Workshops and Short Courses

-

Almudena Suarez, Christopher Silva
Univ. of Cantabria, The Aerospace Corporation
Location
251
Abstract
This full-day course addresses the fundamental topic of stability in nonlinear microwave circuits and networks (MCNs), covering concepts, qualitative analysis, simulation, and engineering design. The many unique qualitative behaviors possible in common nonlinear MCNs will be illustrated, as well as the fundamental means by which these behaviors can abruptly arise with parameter changes (termed a bifurcation). Course attendees will learn about steady-state solutions, identify instability problems through small- and large-signal stability analysis, and understand dynamical mechanisms responsible for instabilities. The primary approaches for stability analysis (classical to advanced) will be presented and compared. Practical examples of instability, stability analysis, and stabilization design will be presented for MCNs such as power amplifiers, frequency multipliers/dividers, and voltage-controlled oscillators. Finally, the vast research area on harnessing nonlinear dynamics for engineering purposes will be surveyed, providing a glimpse into future nonlinear designs. The course will include video/hardware demonstrations and several live stability analysis sessions using ADS.
David S. Ricketts
North Carolina State Univ.
Location
256
Abstract
In this practical short course you will learn the system design of a frequency modulated continuous wave (FMCW) radar. After a short theory lecture, you will participate in teams to design and build a working radar at 1GHz. Each participant will design one component of the radar and then assemble the radar as a team for testing at the end of the day. The participants will build a power amplifier, low-noise amplifier, rat-race coupler and mixer. Baseband signal generation and components will be provided. No prior experience is needed, other than general microwave engineering knowledge.
Thomas Mitchell Wallis, Nathan D. Orloff
NIST
Location
150
Abstract
The ongoing explosion of commercial telecommunications demands innovation across all aspects of next-generation wireless systems. At the component and device levels, novel materials are critical to new device technologies throughout the microwave and mm-wave frequency range. Novel, functional materials enable reconfigurability, tunability, enhancement of transport, and control of loss. In turn, this functionality enables a wide variety of applications, including tunable filters, adaptive networks, MIMO components, and beam-steering. This workshop explores the role of novel materials in next-generation communications, starting from the properties of isolated “building blocks” and extending to the engineering of complex devices and components. Like the field of microwave materials itself, this workshop will begin with a foundation of materials development and characterization. Materials of interest include ferroelectrics, ferrites, phase change materials, and novel nanomaterials. The workshop will extend to the engineering of components for next-generation wireless systems, with a focus on connecting material properties to performance.
Technical Papers
Abstract
WSA-1: Recent Development in Ferroelectric Functional Materials
Holger Maune, Daniel Kienemund, Dominik Walk, Olof Bengtsson, Lambert Alff, Joachim R. Binder, Rolf Jakoby
Holger Maune, Technische Univ. Darmstadt
Abstract
WSA-2: Tunable RF Devices Employing Phase Change Material (PCM) Technology
Raafat R. Mansour
Raafat R. Mansour, Univ. of Waterloo
Abstract
WSA-3: 5THz Figure-of-Merit Phase Change RF Switches with 100 Million Switching Cycle Endurance
Jeong-Sun Moon
Jeong-Sun Moon, HRL Laboratories
Abstract
WSA-4: Advanced CNT-based RF-to-mm-Wave 3D Nanopackaging
Dominique Baillargeat, Kamel Frigui, Stéphane Bila, Philippe Coquet, Tay Beng Kang
Dominique Baillargeat, XLIM (UMR 7252)
Abstract
WSA-5: Recent Research on Materials for Microwave Applications
Hao Xin
Hao Xin, Univ. of Arizona
Abstract
WSA-6: Mesoscale Polarization Dynamics and Nonlinear Permittivity Characterization
Aaron M. Hagerstrom
Aaron M. Hagerstrom, NIST
Abstract
WSA-7: Microwave Microscopy for Advanced and Efficient Materials Analysis and Production
Gilles Dambrine, Kamel Haddadi
Gilles Dambrine, IEMN (UMR 8520)
Abstract
WSA-8: Imaging Microwave Currents in Planar Microwave Devices
Steven M. Anlage
Steven M. Anlage, Univ. of Maryland
Abstract
WSA-9: Near-Field Scanning Microwave Microscopy of Low-Dimensional Materials for Nanoelectronics
Samuel Berweger, Thomas Mitchell Wallis, Pavel Kabos
Samuel Berweger, NIST
François Rivet, Tim LaRocca, Gernot Hueber
Univ. of Bordeaux, Northrop Grumman, Silicon Austria Labs
Location
151AB
Abstract
The 5G and IoT future with enhanced Mobile Broadband (eMBB), ultra-reliable low-latency self-driving car communication and Massive Machine learning are driving RFIC designers to discover and investigate new design techniques using state-of-the-art technology. This workshop will provide the community in-depth understanding of new and underlying FDSOI CMOS capability (extended back biasing, flip-well, etc.), FinFET and GaN technologies, followed by advanced RFIC examples such as high-speed direct RF sampling and 60GHz CMOS. An introduction to emerging 3D and heterogeneous technology combining high-speed InP with digital CMOS for RFIC will provide both the experienced designer and early researchers attendee with a broad and deep overview of technology for next-generation RFIC design.
Technical Papers
Abstract
WSB-1: State-of-the-Art Analog, RF and mm-Wave Design Techniques Using 28nm FD-SOI CMOS, or How the Life of the Analog/RF Designer Became Brighter!
Andreia Cathelin
Andreia Cathelin, STMicroelectronics
Abstract
WSB-2: Body Biasing in 28nm UTBB FD-SOI CMOS Technology — a Device Approach to the Circuit Design
Mirjana Videnović-Mišić
Mirjana Videnović-Mišić, Silicon Austria Labs
Abstract
WSB-3: mm-Wave Radar Circuit Design Techniques in FDSOI CMOS Technology
Abdellatif Bellaouar
Abdellatif Bellaouar, GLOBALFOUNDRIES
Abstract
WSB-4: Opportunity of CMOS FD-SOI from IoT to 5G
Baudouin Martineau
Baudouin Martineau, CEA-LETI
Abstract
WSB-5: Solving the 5G Data Transport Layer Problem with mm-Wave CMOS Products
Joy Laskar
Joy Laskar, MAJA Systems
Abstract
WSB-6: Driving Silicon to Limit: mm-Wave Solution with FinFET Technology
Hyung-Jin Lee
Hyung-Jin Lee, Intel
Abstract
WSB-7: Heterogeneous Integration Using the Dielet Approach for IoT and 5G
Subramanian S. Iyer
Subramanian S. Iyer, UCLA
Abstract
WSB-8: On-Chip Circulators from DC to RF with Direct Sampling GaN Switches
Yuanxun Ethan Wang
Yuanxun Ethan Wang, Univ. of California, Los Angeles
Edmund Balboni, Arun Natarajan
Analog Devices, Oregon State Univ.
Location
153AB
Abstract
Interfacing mm-wave ICs with antennas remains a critical challenge for emerging mm-wave communication, sensor, and radar transceivers. This workshop will focus on the integration of antenna, antenna-arrays and antenna interfaces for microwave and mm-wave sensors and communications applications. The state-of-the-art in Antenna-in-Package (AiP) technology, targeting 5G arrays and 77GHz automotive radar, will be presented. In addition, the workshop will explore emerging Antenna-on-Chip (AoC) approaches focusing on techniques for improved efficiency, bandwidth and manufacturability. Such approaches include combining lenses and superstrates with on-chip antennas, multi-port antennas on high-resistivity substrates as well as micromachining techniques to minimize substrate losses and maximize antenna efficiency and bandwidth. Techniques to further extend system-level performance using antenna-IC co-integration and multi-port driven radiators will also be discussed. Workshop participants should get a very good overview of integrated antenna performance and limitations from this workshop.
Technical Papers
Abstract
WSC-1: Antenna-IC Interfaces for Scalable mm-Wave Arrays for 5G and Beyond-5G Applications
Arun Natarajan
Arun Natarajan, Oregon State Univ.
Abstract
WSC-2: Embracing the “Half-Wavelength” Challenge in Terahertz Regime: Radiator and Receiver 2D Arrays with Large Scale and High Density
Ruonan Han
Ruonan Han, MIT
Abstract
WSC-3: Multi-Port Integrated Antennas and Transceiver Architectures for Antenna-Level Signal Processing for Future mm-Wave Systems
Kaushik Sengupta
Kaushik Sengupta, Princeton Univ.
Abstract
WSC-4: Antenna-Electronics Co-Design — Multi-Feed Antennas Based mm-Wave Front-Ends for On-Antenna Power Combining, Active Load Modulation, and Polarization-Division-Duplex Communication
Taiyun Chi
Taiyun Chi, Rice Univ.
