diamond is demonstrated, followed by a cryogenic wireline transmitter for quantum processors. The next paper shows how silicon photonics can be employed to enhance the performance of an RF receiver. Finally, a mixer-free built-in self-test (BIST) method for phase and amplitude calibration of a beamforming IC is presented.
This session will focus on the system design and circuit implementation of mm-wave transceivers tailored for 5G and Satellite Communication (SATCOM) systems. The first paper proposes a dual LO topology, which simplifies complexity of digital and baseband sections in phased array systems. The second paper focuses on a multi-channel phased array at 39GHz with improved power amplifier efficiency. The third presentation describes the highly integrated baseband and IF section of an mm-wave radio for 5G, while the last presentation discusses an ultra-wide-band RF receiver with excellent NF, designed for SATCOM applications.
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There is growing interest in the potential of digital engineering, and more specifically Model Based Systems Engineering (MBSE) and digital twins, to shorten product development lifecycles and reduce costs. A primary benefit of such an approach is a SHIFT LEFT, such that many end-end system-level performance, interoperability, and security issues may be investigated earlier in the product development lifecycle than is typically the case using the traditional V-based design model.
Digital Twins (DT) leverage high-fidelity software models of physical systems to support design, test, and lifecycle management of complex systems in an efficient and comprehensive manner. A DT uses simulation and emulation but differs from them in that the DT continuously learns and updates itself from multiple sources to represent the near real-time status and operating conditions of the corresponding real-world system. A Network Digital Twin (NDT) is a digital twin of a communications network which uses real-time data to enable understanding, learning, and reasoning across its lifecycle.
We use integrated digital twins (IDT) to mean a digital twin that consist of three primary layers:
• a software or services twin that represents the middleware and services that must directly satisfy the application-level Service Level Agreements or SLAs
• a network digital twin that models the dynamic end-end communication path over a potentially heterogeneous network incorporating the protocols at the transport, network, link, and physical layers, and
• an RF digital twin that captures the behavior of the transceiver devices, antennas, and the signal propagation among communicating neighbors
By constructing the IDT in the early stages of system design, perhaps by leveraging MBSE tools and methodologies, system designers and developers can also maintain a trace of the requirement flow from the initial system specification to the final deployed system.
In this technical lecture, we will present the concept and primary components of an IDT. We will also demonstrate the application of an IDT to design complex systems using a 5G Non-Terrestrial Network (NTN) as an example case study. NTN design and architectures are being standardized by the 3GPP as an integral part of the 5G infrastructure. Broadly speaking, an NTN refers to a 5G network that includes a segment spanning non-terrestrial objects (e.g., High Altitude Platforms, or HAPS, and satellites) which may optionally host a base station. Various attributes of an NTN like the long communication delays, ground-air/space propagation links, and handoff among space-based platforms, make them an interesting case study for an IDT. Using this case study, we will both present an overall methodology for how the IDT can be applied to look at end-end performance of an NTN from the purview of applications like streaming videos, and describe the composabiity of models from the RF, network, and services domains. The case study will also illustrate how IDTs can support the Shift Left approach to early investigations of end-end system-level performance, interoperability, and security issues.
Towards the end of the talk, we consider areas for ongoing research including multi-fidelity models, model composition, automated model generation, and model scalability.
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The use of machine learning (ML), or more broadly, artificial intelligence (AI), has already been demonstrated in a wide range of applications, including even music composition and artistic design. This lunchtime panel, with both industry and academia experts, will explore how we may harness AI in wireless system design and operation, and will attempt to distinguish hope from hype.
In all lunchtime panel sessions the audience will be able to submit questions and be polled via Slido.com. You may also submit questions ahead of time for a particular session by using the code that is associated with that session.
The Sli.do code for this session is: #2902242
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Massive MIMO radio is a key enabling technology of 5G networks. mMIMO radios are highly complex and integrated. The number of transceivers on a mMIMO radio can be 10-200 times more than a 4G radio. Baseband, RF front-end, and antenna are integrated in one unit. OTA and ORAN testing are two salient challenges in mMIMO radio manufacturing. In this workshop, the presenters will first analyze the problems from radio design and test system development perspectives. Then they will provide an automated solution to fast mMIMO radio calibration and testing in a compact OTA chamber with an integrated ORAN emulator.
There are challenges in dealing with device behaviors at different design levels- from device physics to application specifics and system level interactions. In this workshop, an overview of the Wolfspeed design process, from technologies to systems will be presented. From material to technology, and the final product; each development step involves simulation analysis to understand the design parameter interactions impacts on systems. The design process usually involves trade-offs in order to achieve the optimum performance. Strategically choosing the right design tools and modeling strategy is the key to unlocking the superior quality of the technology.
