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The 2017 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2017) will be held in Honolulu, HI, USA, on June 4-6, 2017. For the latest information, please visit: rfic-ieee.org.
Electronic Paper Submission/Communication: Technical papers must be submitted via the RFIC 2017 submission site. Hard copies will not be accepted. Complete information on how and when to submit a paper can be found in the Author Instructions for Initial Submission document (see link above).
Technical Areas: The conference will solicit papers describing original work in RFIC circuits, system engineering, design methodology, RF modeling and CAD simulation, RFIC technologies, devices, fabrication, testing, reliability, packaging and modules to support RF applications in areas such as, but not limited to:
• Wireless Cellular & Connectivity ICs: LTE/LTE-Advanced, 5G Massive MIMO, LTE-M, WWAN, WLAN, 802.11ax, Bluetooth, GPS
• Low Power Transceivers: IoT, RFID, NFC, Zigbee, WPAN, WBAN, Biomedical, Sensor Nodes
• RF Front-End ICs: LNAs, Mixers, Demodulators, VGAs, Filters, Phase shifters, switches, Full-duplex applications, and Interference cancellation
• Mixed-Signal RF and Analog Baseband Circuits: ADCs, DACs, Sub-sampling/Over- sampling Circuits, and analog baseband circuitry including filters and modulators
• Reconfigurable and Tunable Front-Ends: Cognitive Radio, Multi-mode advanced cellular radios, Digitally-assisted RF, and Re-configurable blocks (N-path filter, ADCs, tuners)
• Large-Signal Circuits: Power Amplifiers (RF & mm-Wave), Driver amplifiers, Advanced TX circuits, modulators, efficiency enhancement, and Linearization
• VCOs and Frequency Multipliers: RF and mm-Wave VCOs, Frequency Multipliers
• Frequency Generation Circuits: PLLs, Synthesizers, ADPLL, DDS, Frequency Dividers, DLL, and MDLL
• Modeling, CAD and Testing: RF Design Methodology, RF Modeling and CAD, EM Simulation, Co-Simulation, Testing and Analysis of Active/Passive Devices, and Built-in-Test
• Process, Device and Packaging Technologies: CMOS, SOI, SiGe, GaAs, GaN, MEMS, Integrated Passives, Photonic, Emerging Devices, Reliability, Packaging, and Modules
• mm-Wave Circuits & Systems: mmW SOCs and SIPs above 20GHz for data, video, and imaging, mmW front-end circuits, and mmW-based 5G systems
• High-Speed Data Transceivers: Wireline, UWB, Optical Transceivers, and CDRs for High-Speed Data links
Technical Format: The conference starts on Sunday, June 4, 2017 with workshops and short courses, followed by two Plenary talks and a Reception concurrent with joint Industry Showcase and Interactive Forum. Monday, June 5th and Tuesday, June 6th, 2017 will be comprised of presentations of contributed papers and special lunch-time panel sessions. RFIC also seeks 2-page short-format original industry-only submissions on all the areas listed above.
RFIC Symposium has a Best Student Paper Award and an Industry Best Paper Award.
Journal Submissions: Selected papers will be invited for special issues in IEEE Journal of Solid State Circuits and Transactions on Microwave Theory and Techniques.
Microwave Week 2017: The RFIC 2017 will be held in conjunction with the IEEE MTT-S International Microwave Symposium (IMS). Microwave Week 2017 will start with the RFIC Symposium, followed by the IMS Symposium, and the ARFTG Microwave Measurement Conference.
Industry Exhibition: This two-day Exhibition typically showcases as many as 1000 Exhibitors who represent the state-of-the-art of the industry covering everything needed for RF and microwave design including materials, technologies, components and subsystems, as well as RF IC design and simulation software, measurement and fabrication equipment. It is a perfect venue for engineers to find the newest on RF and microwave ICs.
Conference Location: The Hawaii convention center is located in Honolulu, on the south shore of Oahu. The nearby Waikiki neighborhood is the center for dining, nightlife, shopping, and is famous for its iconic crescent beach. For more information visit Hawaii convention center and Honolulu.
Author Registration and Paper Submission Steps:
1. Author registration form: title, author(s) and affiliation(s), and statement of exclusivity. This form also includes a 30-50 word abstract (description of the subject, its importance, and how the work contributes to the field). This information is required and must be submitted via the website: rfic-ieee.org.
2. Authors must use the template provided on the website (above) to format their manuscript. The manuscript may not exceed 4 pages total and the file size must be less than 2 MB. For PDF files, use Distiller and select "embed all fonts". Please note that we are not accepting "*.doc" files.
3. Submission deadline: 9 January 2017
Submissions will be acknowledged instantly.
· HARD copy and FAX submissions will NOT be accepted.
· Late submissions will NOT be considered.
Authors of accepted papers will be required to submit a detailed paper, along with a clear die photo of the work described in the manuscript (except for the 2-page Industry Briefs).
Visa Requirements: Due to the short timeframe between paper acceptance and conference, the contact authors should provide their name as it shows on their passport and correct mailing address.
Paper Selection Criteria: All submissions must be in English. Papers will be selected based on the following factors:
· Originality: The paper must be unique, significant, and state-of-the-art. Are references to existing literature included?
· Quantitative content: The papers should give an explicit description of the work with supporting data.
· Quality: Clarity of the writing and figures. What is the context of the contribution to previous work?
· Interest to RFIC attendees: Why should this work be reported at this conference?
Clearances: Authors must obtain all required company and government clearances prior to submitting a paper. A statement of clearance, signed by the submitting author, must accompany the final manuscript for the paper to be considered for publication.
· Oral-Presentation Papers: Authors will be given 20 minutes to describe novel circuit and system techniques, measurement results, and potential impact to the RFIC community.
· Industry Briefs: The industry submission may utilize either the regular 4-page format or the 2-page short format, both of which will be presented in a 20-minutes time slot, if accepted. The 2-page industry paper must have an industry first author and presenter, and will be reviewed against the same technical criteria, but will not require a die photo. Selected industry papers will be invited to present a poster and optional demo at a special Industry Showcase Session to be held during the popular evening RFIC Reception on Sunday.
· Interactive Forum Papers: Selected papers, based on both quality and suitability, will be presented in poster format that facilities interactive discussions. The Interactive Forum will be held jointly with the Industry Showcase during the Reception to enhance attendees' experiences.
Best Student Paper Award: A student paper award contest will be held as part of the Symposium. Student papers will be reviewed in the same manner as all other conference papers. To be considered for an award, the student must have been a full time student (9 hours/term graduate, 12 hours/term undergraduate) during the time the work was performed and be the lead author and presenter of the paper. The email address of the student's advisor must be supplied during submission time. Upon submission, the student's advisor will automatically receive a verification email regarding the manuscript. Papers accepted for the competition will be judged on content with prizes awarded for first, second, and third place. Complimentary registration will be given to the student finalists as well as the award winners.
Industry Best Paper Award: An industry paper award contest will be held as part of the Symposium. Industry papers will be reviewed in the same manner as all other conference papers. Only papers with an industrial first author and presenter will be qualified for the Industry Best Paper Award.
Notification: Authors will be notified of acceptance on 5 February, 2017. Authors of accepted papers will receive copyright release forms and instructions for publication and presentation. Final manuscripts for publication in the RFIC digest must be received by 16 March 2017.
Double Submission: Authors who do not properly cite their previous work, or who submit an RFIC manuscript to two or more publications without informing the editor that the paper is concurrently under review by another publication will be reported to IEEE and may be banned from future publications.