Abstract
WSC-5: W-Band Antenna-in-Package and Phased Array Module Integration for Portable Polarimetric Imaging
Alberto Valdes-Garcia
Alberto Valdes-Garcia, IBM T.J. Watson Research Center
Abstract
WSC-6: Integration of On-Chip and On-Board Antennas and Arrays for 100–600GHz CMOS Transceivers
Eran Socher
Eran Socher, Tel Aviv University
Abstract
WSC-7: mm-Wave Packaging and Antenna Integration for 5G Applications and Beyond
Telesphor Kamgaing
Telesphor Kamgaing, Intel
Abstract
WSC-8: The Limits of Antenna & Interconnect Integration for Large-Scale Phased Arrays
Shahriar Shahramian
Shahriar Shahramian, Nokia Bell Labs
Ayman Fayed, Bodhisatwa Sadhu, Jamin J. McCue
The Ohio State University, IBM T.J. Watson Research Center, AFRL
Location
156C
Abstract
Powerful design, characterization, and implementation tools of electronic devices have become easier than ever to acquire by commercial and government entities alike. This, along with the know-how of electronic design becoming globally accessible, opens the door to various activities that pose serious security risks. Some of these activities are incentivized only by commercial interests and profit, such as counterfeiting and IP theft, and others are driven by more malicious motives such as spying on, disrupting of, or interfering with the operation of a system. Regardless of the motivation, the question of how to improve the immunity of electronic devices to nefarious activities is a pressing one. This workshop discusses the security challenges associated with the analog, RF, and power portions of electronic systems, their place in the grand scheme of hardware security, why they are particularly vulnerable, how they can be exploited, and potential ways to address their security vulnerabilities.
Technical Papers
Abstract
WSE-1: The Landscape of Analog Hardware Security
Brian Dupaix, Jamin J. McCue
Brian Dupaix, AFRL
Abstract
WSE-2: Obfuscation of Analog IPs
Swaroop Ghosh
Swaroop Ghosh, Pennsylvania State Univ.
Abstract
WSE-3: Securing Analog Intellectual Property: Split Manufacturing, PUFs, and Beyond
Ioannis Savidis
Ioannis Savidis, Drexel Univ.
Abstract
WSE-4: Using Analog Side-Channel Signals for Malware and Hardware Trojan Detection
Alenka Zajić
Alenka Zajić, Georgia Tech
Abstract
WSE-5: Exploiting On-Chip Power Management for Side-Channel Security
Saibal Mukhopadhyay
Saibal Mukhopadhyay, Georgia Tech
Abstract
WSE-6: Analog Mixed Signal Approaches to IC Security
Nima Maghari
Nima Maghari, Univ. of Florida
Abstract
WSE-7: Securing RF/Analog Circuits Through Lifetime via Multi-Variate Authentication and Identification
Sule Ozev, Jennifer Kitchen
Sule Ozev, Arizona State Univ.
Abstract
WSE-8: Statistical and Machine Learning-Based Solutions for Trusted and Secure Analog/RF ICs
Yiorgos Makris
Yiorgos Makris, Univ. of Texas at Dallas
Magnus Wiklund, Didier Belot, Pierre Busson
Qualcomm Technologies, Inc., STMicroelectronics
Location
156AB
Abstract
For more than a decade mm-Wave has been a technology waiting to take off. We have 5G, radar, 802.11ay and many more product scenarios than when 802.15.3c (WPAN) was drafted. This workshop will present state-of-the-art circuits and techniques for 5G mm-Wave to Sub-THz that are driving product development now and in the near future. Where are we today in terms of circuit design? Which technology, which spectrum allowance, which standardization?
Technical Papers
Abstract
WSF-1: mm-Wave to sub-THz High Data Rate Links for 5G and Beyond
Abstract
WSF-2: Silicon Based Transceivers for High Data Rate mm-Wave Communications Targeting Beyond 5G Spectrum
Kenichi Okada
Kenichi Okada, Tokyo Institute of Technology
Abstract
WSF-3: Silicon Based High Data Rate mm-Wave Links for Short and Medium Range Communications
Amin Arbabian
Amin Arbabian, Stanford Univ.
Abstract
WSF-4: CMOS THz Imager for Security and Health Applications
Hani Sherry
Hani Sherry, TiHive
Abstract
WSF-5: Silicon Based THz Source and Imager for Health Applications
Alexandre Siligaris
Alexandre Siligaris, CEA-LETI
Abstract
WSF-6: III-V and SiGe Transceivers for High Data Rate mm-Wave Communications Targeting Beyond 5G Spectrum
Herbert Zirath
Herbert Zirath, Chalmers Univ. of Technology
Abstract
WSF-7: mm-Wave Phased-Arrays for 5G Systems
Gabriel M. Rebeiz
Gabriel M. Rebeiz, Univ. of California, San Diego
Abstract
WSF-8: mm-Wave to sub-THz High Data Rate Links for 5G and Beyond
Yinggang Li
Yinggang Li, Ericsson
Hossein Hashemi, Harish Krishnaswamy
Univ. of Southern California, Columbia Univ.
Location
157A
Abstract
Complex electronic-photonic integrated systems for fiber optical communication applications are now produced commercially at high volume. In particular, the silicon photonic integrated system ecosystem, including foundry processes, design tools, packaging, has greatly matured over the past few years. The silicon photonic market alone is estimated to be worth $500M in 2018, $1B in 2020, and over $2B by 2024 [Source: Yole Développement]. A large number of other applications can benefit from electronic-photonic integrated systems, in particular within the silicon photonic technology platform. Three-dimensional (3D) cameras, already used in iPhone X, can become mainstream in smartphones. Solid-state infrared lidars can enable low-cost sensors for self-driving cars and drone. Electronic-photonic integrated sensors may be used in biomedical applications. This workshop brings some of the prominent researchers from academic and industrial research labs to cover the latest advancements of electronic-photonic integrated systems with emphasis on sensors.
Technical Papers
Abstract
WSG-1: Integrated Photonics for Lidar, RF Signal Processing, and Quantum Sensing
Cheryl Sorace-Agaskar
Cheryl Sorace-Agaskar, MIT Lincoln Laboratory
Abstract
WSG-2: Optical Frequency Synthesis and Control: from Communication to Sensing
Firooz Aflatouni
Firooz Aflatouni, Univ. of Pennsylvania
Abstract
WSG-3: Integrated Electro-Optical PLL for Linear FMCW Modulation of a Tunable Laser
Behnam Behroozpour
Behnam Behroozpour, Robert Bosch LLC
Abstract
WSG-4: Integrated Opto-Electronic Phase Locked Loops for High Performance Lidar
Harish Krishnaswamy
Harish Krishnaswamy, Columbia Univ.
Abstract
WSG-5: Recent Progress Toward Automotive Lidar on a Chip
Lute Maleki
Lute Maleki, Cruise Automation
Abstract
WSG-6: Silicon Arrays and Sensors: Opportunity, Progress, and Challenge
Ali Hajimiri
Ali Hajimiri, Caltech
Abstract
WSG-7: Lidar and Beam Steering Technologies Based on Silicon Photonics
Michal Lipson
Michal Lipson, Columbia Univ.
Abstract
WSG-8: Optical Phased Arrays
Hossein Hashemi
Hossein Hashemi, Univ. of Southern California
Jeffrey S. Walling, Debopriyo Chowdhury
Tyndall National Institute, Broadcom
Location
157BC
Abstract
It is suggested that 5G communications will be comprised of a combination of the existing cellular and ISM bands in the sub-6GHz spectrum, along with near mm-wave bands (e.g., K and Ka) and mm-wave bands (e.g., W and V). This workshop focuses on power amplifier and transmitter designs and architectures in the sub-6GHz spectrum that can include highly digital architectures (DPAs, charge-based TX), as well as architectural innovation (e.g., Cartesian combiners and magnetic free circulators). To explore the pathways that will enable 5G communications, the workshop will highlight recent trends in PAs and transmitters that can be used to enable digital beamforming, multi-beam TX, enhance energy efficiency and linearity. Additionally, we will explore the emerging topics of co-existence and simultaneous transmit and receive.
Technical Papers
Abstract
WSH-1: Duplexing and Co-existence in Emerging RF Wireless Systems
Harish Krishnaswamy
Harish Krishnaswamy, Columbia Univ.
Abstract
WSH-2: Analog and Digital Wideband Envelope Tracking for 5G
Jonmei Yan, Toshifumi Nakatani, Paul Theilmann, Donald Kimball, Isabelle Telliez
Jonmei Yan, MaXentric Technologies
Abstract
WSH-3: Modulating Transmitter Power Supplies for Improved Battery Life in Wideband Applications
Debopriyo Chowdhury
Debopriyo Chowdhury, Broadcom
Abstract
WSH-4: Bits-In RF-Out Transmitters
Morteza S. Alavi, Leo de Vreede
Morteza S. Alavi, Technische Universiteit Delft
Abstract
WSH-5: Energy-Efficient and Area-Saving Techniques in Digital Power Amplifiers
Hongtao Xu
Hongtao Xu, Fudan Univ.