This session includes four papers on mm-wave key components and receivers. It starts from a compact active quasi-circulator with ultra-wideband TX to RX isolation over 20–38.5GHz in 28nm CMOS. The second paper presents a new D-band phase-shifter concept based on delay manipulating and achieves RMS phase-error of 1.2 degrees without calibration in 45nm RFSOI. The next two papers are high-performance receivers. The first paper presents a 140GHz 4-element RF beamforming receiver, achieving >20dB IRR with 8GHz channel bandwidth in 22nm FDSOI. The final is an N-path filter based block-tolerant receiver with
In this session, we present papers addressing IoT transmitter and sub-THz PAs. The first paper presents a passive mixer in 22nm FD-SOI technology for low-power cartesian transmitter. The second paper showcases a D-band SiGe HBT PA module providing high output power (>20dBm) and linearity from 110 to 170GHz. The third paper demonstrates a transformer-based InP HBT PA with high linear power (20dBm) and efficiency (>20%) in D-Band. The last paper presents a SiGe HBT PA operating at 300GHz in a 130nm BiCMOS technology using capacitive feedback.
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Phased array antenna modules (PAAMs) require OTA tests to measure EIRP and EIS in addition to the traditional radiation patterns. Anechoic chambers are permanently in use because they are also needed for FW/SW testing.
Fujikura develops 5G FR2 PAAMs with integrated ICs for beamforming, frequency conversion, and filters. They built their direct far-field chambers for radiation patterns and OTA tests.
Rohde & Schwarz and Avnet automated mmWave RFSoC testing.
In this workshop, the three companies will validate a CATR benchtop test system for the 5G FR2 PAAM R&D test. Metrics include ACLR, EVM, AMAM, AMPM with and without DPD.
GaN HEMTs are leading candidates for high frequency high power amplifiers for 5G/6G base stations. TCAD simulation helps GaN device developers optimize epitaxial structure and layout parameters to achieve transistor DC and small signal (Ft) targets. The TCAD simulation generates I-V, C-V, S-parameter curves and large signal power sweeps. ASM compact model parameters are extracted from the TCAD simulation data, from which the PA circuit design is optimized with HB load pull simulation. The device-level insights into nonlinearity physics are revealed by Fourier coefficients of solution variables.
This session is dedicated to industry presentations. The first presentation will be on recent research results on D-band circuits and systems implemented in 55nm SiGe BiCMOS technology. The second presentation will discuss thermal challenges in GaAs PAs for 5G applications. The last talk will present recent results on PAs implemented in 22nm FDSOI technology with EDMOS.
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With 80% of new product features delivered via electronics and 50% of a program's delivery time spent on system integration, IMS has asked INCOSE (International Council On Systems Engineering) to provide an introduction to Model-Based Systems Engineering (MBSE) application to electronic systems to enable continuous electronic systems integration. The Workshop will begin with an introduction to MBSE followed by application of MBSE to electronic systems; flowing product functions from systems to silicon and back for closed loop continuous integration to deliver electronics-driven features on-time, on-schedule.
The talk will show the best methods for setting up, calibrating, and evaluating measurement performance for measurements spanning WR15 (75 GHz) to WR1 (1100 GHz) over a broad (-40 to 125c) temperature range. This includes approaches to conveniently swap waveguide bands.
We will discuss test executive approaches for multi-wafer over-temperature testing, both using commercial test executives and programming examples using FormFactor Inc. WinCalXE and Velox software to automate on-wafer data measurement and analysis
Single-sweep measurements from 900 Hz to 220 GHz will be highlighted along with measurements at elevated temperatures.
Examples in Wincal itself and supporting video will be provided
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The availability of advanced node silicon ICs for RF front ends and highly integrated system-in-package (SiP) technologies are enabling millimeter-wave (mmWave) phased array systems for commercial applications. This workshop explores recent developments in design, analysis and implementation workflows supported by EM/thermal analysis, RF circuit/antenna co-simulation, and phased array synthesis to address silicon-to-antenna co-design. A comprehensive top-down system design methodology is presented and demonstrated with a front-end module (FEM)/antenna-in-package (AiP) design for 5G mobile applications targeting 24 to 29 GHz. The system requirements that drive antenna/front-end architectural decisions for mmWave applications, antenna optimization, and array configuration and generation will be discussed.
This workshop discusses and demonstrates an extension to a Vector Signal Generator (VSG) to accurately generate a desired broadband modulation signal at a defined plane of a device under test (DUT), possibly on wafer. The technique ensures the stimulus signal delivered to the DUT is ideal, enabling characterization of non-linear devices while minimizing the signal generator’s contribution to key figures of merit, such as EVM and ACPR. This technique eliminates critical measurement uncertainties present in today’s VSG + Vector Signal Analyzer setups. It is possible to extend into high-power signal generation, impedance measurement and matching applications and more.
