About RFIC 2017
Venue: Hawaii Convention Center, in Honolulu, Hawaii.
Technical Format: The conference starts on Sunday, 4 June 2017 with workshops and short courses, followed by two Plenary talks and Reception embedded with joint Industry Showcase and Interactive Forum. Monday, 5 June and Tuesday, 6 June 2017 will be comprised of presentations of contributed papers and special lunch-time panel sessions.
Industry Papers: RFIC also seeks 2-page short-format original industrial-only submissions on all the areas listed in the Call for Papers.
Paper Awards: The RFIC Symposium presents two awards annually, Best Student Paper and Industry Best Paper.
2017 Call for Papers
The 2017 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2017) will be held in Honolulu, Hawaii, 4-6 June 2017.
Technical papers must be submitted by 9 January 2017 via links to be posted on the RFIC 2017 website at rfic-ieee.org.
The conference will solicit papers describing original work in RFIC design, system engineering, system simulation, design methodology, RFIC circuits, fabrication, testing, and packaging to support RF applications.