Abstract
WSH-6: A Digital Transmitter Based on Class-G Quadrature Switched-Capacitor Power Amplifier with Efficiency Enhancement and Linearization Techniques
Sang-Min Yoo
Sang-Min Yoo, Michigan State Univ.
Abstract
WSH-7: Emergent Reconfigurable DPAs and Beamforming Transmitters for 5G
Jeffrey S. Walling, Ali Azam, Zhidong Bai, Wen Yuan
Jeffrey S. Walling, Univ. of Utah
Yao-Hong Liu, Hossein Miri Lavasani, Gernot Hueber
Holst Centre, Case Western Reserve Univ., Silicon Austria Labs
Location
254AB
Abstract
The 5G and IoT future with enhanced Mobile Broadband (eMBB), Ultra-Reliable and Low Latency Communications (URLLC) and massive Machine Type Communications (mMTC) is open for new applications in high volume deployment that will benefit from 5G’s ultra-fast networks and real-time responsiveness, such as mMTC for solar-powered nodes (street-light) or other innovations to help city-wide infrastructure, or device-to-device public safety communications without a need for cellular coverage. Novel applications and network techniques demand that RFIC designers discover and investigate new designs to allow the high volume of use-cases based on and beyond 5G. The motivation of this workshop is to capture what is the state at the edge of IoT technology, what is the demand of the industry in the context of innovation, as well, what are circuit and architectural concepts that are demanded or enforced by 5G IoT standardization. We focus especially on RFIC circuits design and technologies competing for today’s and tomorrow’s applications in 5G IoT.
Technical Papers
Abstract
WSI-1: Evolving 5G NR to Connect the Internet of Things
John Smee
John Smee, Qualcomm
Abstract
WSI-2: A Wireless Self-Powered IoT Smart Edge Mote
Tanay Karnik
Tanay Karnik, Intel
Abstract
WSI-3: What is Required of 5G to Make it Attractive for IOT?
Yao-Hong Liu
Yao-Hong Liu, IMEC
Abstract
WSI-4: ULP Radios and Their Application in 5G IoT
David D. Wentzloff, Univ. of Michigan
Abstract
WSI-5: Ultrasound-Enabled Connectivity for Next-Generation IoT Systems
Angad Rekhi, Stanford Univ.
Abstract
WSI-6: Benefits of 22FDX for NB-IOT RF Integration
Thomas Mckay, GLOBALFOUNDRIES
Abstract
WSI-7: How Silicon Technology can Address 5G IoT Challenges
Frederic Gianesello, STMicroelectronics
Abstract
WSI-8: mm-Wave Wireless Powered IoT
Hao Gao
Hao Gao, Technische Universiteit Eindhoven
Joseph C. Bardin, Masoud Babaie
UMass Amherst, Technische Universiteit Delft
Location
259AB
Abstract
As the field of quantum computing continues to grow, numerous opportunities will emerge for RFIC designers to contribute. For instance, quantum processors are typically interfaced to using microwave control and readout, and, for the field to continue to succeed, these interfaces must be simplified and integrated. The goal of this workshop is, first to provide enough background so that the need for RFIC designers is clear, and then to describe the current state-of-the-art in quantum computing hardware as well as where the field is heading. The workshop will begin with a tutorial designed to introduce RF circuit designers to the field of quantum computing. Following this, world experts will present research spanning a wide range of topics including CMOS-compatible qubit technology, quantum limited amplification, microwave qubit readout, CMOS RFICs for quantum computing, and system-level challenges related to building a practical quantum computer.
Technical Papers
Abstract
WSJ-1: An Introduction to Quantum Computing for RFIC Engineers
Joseph C. Bardin, Daniel Sank
Joseph C. Bardin, UMass Amherst
Abstract
WSJ-2: Si MOS-Based Spin Qubits for Quantum Computing
Louis Hutin
Louis Hutin, CEA-LETI
Abstract
WSJ-3: An Introduction to Parametric Amplifiers for Superconducting Quantum Information
José Aumentado
José Aumentado, NIST
Abstract
WSJ-4: Adapting Microwave Control to Evolving Quantum Computers
Diego Ristè
Diego Ristè, Raytheon BBN
Abstract
WSJ-5: Scaling Up of Quantum Computers: the Importance of Interconnects and Fast Electrical Characterization
James S. Clarke
James S. Clarke, Intel
Abstract
WSJ-6: Cryogenic CMOS Interfaces for Quantum Computers
Fabio Sebastiano
Fabio Sebastiano, Technische Universiteit Delft
Abstract
WSJ-7: System Design Considerations for Noisy Intermediate-Scale Quantum Machines
Matt Reagor
Matt Reagor, Rigetti Computing
Jennifer Kitchen, Oren Eliezer, Donald Lie
Arizona State Univ., PHAZR, Texas Tech Univ.
Location
252AB
Abstract
There is a growing demand for high data rate, short-range communications to support near-future 5G networks and wireless broadband networks (WLAN), with speculation that 50 billion mm-wave wireless devices will be deployed worldwide by 2024. These transceivers will require mm-wave power amplifiers (PAs) that operate at frequencies well above 10GHz and support wide instantaneous bandwidths. This workshop brings together experts from academia and industry to highlight recent works and performance trends in mm-Wave PAs; detail advanced architectures and design concepts using silicon CMOS, FINFETs, and GaN; discuss techniques to maintain high PA efficiency at mm-Wave while meeting the stringent 5G linearity requirements; and introduce new PA architectures to achieve broadest reported bandwidths. Additionally, this workshop examines process technology and assembly limitations for delivering power at these high frequencies, with comparisons between silicon, GaN, and GaAs processes.
Technical Papers
Abstract
WSK-1: mm-Wave Power Amplifiers in Silicon — State-of-the-Art and Several Recent Architecture/Circuit Examples
Hua Wang
Hua Wang, Georgia Tech
Abstract
WSK-2: Broadband PA Design in CMOS and SOI for 5G Applications
Patrick Reynaert
Patrick Reynaert, Katholieke Univ. Leuven
Abstract
WSK-3: mm-Wave Power Amplifiers in FINFET Technology
Christopher Hull
Christopher Hull, Intel
Abstract
WSK-4: High-Efficiency RF-PA Supply Modulation Techniques for mm-Wave Amplifiers
Ji-Seon Paek, Samsung Electronics
Abstract
WSK-5: mm-Wave GaN PAs for 5G High-Performance Transmitters
Christophe Auvinet, UMS
Abstract
WSK-6: GaN and GaAs Process Technologies and PA Architectures to Support mm-Wave Frequencies
Elias Reese, Qorvo
Abstract
WSK-7: mm-Wave Power — What Can GaN Do?
Mansoor Siddiqui
Mansoor Siddiqui, Northrup Grumman
Abstract
WSK-8: Design Considerations for 5G Power Amplifiers
Timothy Faughn
Timothy Faughn, Skyworks Solutions
Abstract
WSK-9: Summary and Highlights of our mm-Wave Broadband PA Design Workshop
Donald Lie, Oren Eliezer
Donald Lie, Texas Tech Univ., Oren Eliezer, PHAZR
Ehsan Afshari, Hongtao Xu
Univ. of Michigan, Fudan Univ.
Location
257AB
Abstract
Future applications, such as 5G, SatCom, AR/VR and radar imaging, need a large-scale array system. Such a system requires highly integrated RFICs for the growing channel number, easy system integration and cost/area optimization. This workshop addresses key design challenges in components, integration and overall system in such systems. The focus would be on manufacturing friendly techniques for interfacing mm-wave arrays with antennas both for single-element and large-scale arrays, and will also help to understand evolution from Phased Arrays to MIMO Arrays.
Technical Papers
Abstract
WSL-1: Silicon Phase Arrays: Past, Present, and Future
Ali Hajimiri
Ali Hajimiri, Caltech
Abstract
WSL-2: RF/mm-Wave FEM Applications with SOI/SiGe Processes
Chaojiang Li
Chaojiang Li, GLOBALFOUNDRIES
Abstract
WSL-3: Hybrid Beamforming-MIMO Architectures Leveraging Best of Both Worlds for 5G and Beyond
Payam Heydari
Payam Heydari, University of California Irvine
Abstract
WSL-4: mm-Wave CMOS Phased-Array Transceiver for 5G New Radio
Kenichi Okada
Kenichi Okada, Tokyo Institute of Technology
Abstract
WSL-5: Integrated RFICs in mm-Wave Array Systems for 5G and Beyond
Shahriar Shahramian
Shahriar Shahramian, Nokia Bell Labs
Abstract
WSL-6: mm-Wave and Terahertz Signal Generation, Amplification, and Beam Steering in Silicon
Omeed Momeni
Omeed Momeni, Univ. of California, Davis
Abstract
WSL-7: Fully-Integrated 94GHz Dual-Polarized TX and RX Phased Array ICs for 3D Real-Time Radar Imaging Applications
Wooram Lee
Wooram Lee, IBM T.J. Watson Research Center
Murtaza Ali, Ruonan Han, Hiva Hedayati
Uhnder, MIT, Macom
Location
158
Abstract
Autonomous driving has the potential to revolutionize not only transportation but also the entire society. Every year, more than a million lives are cut short due to traffic accidents. Autonomous driving could significantly reduce these fatalities and improve the quality of life for millions of commuters. The intelligence behind such technology based on artificial intelligence and machine learning will rely on a number of advanced sensors and connectivity nodes generating and processing large amounts of data. This workshop will delve into the latest technologies that enable self-driving cars, focusing on sensing and connectivity and their impact on RFIC requirements and design.