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Spaceborne RF high power amplifiers (HPAs) are key building blocks used in telecommunication, navigation, remote sensing, science and human spaceflight applications. Due to their limited efficiency, they often play a central role in the electrical, thermal and mechanical design of complete instrument and payloads onboard the spacecraft.
The aim of this technical lecture is to provide, through a real-case scenario, a comprehensive insight of solid-state power amplifiers including key semiconductor technologies and trade-offs, basic principles of HPA operating modes, traditional architectures used in space systems, step-by-step design and integration aspects, validation activities as well as development challenges brought by the different application domains.
The technical lecture aims at being an entertaining and interactive forum where participants will have the opportunity to exchange throughout the lecture.
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Through both lecture material and instructor-led demos, workshop participants will learn about modeling and simulating antenna-array designs, explore phased-array beamforming concepts and beamforming ICs, and examine real-world impairments and their effect on system performance. Radar design examples will be used to tie the signal processing theory to practical applications.
Workshop discusses results of iNEMI 5G/mmWave project on developing permittivity standard reference material (SRM), allowing industry for calibrating high frequency dielectric characterization tools spanning 10 to 120 GHz. SRM candidates are tested with industry acknowledged material characterization techniques within round-robin routine involving 8 laboratories worldwide. Testing results support development of traceable reference sample. Consortium efforts are in parallel directed to developing roadmap on 5G/6G materials and electrical test technology. Workshop comprises four presentations (5G industry needs and project goals, standardization efforts for traceable material standard, round-robin results, roadmapping efforts) supported with hands-on exercises (involving Keysight and QWED equipment, NIST SRM candidates).
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This workshop presents step by step approach to create a system level digital twin using Keysight’s SystemVue software and COTS hybrid beamforming system hardware from Analog Devices Inc. The X-Band Phased Array Platform is a scalable 32 element hybrid beamforming phased array development platform developed by Analog Devices. The workshop will discuss the hardware architecture and take a deep dive into the steps required to simulate a digital twin in SystemVue including device, sub-system, and system level modeling. The audience will be able to walk away with sufficient knowledge to explore creating their own phased array digital twins.
Analog Devices Instrumentation Group along with SignalCraft and Richardson RFPD are working on Modular DC-44 GHz transmit and receive signal chains for Wireless Test Systems to support the latest standards like 5G, Wi-Fi 6 &7, and UWB. The blocks include all components necessary for signal generation and capture including; up conversion/multiplication, amplification, switching, and filtering. The blocks are designed to remove risks for our customers and accelerate their time to market. We will be discussing and demonstrating the blocks at the workshop.
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In this presentation, a specific GRIN (GRadient INdex) lens design workflow is shared from concept, through simulation, fabrication, test, and analysis. This cylindrical Luneburg-like lens is applied to the focal distance of a standard gain horn to increase the total gain from 20dBi to over 25dBi at a lower weight and smaller footprint than a pure 25dBi horn. Fortify’s FLUX CORE printer paired with Rogers Radix(TM) 2.8 low-loss photocurable polymer are the enabling technologies for the production of a structure with traits of high resolution and low power absorption that make the above performance possible.
Emerging 5G/6G, radar, EW, SATCOM, and instrumentation antenna-to-bits architectures necessitate careful design tradeoffs due to mmWave band sensitivity. System designers must preserve channel signal integrity (SI) while optimizing component selection at reasonable cost. Simulating and testing system architectures at the electrical and protocol layers demands engineering expertise from RF, phased-array antenna design, SI, embedded software, DSP, FPGA and test. In this Industry Workshop, technical experts from Otava, Samtec, MathWorks, Avnet, and Rohde & Schwarz address the challenges of mmWave system design, detailing the interplay between simulation models and real-world signals through design flows that foster collaboration within multi-disciplinary engineering teams.
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The evolution of 5G and the need for increased capacity drive new transmitter requirements. Power amplifiers must support large instantaneous bandwidths further extended by carrier aggregation, combined with high power and reduced consumption. This workshop introduces a workflow to combine state-of-the-art PA measurements with behavioral models and prototypes for accelerating the design, optimization, and testing of linearization techniques before the entire system is available.
We will introduce recent trends in PA architectures and identify linearization techniques, such as DPD, based on hardware characterization and behavioral models to tradeoff design parameters and improve ACLR, EVM, and other metrics for 5GNR waveforms.
Wireless systems - from Wi-Fi to 5G FRX, UWB and several others - need to evolve fast in order to connect an ever growing number of users - people but also smart things - and applications with excellent QoS and QoE. Furthermore, changing regional regulations, e.g. spectrum usage, add to wireless systems products time-to-market constraints.
Addressing such constraints requires a comprehensive system design methodology supported by proven semiconductor technologies. This workshop will provide guidelines on the use of performance and supply proven engineered substrates for RF and mmWave to implement a comprehensive Front-End Module design methodology.