Technical Papers
Abstract
WSM-1: The Sensor Landscape for Automated Driving
Ben McIntosh
Ben McIntosh, Infineon Technologies
(08:00 - 17:15)
Abstract
WSM-2: Digital Modulation: A Breakthrough in Radar Enabling High Performance at Lowest Cost
Ralf Reuter
Ralf Reuter, Uhnder
(08:00 - 17:15)
Abstract
WSM-3: Multi-Mode Image Radar System and its Challenges
Dan Wang, Texas Instruments
(08:00 - 17:15)
Abstract
WSM-4: In Vehicle Networking for Future Cars
Luc Van Dijk
Luc Van Dijk, NXP Semiconductors
(08:00 - 17:15)
Abstract
WSM-5: mm-Wave Radar Sensors for Roadside Infrastructure Enabling Autonomous Driving
Vadim Issakov, Wolfgang Lehbrink
Vadim Issakov, Infineon Technologies
(08:00 - 17:15)
Abstract
WSM-6: Optimizing FMCW Radar Architecture for LO Chirp Detected Noise Reduction
Danny Elad, Jakob Vovnoboy
Danny Elad, ON Semiconductor
(08:00 - 17:15)

-

Fred Lee, Ramesh Harjani
Verily, Univ. of Minnesota
Location
152
Abstract
Four engaging technical leaders from industry and academia will cover the latest in high-performance RF receiver architectures. To frame the workshop, Dr. Jon Strange will present the latest advancements in commercial receiver ICs and wireless systems. The following three speakers will cover receiver techniques on the horizon: Dr. Tong Zhang will share self-interference cancellation techniques in frequency-division-duplex and full-duplex receivers; Dr. Peter Kinget will motivate compressed sensing systems for interference detection; and Dr. Ramesh Harjani will discuss how N-path mixer-first receivers are used for spread-spectrum interference mitigation. Finally, to adjourn the workshop, a short but lively panel discussion will be moderated to discuss the likely future of RF receiver architectures.
Technical Papers
Abstract
WSD-1: Architectures and Circuits for Cellular Receivers: an Industrial Perspective
Jon Strange
Jon Strange, Mediatek
Abstract
WSD-2: Self-Interference Cancellation Techniques in Frequency-Division-Duplex (FDD) and Full-Duplex (FD) Receivers
Tong Zhang
Tong Zhang, Verily
Abstract
WSD-3: Compressed Sensing Based Radio Architectures for Rapidly Finding Interferers in the Spectral and Spatial Domains
Peter R. Kinget
Peter R. Kinget, Columbia Univ.
Abstract
WSD-4: Spread-Spectrum In-Band Interference Mitigation Techniques using N-Path Mixer-First Designs
Ramesh Harjani
Ramesh Harjani, Univ. of Minnesota

-

Kamal Samanta, Timothy Lee, Harrison Chang
Sony Europe, The Boeing Company, ASE
Location
157BC
Abstract
5G Front-End Modules (FEM) for below 6GHz and at mm-wave frequencies poses daunting design challenges to fit within the phased-array antenna element spacing constraints. The challenge is to create solutions that will meet or exceed electrical, mechanical, thermal and cost requirements for both the UE and BS use cases. The close proximity of components points to the need for optimized design to achieve signal integrity and reduced insertion losses imposed by interconnects and packaging techniques at the chip, module, and board levels. This workshop will address design and manufacturing techniques by bringing together the subject matter experts from the IEEE EPS and the MTT-S communities. The workshop will highlight advances in the 2.5D/3D multichip module (MCM) integration from leading Outsourced Assembly and Test (OSAT) foundries, advanced materials, Antenna in Package (AiP) versus Antenna On Chip (AoC) trades, novel integrated circuits, beam-forming techniques, and EDA tools for co-engineering to realize high-performance 5G FEMs.
Technical Papers
Abstract
WMG-1: Scaling mm-Wave Phased Arrays: Challenges and Solution Examples at Ka-Band and W-Band
Xiaoxiong (Kevin) Gu, Alberto Valdes-Garcia
Xiaoxiong (Kevin) Gu, IBM T.J. Watson Research Center
Abstract
WMG-2: 5G Design Innovation Through Simulation
Larry J. Williams
Larry J. Williams, Ansys
Abstract
WMG-3: Design and Fabrication of SIW at mm-Wave using Organic Substrates
Madhavan Swaminathan
Madhavan Swaminathan, Georgia Tech
Abstract
WMG-4: Mode-Selective Transmission Line Technology for Ultra-Broadband Analog and Super-High-Speed Digital ICs and Systems
Ke Wu, Desong Wang
Ke Wu, École Polytechnique de Montréal
Abstract
WMG-5: Characterization of Low Cost Organic Substrate for mm-Wave AiP Application
Harrison Chang
Harrison Chang, ASE
Abstract
WMG-6: Thermal and Mechanical Co-Design for Packaging in 5G Systems
Chris Bailey
Chris Bailey, University of Greenwich

-

Steve Dudkiewicz, Larry Dunleavy
Maury Microwave, Modelithics, Inc.
Location
150
Abstract
In modern communications systems, receivers are required to detect and receive very small signals, and at the same time not add a significant level of noise, otherwise the information contained within the signals may be overpowered and become unusable. In order to minimize the amount of added noise, low-noise circuit design becomes critical, and highly effective designs begin with accurate noise parameters or noise models. Noise parameters measurements and noise model extraction are extremely sensitive techniques, and the measurement/extraction system can itself become the dominant contributor of noise if the system is not calibrated accurately. Therefore understanding the sources of error, and using the best techniques and practices, is critical when attempting to accurately characterize noise parameters and extract a noise model. This short course aims to demystify noise parameter measurements and model extraction, and includes topics such as: an introduction to noise figure and noise parameter concepts; noise parameter calibration; measurement and extraction techniques and best practices; how to validate noise parameter data; an in-depth review of critical variables that affect the accuracy of noise parameter measurements; noise parameter de-embedding; and noise model theory and extraction.
Guillaume Callet, Ko-Tao Lee
UMS, IBM T.J. Watson Research Center
Location
151AB
Abstract
Over the past decades, the RF/microwave community has expanded and benefited from the rapid development of the semiconductor industry. Advances in exploratory materials and structures have enabled devices switching at higher frequency, while keeping a compact form factor and increasing energy efficiency. These devices are now reaching the level of industrial maturity to meet the requirements for 5G power applications at mm-wave frequencies and beyond. In this one-day workshop, 9 invited talks from semiconductor experts, academic researchers and the global end-users will be presented. The workshop will cover all key aspects of advanced technologies for 5G, including 1) mm-wave GaN devices and integration, 2) ultra broadband RF SoC, 3) integration for RF transceivers, and 4) wafer-level packaging for high frequency devices. It will give the attendees a comprehensive exposure to the latest 5G technological solutions and breakthrough.
Technical Papers
Abstract
WMA-1: Emerging Ultra Broadband RF SoC Technologies
Young-Kai Chen
Young-Kai Chen, DARPA
Abstract
WMA-2: GaN for 5G Applications: FinFETs, CMOS and Vertical Transistors
Nadim Chowdhury, Ahmad Zubair, Joshua Perozek, Qingyun Xie, Tomás Palacios
Tomás Palacios, MIT
Abstract
WMA-3: Exploiting the Unique Properties of GaN for Next Wave of Mobile Communications
Nadine Collaert
Nadine Collaert, IMEC
Abstract
WMA-4: mm-Wave GaN Device for 5G
Akira Inoue
Akira Inoue, Mitsubishi Electric
Abstract
WMA-5: Heterogeneous Integration for WLP RF Transceivers : Challenges and Issues
Didier Floriot
Didier Floriot, UMS
Abstract
WMA-6: Fully Integrated GaN-on-Si Devices: A CMOS Compatible Solution for the Next Generation RF and Power Electronics
Ko-Tao Lee
Ko-Tao Lee, IBM T.J. Watson Research Center
Abstract
WMA-7: Silicon Semiconductor Technologies for the 5G mm-Wave Era and Beyond
Alvin Joseph
Alvin Joseph, GLOBALFOUNDRIES
Abstract
WMA-8: Wafer Level Packaging Technologies for High Frequency Device Applications
John Hunt
John Hunt, ASE
Abstract
WMA-9: Opportunities for Heterogenous Integration of GaN/RF CMOS in 5G mm-Wave Systems
Kristoffer Anderson
Kristoffer Anderson, Ericsson
Alexander Chenakin, Paul Khanna
Anritsu, National Instruments
Location
152
Abstract
Frequency synthesis plays a key role in virtually all present-day commercial, industrial and test and measurement systems. State-of-the-art low-noise frequency synthesis is a particularly important technical asset to high-speed telecommunications, efficient management of the wireless spectrum and high-resolution imaging. Overall performance of various technologies depends on, and is often limited by, phase and amplitude noise fluctuations in oscillators and frequency synthesizers. This full-day workshop will focus on modern low phase noise oscillator and frequency synthesizer techniques. The RF/microwave industry feels persistent pressure to deliver higher performance, higher functionality, smaller size, lower power consumption and lower cost synthesizer designs. Various synthesizer architectures along with their main characteristics will be analyzed. The new market demands, design challenges and possible solutions will be discussed. In respect to phase noise performance, synthesizer designers primarily rely on ovenized crystal oscillators (OCXO), which will be reviewed in detail. Longer-term major breakthroughs are expected operating the reference with other physical principles or materials. For example, the phase noise exceeding -170dBc/Hz at 10kHz offset at 10GHz output for a sapphire resonator based oscillator has been reported. These quality expectations will dramatically change conceptual approaches for building new synthesizers or even the whole way of thinking about this problem. State-of-the-art low-phase-noise oscillator techniques including sapphire loaded cavity oscillators, optoelectronic and atomic methods will also be covered.
Technical Papers
Abstract
WMB-1: Microwave Frequency Synthesizers: Status and Technology Trends
Alexander Chenakin, Suresh Ojha
Alexander Chenakin, Anritsu, Suresh Ojha, Anritsu
Abstract
WMB-2: Arbitrary Frequency, Ultra Low Phase Noise DDS
Fred Harris
Fred Harris, Univ. of California, San Diego
Abstract
WMB-3: Using LT SPICE to Simulate Phase Noise and Small Signal Performance of Phase Lock Loops
Eric Drucker
Eric Drucker, Univ. of Washington
Abstract
WMB-4: Accurate and Stable Microwave Vector Modulators
Andrew Teetzel
Andrew Teetzel, Linear Radio Company
Abstract
WMB-5: Precision Low Phase Noise Oven Controlled Crystal Oscillator as a Reference Source for Modern Synthesizers
Aleksander Kotyukov
Aleksander Kotyukov, Morion
Abstract
WMB-6: Opto-Electronic Oscillators as RF Synthesis Tools
Andrey B. Matsko
Andrey B. Matsko, OEwaves
Abstract
WMB-7: Low Noise Sapphire Resonators and Oscillators
Michael Tobar
Michael Tobar, University of Western Australia
Abstract
WMB-8: Phase Noise Measurement of Low-Noise Oscillators and Devices
Enrico Rubiola
Enrico Rubiola, FEMTO-ST
Didier Belot, Eric Kerhervé
CEA-LETI, IMS (UMR 5218)
Location
225
Abstract
5G spectrum is presently open world-wide to sub-6GHz and mm-Wave bands at 26GHz, 28GHz, and other bands at 40GHz, 60GHz (V) and 71-86GHz (E) are under evaluation in most parts of the world. Different power amplifier architectures and process technology approaches are in competition to cover these 5G opened bands. This workshop will benchmark the state-of-the-art power amplifier techniques targeting mm-Wave frequency for 5G applications, and will present the status of different processes addressing the Power Amplifier applications such as silicon based, III-V, GaN and InP technologies. Finally we will discuss the match between these technologies’ specificities and the different 5G application requests.
Technical Papers
Abstract
WMC-1: Design Considerations for 5G mm-Wave Transmitters and Power Amplifiers
Stefan Andersson, Sven Mattisson, Fredrik Tillman
Stefan Andersson, Ericsson
Abstract
WMC-2: mm-Wave InP Power Amplifier for High Speed Wireless Communications
Hiroshi Hamada
Hiroshi Hamada, NTT
Abstract
WMC-3: mm-Wave GaN MMIC PA Design for High Efficiency and High Power
Zoya Popović
Zoya Popović, University of Colorado Boulder
Abstract
WMC-4: PA Design in Silicon (SiGe & CMOS) and Other III-V Processes for Advanced Beamformed Applications
Eric Kerhervé, Vincent Knopik
Eric Kerhervé, IMS (UMR 5218)
Abstract
WMC-5: Wideband GaN-Based Supply-Modulated Power Amplifier Systems
Olof Bengtsson, Sophie Paul, Sebastian Preis, Nikolai Wolff
Olof Bengtsson, FBH
Abstract
WMC-6: Transmitter Architectures for PA Efficiency
Earl McCune
Earl McCune, EMC2
Abstract
WMC-7: 5G High Power RF Front-End Solution for Ka-Band
Mohammed Ayad
Mohammed Ayad, UMS
Abstract
WMC-8: Process Technology Benchmarking for mm-Wave PA
Didier Belot
Didier Belot, CEA-LETI
Antonio Raffo, Patrick Roblin
Univeristy of Ferrara, Ohio State Univ.
Location
156AB
Abstract
The design of future communication systems poses several challenges in terms of required bandwidth, power, efficiency, and costs. The workshop aims at discussing how these challenges can be tackled by adopting skills and techniques that, although acquired by the microwave community, are still too fragmented. More specifically, the workshop will focus on measurements, which are a crucial step at each design level, from semiconductor devices to circuits and systems. Speakers will show how a deep understanding of the measurement quality is of critical importance and remains an unavoidable step for the design of the next-generation microwave circuits and systems. Emphasis will be placed on wideband measurements accounting for new modulation techniques. Finally, different examples of circuit and system designs oriented to 5G and IoT applications will be presented. It will be emphasized how simulations and measurements merge together in modern design techniques to give rise to first-pass design strategies.
Technical Papers
Abstract
WMD-1: EVM and NPR Definition and Optimum Measurement
Jacques B. Sombrin
Jacques B. Sombrin, TéSA
Abstract
WMD-2: On-Wafer Measurement Uncertainty for Estimating the Performance of Active RF Circuits
Jérôme Chéron, Dylan F. Williams, Richard Chamberlin, Benjamin F. Jamroz
Dylan F. Williams, National Institute of Standards and Technology
Abstract
WMD-3: How to Improve Accuracy of Wafer-Level Calibration at mm-Wave and sub-mm-Wave Frequencies
Andrej Rumiantsev
Andrej Rumiantsev, MPI Corp.
Abstract
WMD-4: GaN HEMT Characterization for High-Efficiency Power Amplifiers
Hiroshi Yamamoto
Hiroshi Yamamoto, Sumitomo Electric Device Innovations
Abstract
WMD-5: Wideband Load-Pull Measurement Techniques: Architecture, Accuracy, and Applications
Mauro Marchetti, Gustavo Avolio
Mauro Marchetti, Anteverta-mw
Abstract
WMD-6: Behavioral Modeling Including Low-Frequency Dispersion Effects and Application to PA Design
Edouard Ngoya, Christophe Mazière, Wissam Saabe, Sébastian Mons
Edouard Ngoya, Xlim - CNRS- Unversite De Liroges
Abstract
WMD-7: Broadband PAs for Concurrent Signals
Zoya Popović, Taylor W. Barton
Zoya Popović, University of Colorado Boulder
Abstract
WMD-8: Design of GaN Based K/Ka-Band MMIC Power Amplifiers
Paolo Colantonio, Elisa Cipriani, Franco Giannini
Paolo Colantonio, Università di Roma
Abstract
WMD-9: Linearization Implementation Challenges and Techniques for 5G Waveforms
Meenakshi Rawat
Meenakshi Rawat, Indian Institute of Technology Roorkee
Edward Niehenke, Rüdiger Quay, John Pierro
Niehenke Consulting, Fraunhofer IAF, Telephonics
Location
160ABC
Abstract
mm-waves have found uses for radar, communications, and most recently in 5G applications and beyond. Power amplifiers are limiting components due to their energy consumption, bandwidth limitation, and gain limitation. This workshop will focus on recent innovations in power amplifier IC design techniques with specific emphasis on their realization at mm-wave frequencies. These include design and layout techniques for efficiency enhancement, linearity improvements, thermal management, memory effects, and bandwidth and gain extension. Many of these state-of-the-art improvements can be linked to power amplifier device technology whose great variety will be covered including SOI, GaN, GaAs , SiGe, and CMOS as those differ drastically in their active and passive capabilities and available design features.