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This lecture will enable audience to design and analyze modern portable radar systems for healthcare and IoT applications. It will develop understanding of the fundamentals of smart radar systems. The audience will be exposed to various radar systems including Doppler, ultra-wideband, frequency shift keying, and frequency-modulated continuous-wave radars. Furthermore, the audience will be exposed to the fundamentals of synthetic-aperture radar, inverse synthetic-aperture radar, and pulse compression radar. A few examples based on interferometry, Doppler, and FMCW modes at 5.8 GHz, 24 GHz, and 120 GHz will be discussed. Then, the mechanism and applications of nonlinear radar sensing technologies will be illustrated. Case studies at this exciting human-microwave frontier will be given on physiological signal sensing, non-contact human-computer interface, driving behavior recognition, human tracking, and anomaly detection.
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Phased array Antennas, Frequency Selective Surfaces (FSS), and several other microwave devices are based on periodic arrangement of element structures. Explicit simulation of these devices is usually computationally demanding, and sometimes impossible within the available resources.
ANSYS HFSS has powerful features to enable efficient simulation of periodic structures. It also allows a user to break the periodicity and come up with innovative semi-periodic arrangements of the elements.
We will present this workflow through examples of phased array antennas with Radom, and semi-periodic FSS simulations.
The new generation of broadband satellite communications equipment must meet specifications over large instantaneous bandwidths and significant channel impairments. These radio systems are being built around multi-channel active antenna arrays requiring complex digital signal processing algorithms for calibration, channel corrections, and beamforming.
This workshop introduces a model-based design methodology combining hardware measurements to accelerate the design, optimization, and testing of mmWave wideband radios before the entire system is prototyped. We will use hardware and software examples to optimize the full phased-array signal chain performance, trading off design parameters to achieve acceptable ACLR and EVM for very wide waveforms.
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There have been significant advances in the application of quantum technologies with several examples demonstrating the feasibility of what a few decades ago were only theories. However, key challenges still remain as a barrier to fully realizing the advantages brought by quantum technologies. One of the main challenges to overcome is scaling up quantum systems by several orders of magnitude. For instance, as the leading approach in quantum computing relies on superconductors and microwave signal processing, exploring options in packaging and interconnects for superconducting applications in the 4K and mK range is necessary. This workshop offers the opportunity to hear from multiple speakers that are actively working in the areas of microwave packaging and interconnects for superconducting application to face the challenges ahead.
With the development of high performance semiconductor nodes and emergence of 5G and 6G systems, significant advances have been achieved in electronically scannable mm-wave phased arrays. The continued performance improvements of advanced node CMOS and scaled SiGe HBTs, have enabled the development of highly integrated mm-wave phased arrays for low cost, small size and low dissipation applications. As a result, we have made great advances in RF front-ends, antenna arrays and high-speed analog-to-digital converters. On the other hand, the recent development of THz III-V HEMTs have enabled phased arrays at previously inaccessible frequencies. This workshop will discuss some of the highlights of major advances in mm-wave phased arrays in 4 invited talks by industry and academic leaders. The range of these topics will show how the varying application spaces impose requirements which flow down through the system architecture and component designs to the semiconductor technologies.
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The large available spectrum at mm-wave frequencies above 100GHz offers wideband channels with tens of GHz wide bandwidth. This enables the development of wireless and waveguide communication systems with unprecedented data capacity. The small carrier wavelength (λ) permits compact arrays with many antennas. This paves the path for compact radio imaging systems with very high resolution. The goal of this workshop is to review the most recent advances in wireless, waveguide, and radar systems at D-band and beyond. Selected experts from academia and industry will discuss end-to-end components and challenges associated with novel mm-wave massive MIMO arrays, large scale phased arrays, high data-rate waveguide systems for data centers, and radar and sensing systems with very high resolution above 100GHz. Topics addressed will include semiconductor technology, mm-wave wireless transceivers, antenna arrays, waveguide channels and fully packaged modules.
In the past few years, the COVID19 pandemic has drawn attention to health. Radio-frequency and mm-wave radar has been regarded as an emerging technique for contactless monitoring of health conditions, particularly the health of the subject’s respiratory and cardiovascular systems. Radar has evolved from a complex, high-end technology into a relatively simple, low-cost solution penetrating industrial, automotive and consumer market segments. The adoption of short-range radars for consumer applications requires reliable system performance at small form factor, low-power and low-cost. The advancement of silicon and packaging technology has led to small form factor such that they can be mounted on devices, aesthetically concealed without affecting the system performance. This workshop covers multiple aspects of how to leverage short-range radar sensing for biomedical applications, including the metamaterial bio-radar, the clinic evaluations, gait analysis, monitoring impaired people, system design principles, and MIMO bio-radars.