Technical Papers
Abstract
WME-1: GaN Technology is Revolutionizing mm-Wave Power
James Schellenberg
James Schellenberg, QuinStar Technology
Abstract
WME-2: Wideband Design Techniques for mm-Wave Gallium Nitride MMICs
Maciej Ćwikliński, Rüdiger Quay, Peter Brückner
Maciej Ćwikliński, Fraunhofer Institute for Applied Solid State Physics
Abstract
WME-3: mm-Wave InP HEMT Power Amplification
William R. Deal
William R. Deal, Northrop Grumman
Abstract
WME-4: Methodology of High Efficiency mm-Wave GaN Power Amplifiers
Harris P. Moyer
Harris P. Moyer, HRL Laboratories
Abstract
WME-5: RF to mm-Wave CMOS-SOI Power Amplifiers
Saeed Mohammadi
Saeed Mohammadi, Purdue Univ.
Abstract
WME-6: Power Amplifiers for 5G mm-Wave Applications
Peter Asbeck
Peter Asbeck, Univ. of California, San Diego
Abstract
WME-7: HBT and CMOS Outphasing Power Amplifiers for mm-Wave Applications
James F. Buckwalter
James F. Buckwalter, Univ. of California, Santa Barbara
Jon Martens, Nuno Borges Carvalho
Anritsu, Universidade de Aveiro
Location
156C
Abstract
As radio integration proceeds apace for 5G, satellite and other applications, over-the-air testing requirements are increasing dramatically. This workshop covers topics related to both measurement fundamentals (spatial data fusion, calibration and synchronization concerns, traceability, etc.), to the structure and measurement requirements of the subsystems being analyzed and to more advanced topics (e.g., MIMO test beds, higher order measurements such as EVM). Even simple transmission phase measurements versus position/angle can be a challenge with disjoint frequency converters and path characteristics changing over the modulation bandwidth. Nonlinear characterization (including emulated load pull) is increasingly needed for the embedded power amplifiers in these systems. Some subsystems under test may employ multibeam scanning or element-level predistortion that require additional characterization considerations. Attendees at this workshop will hear some of the latest thinking in OTA measurements and procedures and how some recent changes in integrated radio/system designs will further influence the measurement landscape.
Technical Papers
Abstract
WMF-1: Traceable mm-Wave Modulated-Signal Source for Over-The-Air Device Characterization
Robert D. Horansky
Robert D. Horansky, NIST
Abstract
WMF-2: Calibration, Synchronization and Sensitivity Topics in OTA Array Characterization
Jon Martens
Jon Martens, Anritsu
Abstract
WMF-3: Multibeam Phase-Shifter-Less Antenna Arrays and Free-Space Measurements
Zoya Popović
Zoya Popović, University of Colorado Boulder
Abstract
WMF-4: Measurement Systems Fusion for Over-The-Air (OTA) Characterization of 5G Devices
Gerardo Orozco
Gerardo Orozco, National Instruments
Abstract
WMF-5: Metrological MIMO Testbeds for 5G Communications
Tian Hong Loh
Tian Hong Loh, NPL
Abstract
WMF-6: OTA Characterization of Nonlinear Transmitters Using Specially Designed Multi-Sines
Nuno Borges Carvalho
Nuno Borges Carvalho, Universidade de Aveiro
Abstract
WMF-7: Over-The-Air Characterization and Prediction of Non-Linearity in mm-Wave Arrays
Koen Buisman, Christian Fager, Thomas Eriksson
Koen Buisman, Chalmers Univ. of Technology
Abstract
WMF-8: Testing 5G PAs: from the Cable to OTA
Sérgio C. Pires
Sérgio C. Pires, Ampleon
Manuel Ferdik, Thomas Ussmueller, Christian Carlowitz
Universität Innsbruck, FAU Erlangen-Nürnberg
Location
157A
Abstract
RFID technology is today widely deployed in industrial and commercial environments with mature hardware concepts. Nevertheless, recent research demonstrates substantial potential to boost especially the achievable accuracy for RFID based localization systems and high-speed communication networks. These advances are primarily enabled through the combination of powerful digital signal processing (DSP) techniques with flexible reader hardware based on software-defined radios. Thus the most promising DSP techniques will be covered: Based on high performance wideband software defined radio platforms with modern self-interference cancellation techniques, novel modulation formats optimized for RFID scenarios in order to boost data rate as well as ranging capability will be explored. Finally, combining several nodes with unprecedented performance into a complete RFID-based communication network enables novel localization techniques, e.g., for autonomous indoor navigation. The workshop brings together all major DSP-based approaches in order to push forward their application in practice and to explore mutual benefits of their combination.
Technical Papers
Abstract
WMI-1: Phase Based Near-Field Source Localization for UHF RFID
Andreas Parr, Matthias Gareis, Christian Carlowitz
Andreas Parr, FAU Erlangen-Nürnberg
Abstract
WMI-2: UHF RFID Reader based on NI PXIe
Manuel Ferdik, Markus Samuel Hesche, Georg Saxl, Thomas Ussmueller
Thomas Ussmueller, Universität Innsbruck
Abstract
WMI-3: Self-Interference Cancellation for Passive RFID
Gregor Lasser
Gregor Lasser, University of Colorado Boulder
Abstract
WMI-4: Software Defined Radio Based Backscatter RFID Reader for Tag Tracking and Sensing
Lukas Görtschacher, Wolfgang Bösch, Jasmin Grosinger
Jasmin Grosinger, Technische Universität Graz
Abstract
WMI-5: Spread Spectrum based Localization of UHF RFID Tags
Holger Arthaber, Florian Galler, Stefan Grebien, Klaus Witrisal
Holger Arthaber, Technische Univ. Wien
Abstract
WMI-6: Inkjet-/3D-Printed Nanotechnology-Enabled Wireless Communication, Sensing and RFID Modules for Internet of Things, “Smart Skin” and “Zero-Power” Applications
Manos M. Tentzeris
Manos M. Tentzeris, Georgia Tech
Abstract
WMI-7: RF and DSP Techniques for Enabling Low-Cost Software-Defined RFID Readers
Edward A. Keehr
Edward A. Keehr, Superlative Semiconductor
Abstract
WMI-8: Semi-Passive Backscatter Technologies for Low Cost Smart Agricultural Applications
Spyridon Nektarios Daskalakis, George Goussetis, Apostolos Georgiadis
Spyridon Nektarios Daskalakis, Heriot-Watt Univ.
Abstract
WMI-9: High Efficient Passive Localization Exploiting Harmonic RFID Tags
Alessandra Costanzo, Nicolò Decarli, Davide Dardari, Diego Masotti
Alessandra Costanzo, Univ. of Bologna
Abstract
WMI-10: All-Digital and Low Cost SDRs Applied to Backscatter Transceivers
Arnaldo S.R. Oliveira, Nuno Borges Carvalho
Arnaldo S.R. Oliveira, Universidade de Aveiro
Dimitris Pavlidis, Yuanxun Ethan Wang
Boston Univ., Univ. of California, Los Angeles
Location
158
Abstract
The Workshop addresses important challenges faced by the notions of reciprocity, time-reversal symmetry and sensitivity to defects in wave propagation and field transport by discussing disruptive ways in which devices and circuits are employed enabling new functionalities at high frequencies. Reciprocity can be broken, and nonreciprocal components can be built in CMOS using linear periodically time-varying circuits. Acoustic wave based integrated circuits will be described leading to time correlations and multipath equalizations directly at RF with almost no noise penalty. Various types of circulators for full-duplex and 5G mm-wave applications will be reported. Nonreciprocity considerations include one-way transport of electrons with certain spin in crystals such as topological insulators, magnetic heterostructures such as giant interfacial interaction and voltage-controlled magnetic anisotropy, magnet-free nonreciprocal and topological devices and metamaterials based on spatio-temporal modulation, self-biased magnon crystals, two-dimensional layered materials with no magnetic bias as applied to plasmonic isolators and nonreciprocal leaky-wave antennas.
Technical Papers
Abstract
WMJ-1: Integrated Nonreciprocal Components Based on Linear Time-Varying Circuits
Harish Krishnaswamy
Harish Krishnaswamy, Columbia Univ.
Abstract
WMJ-2: Time-Varying Electromagnetic Devices — Breaking the Limit of Reciprocity
Yuanxun Ethan Wang
Yuanxun Ethan Wang, Univ. of California, Los Angeles
Abstract
WMJ-3: Exploiting Acoustic Devices and Mechanical Domain to Achieve High-Performance RF Nonreciprocity
Songbin Gong, Univ. of Illinois at Urbana-Champaign
Abstract
WMJ-4: Achieving Nonreciprocity in Microwave Electronics at the Materials and Device Level
Debdeep Jena
Debdeep Jena, Cornell Univ.
Abstract
WMJ-5: Nanoscale Nonreciprocal Spin-Wave-Based Devices for Microwave Signal Processing
Ilya N. Krivorotov
Ilya N. Krivorotov, Univ. of California, Irvine
Abstract
WMJ-6: Nonreciprocity and Topological Propagation in Time-Modulated Metamaterials
Andra Alù
Andra Alù, CUNY ASRC
Abstract
WMJ-7: Self-Biased Hexagonal Ferrite Thin Film on GaN, AlN, Si Substrates for mm-Wave Devices
Mohammed Nurul Afsar, Valencia Koomson
Mohammed Nurul Afsar, Tufts Univ.
Abstract
WMJ-8: Enhancing Nonreciprocity Using Coherent Magnonics
Ezekiel Johnston-Halperin
Ezekiel Johnston-Halperin, The Ohio State University
Abstract
WMJ-9: Magnetless Approaches to Break and Engineer Reciprocity with 2D Materials
J. Sebastian Gomez-Diaz
J. Sebastian Gomez-Diaz, Univ. of California, Davis
Abstract
WMJ-10: Nonreciprocal Nano-Acoustic Spectral Processors: Enabling Chip-Scale Full-Duplex cm-/mm-Wave Front-Ends
Roozbeh Tabrizian
Roozbeh Tabrizian, Univ. of Florida
Dimitra Psychogiou, Michael Geiler
University of Colorado at Boulder, Metamagnetics
Location
161
Abstract
The workshop aims to explore challenges and benefits of design and integration of RF/microwave devices that employ novel magnetic materials and fabrication techniques. We will focus on materials with built-in magnetization that facilitate the realization of self-biased magnetic-based components, and non-linear magnetization processes for advanced signal processing. Integration of magnetic components on semiconductor-based platforms will be discussed, including material deposition, fabrication, and packaging methods as they relate to integrated magnetic devices. Micro- and nanomachining, hetero-epitaxial integration, and conventional solid-state chemistry approaches will be considered. The cutting-edge and comprehensive multi-physics-based modeling approaches and the corresponding experimental data for both linear and non-linear magnetic devices, e.g., RF circulators, isolators, frequency selective limiters, and signal-to-noise enhancers, will be presented. Factors limiting such RF/microwave performance criteria as bandwidth, dynamic range, noise figure, intermodulation distortion, and temperature stability will be discussed along with methods to overcome these limitations and improve the performance of such devices.
Technical Papers
Abstract
WMK-1: Integrated Ferroics for Sensing, Power, RF, Microwave and mm-Wave Electronics
Nian-Xiang Sun
Nian-Xiang Sun, Northeastern Univ.
Abstract
WMK-2: Integrated Self-Biased Circulators for C-Band and X-Band RF Applications
Yu Cao
Yu Cao, Qorvo
Abstract
WMK-3: Micromachined CMOS Compatible RF Magnetic Materials and Devices
Yong-Kyu Yoon, David P. Arnold
Yong-Kyu Yoon, Univ. of Florida, David P. Arnold, Univ. of Florida
Abstract
WMK-4: Frequency Selective Limiters
Steven N. Stitzer
Steven N. Stitzer, Northrop Grumman
Abstract
WMK-5: Synthesis and Assembly of Hexaferrite Nanoparticles for Monolithic Fabrication of mm-Wave Circuits
Florian Herrault
Florian Herrault, HRL Laboratories
Abstract
WMK-6: Development of Anisotropic Magnetic Nanocomposites for Miniaturized RF Device Applications
Yuepeng Zhang, Kaizhong Gao
Yuepeng Zhang, Argonne National Lab, Kaizhong Gao, Argonne National Lab
Abstract
WMK-7: Emerging Integrated RF Magnetics Technologies
Young-Kai Chen
Young-Kai Chen, DARPA
Abstract
WMK-8: CAD for Biased and Self-Biased Magnetic Nonreciprocal Devices
Zoya Popović, Dimitra Psychogiou
Dimitra Psychogiou, University of Colorado Boulder, Zoya Popović, University of Colorado Boulder
Abstract
WMK-9: Magnetic Circuit Design of Conventional and Self-Biased Circulators for Temperature Stable Performance
Thomas Lingel, Michael Geiler
Thomas Lingel, Anaren, Michael Geiler, Metamagnetics.
Abstract
WMK-10: Nonlinear Behavioral Modeling and Post-Distortion of Frequency-Selective Limiters
James S. Kenney, Kathleen L. Tokuda
James S. Kenney, Georgia Tech, Kathleen L. Tokuda, Georgia Tech
Abstract
WMK-11: Wafer Level Integration of Self-Biased Ferrite Materials and Devices with Wide Band Gap Heterostructures
Vincent G. Harris
Vincent G. Harris, Northeastern Univ.

-

Kamal Samanta, Wonbin Hong
Sony Europe, POSTECH
Location
157BC
Abstract
Next generation applications, including 5G and beyond, demand integration of higher speed and bandwidth RF functions into smaller volumes, yet with unprecedented levels of power and cost. For addressing these, mm-Wave and Terahertz have found an ever-increasing interest. However, as frequency increases, conventional integration lacks the geometric and interconnecting resolution, and the interconnection parasitic and losses between ICs add up quickly. The 3D heterogeneous integration technologies, employing precise wafer-scale/lithographic integration of III-V with Si semiconductors are demonstrating high suitability for these requirements. This workshop will discuss the current trends and state-of-the-art developments in 3D heterogeneously integrated multifunction circuits and modules, including integrating InP-HBT on Si/BiCMOS, and GaN-HEMT and InP-HBT on SiGe BiCMOS. Improved InP HBT integrated circuit process, BiCMOS controlled InP HBT oscillator for mm-Wave and THz beamforming, novel materials, and thermo-mechanical challenges will be discussed. Further, this workshop will present advanced micromachined and 3D-FOWLP integration and packaging covering 70GHz to THz.
Technical Papers
Abstract
WMH-1: Diverse Accessible Heterogeneous Integration (DAHI) Technology at Northrop Grumman Aerospace Systems (NGAS)
Augusto Gutierrez-Aitken, Bryan Wu
Augusto Gutierrez-Aitken, Northrop Grumman
Abstract
WMH-2: THz InP Integrated Heterojunction Bipolar Transistor Technology for mm-Wave Beam Steering Applications
Nils Weimann, Wolfgang Heinrich
Nils Weimann, Universität Duisburg-Essen
Abstract
WMH-3: Application of Heterogenous Integration to Advanced Transceivers and mm-Wave Phased Arrays
Timothy M. Hancock
Timothy M. Hancock, DARPA
Abstract
WMH-4: Preliminary Observation on Wafer-Level Terahertz Packaging and Heterogeneous Integration
Ho-Jin Song
Ho-Jin Song, POSTECH
Abstract
WMH-5: Packaging and Integration Solutions at Terahertz Frequencies
Goutam Chattopadhyay
Goutam Chattopadhyay, Jet Propulsion Lab

-

Vadim Issakov, Uwe Rüddenklau, Amelie Hagelauer
Infineon Technologies, FAU Erlangen-Nürnberg
Location
157BC
Abstract
In this half-day workshop we discuss several aspects of the Remote Radio Unit (RRU). This is a remote radio transceiver that is located on the radio mast and is connected to the baseband unit (BBU) typically via a fiber interface. The RRU should support data rates of tens or hundreds of Gbps and MIMO operation. This poses challenging requirements for RF front-ends and antenna beamforming. Therefore, RRU has become one of the most important sub-systems in the distributed fronthaul architecture. Distinguished speakers from leading companies from industry and academia discuss several aspects of 5G infrastructure with a focus on challenges related to the hardware implementation of RF Front-End Modules (FEMs) and beamforming techniques for RRU. Additionally, a vision of 5G wireless networks will be provided. A brief concluding discussion will round-off the workshop to summarize the key learnings and discuss the future trends in radio access networks.
Technical Papers
Abstract
WFH-1: An Industry View of mm-Wave Technology and Research Trends for 5G Access Applications with Particular Emphasis on Front-Ends and Antennas
Renato Lombardi, Maurizio Pagani
Renato Lombardi, Huawei Technologies
Abstract
WFH-2: Rate Characterization of mm-Wave Beamforming with Circuits Constraints
Robert W. Heath, Amine Mezghani
Robert W. Heath, Univ. of Texas at Austin
Abstract
WFH-3: System Aspects of Antenna Integration for Beamforming
Chiara Mariotti, Uwe Rüddenklau, Vadim Issakov
Chiara Mariotti, Infineon Technologies
Abstract
WFH-4: Integration Challenges for 5G mm-Wave Radios
Kristoffer Andersson
Kristoffer Andersson, Ericsson
Abstract
WFH-5: 5G and Cloud, Evolution of the Telecommunication Networks
Valerio Frascolla
Valerio Frascolla, Intel

-

Luciano Tarricone, Caterina Merla
Università del Salento, Enea
Location
150
Abstract
The workshop addresses the “electroceutical” topic: a multidisciplinary initiative for medical treatments using electric/magnetic/electromagnetic power to modulate different body functions controlled by neurological circuits. These functions span from control of neuro-disorders, to heart pathologies, endocrine or metabolic dysfunctions. The workshop will cover the technological aspects, and will provide updated knowledge on modelling interactions between the stimulating signals (in a wide band of frequencies) and the targeted organs, down to the network of neurons. In the workshop, new technological applications related to flexible electronics (at radiofrequency-RF and microwaves-MW) and implantable devices will be proposed, including the use of nanosecond pulsed electric fields to target deep body regions with the new paradigm of the electric pulse bipolar cancellation effect. Advanced modelling of tissues and organs will be proposed under these stimulations to provide the so-called “dose-effects” curve as a meter for controlled and personalized treatments.
Technical Papers
Abstract
WFA-1: Electromagnetic Theoretical and Technological Bases for “Electroceuticals”
Luciano Tarricone, Giuseppina Monti, Caterina Merla
Luciano Tarricone, Università del Salento
Abstract
WFA-2: Nerve Stimulation for Pain Treatment
Peter S. Staats
Peter S. Staats, Johns Hopkins Univ.
Abstract
WFA-3: Electroceuticals for Mapping and Modulating Gut Activity
Aydin Farajidavar
Aydin Farajidavar, New York Institute of Technology
Abstract
WFA-4: Wireless Microenergy Platform: Pushing Implantable Remote Stimulation to the µl (Micro-Liter) Level
Simon Hemour
Simon Hemour, IMS (UMR 5218)
Abstract
WFA-5: Advanced Open Source In Silico Solution for Device Development, Treatment Planning, and Virtual Clinical Trials in Bioelectronic Medicine
Antonino Mario Cassará, Esra Neufeld, Niels Kuster
Niels Kuster, IT’IS Foundation
Abstract
WFA-6: Manipulating the Response of Peripheral Nerves with Nanosecond Electric Pulses
Maura Casciola, Andrei Pakhomov
Maura Casciola, Old Dominion Univ.
Abstract
WFA-7: Electromanipulate Biological Cells with High Frequency Signals: a New Way to Characterize Cell Agressivity in the Frame of Cancer Treatment?
Arnaud Pothier
Arnaud Pothier, XLIM (UMR 7252)
Abstract
WFA-8: New Antibody-Free Rare Cell Screening Platform for Cancer Diagnostics
Hung-Wei Wu
Hung-Wei Wu, Kun Shan Univ.
Abstract
WFA-9: Electroceuticals Technologies and Modelling: Fundamental Requirements to Effectively Manage Future Therapies
Caterina Merla, Giuseppina Monti, Luciano Tarricone
Caterina Merla, Enea
Andreas Wentzel, Gregor Lasser
FBH, University of Colorado Boulder
Location
151AB
Abstract
Next-generation wireless networks require a denser spatial distribution of base stations and a simultaneous usage of several antennas (MIMO). Moreover, frequency and service agility of the hardware components as well as integration of the RFPAs into the antenna and high frequency operation are pursued trends to fulfill the future requirements. As a result, the RFPAs need to satisfy the following essential requirements: high energy efficiency over a wide dynamic range of output power, supporting large bandwidths, while maintaining a small form factor and flexibility. In this workshop, international industry and academic experts will discuss demands and various perspectives with regard to efficient, extremely broadband and highly linear system and circuit design techniques suitable for future wireless communications in 5G and beyond. Various Si- and GaN-based solutions from cutting edge Doherty designs, load- as well as supply-modulated amplifiers, up to all-digital transmitters and PA approaches will be examined up to mm-waves.
Technical Papers
Abstract
WFB-1: Overview About RF and PA Requirements for 5G NR and Challenges for Hardware Implementation
Franz Dielacher
Franz Dielacher, Infineon Technologies
Abstract
WFB-2: Linearity and Efficiency in 5G mm-Wave Transmitters
Christian Fager
Christian Fager, Chalmers Univ. of Technology
Abstract
WFB-3: Analog Techniques for Efficiency Enhancement
Taylor W. Barton
Taylor W. Barton, University of Colorado Boulder
Abstract
WFB-4: Wideband GaN-Based Supply Modulated Power Amplifier Systems
Olof Bengtsson, Sophie Paul, Sebastian Preis, Nikolai Wolff
Olof Bengtsson, FBH
Abstract
WFB-5: Digitally Supply-Modulated GaN PAs with Analog Predistortion for Broadband Signals
Gregor Lasser, Zoya Popović
Gregor Lasser, University of Colorado Boulder
Abstract
WFB-6: Digital Active Antenna Systems for 5G and Beyond mm-Wave Massive-MIMO Systems
Tomoya Kaneko
Tomoya Kaneko, NEC
Abstract
WFB-7: All-Digital Transmitter Architectures — Challenges and Opportunities
Rui Ma
Rui Ma, MERL
Abstract
WFB-8: Digital Transmitter Architectures for 5G and Beyond
Andreas Wentzel, Thomas Hoffmann, Florian Hühn
Andreas Wentzel, FBH
Cristina Andrei, Charles F. Campbell
Brandenburgische Technische Universität, Qorvo
Location
153AB
Abstract
The goal of this full-day workshop is to address the current state-of-the-art of GaN-based RF front-ends for communication systems, with focus on the next generation of integrated one-chip solutions. In particular, the challenges related to the design requirements for system components and the hardware implementation of innovative array antennas and RF front-ends for communications up to Ka-band will be addressed. Speakers from leading companies, research institutes and academia will present several aspects related to the design of antenna arrays, switches and switch-based modules, rugged low-noise amplifiers, high power amplifiers, and novel system architectures. The talks will tackle different approaches to implement front-ends in communication systems in the microwave bands. A brief discussion will conclude the workshop summarizing the key issues addressed during the day. The attendees will be encouraged to put questions and to discuss design issues that they may have.
Technical Papers
Abstract
WFC-1: Front-End Duplexing Solutions
Charles F. Campbell
Charles F. Campbell, Qorvo
(08:00 - 17:15)
Abstract
WFC-2: RF Challenges in the Design of Phased-Array Antennas for 5G and Satcom Front-Ends
Andreas Lauer
Andreas Lauer, IMST GmbH
(08:00 - 17:15)
Abstract
WFC-3: Properties of GaN LNAs for Front-End Applications
Cristina Andrei
Cristina Andrei, Brandenburgische Technische Universität
(08:00 - 17:15)
Abstract
WFC-4: Broadband Power Amplifier Solutions from 4kHz to 18GHz
Sebastina Preis
Sebastina Preis, Rohde & Schwarz USA, Inc.
(08:00 - 17:15)
Abstract
WFC-5: Low-Noise mm-Wave Gallium Nitride MMICs and Transceivers
Fabian Thome
Fabian Thome, Fraunhofer Institute for Applied Solid State Physics
(08:00 - 17:15)
Abstract
WFC-6: From Spaceborne C-Band SAR Down to Single Chip GaN Front-Ends
Marc van Heijningen
Marc van Heijningen, TNO
(08:00 - 17:15)
Abstract
WFC-7: GaN Single-Chip Front-Ends from S-Band to mm-Waves for Space and Defense
Ernesto Limiti
Ernesto Limiti, Università di Roma “Tor Vergata”
(08:00 - 17:15)
Abstract
WFC-8: Single-Chip GaN Front-End for X-Band AESA
Patrick Schuh
Patrick Schuh, HENSOLDT Sensors
(08:00 - 17:15)
Kenneth E. Kolodziej, Bradley T. Perry
MIT Lincoln Laboratory
Location
156AB
Abstract
Many wireless systems could benefit from the ability to transmit and receive on the same frequency at the same time, which is known as In-Band Full-Duplex (IBFD) and/or Simultaneous Transmit and Receive (STAR). This technology could lead to enhanced spectral efficiency for future wireless networks, such as fifth-generation New Radio (5G NR) and beyond, and/or could enable capabilities and applications that were previously considered impossible, such as IBFD with phased array systems. In this workshop, experts from academic and federal research institutions will discuss the various approaches that can be taken to suppress the inherent self-interference that is generated in IBFD systems, and will present both static and adaptive techniques that span across the propagation, analog and digital domains. Presentations will contain details and measured results that encompass high-isolation antenna designs, RF and photonic cancellation as well as signal processing approaches, which include beamforming and linear/non-linear equalization. Throughout this workshop, state-of-the-art IBFD systems that utilize these technologies will be provided as practical examples for various applications.
Technical Papers
Abstract
WFD-1: Wideband Antenna Systems
Dejan S. Filipovic
Dejan S. Filipovic, University of Colorado Boulder
Abstract
WFD-2: Electrical Balance Duplexers: Practical Performance in the Field
Leo Laughlin
Leo Laughlin, Univ. of Bristol
Abstract
WFD-3: One-Way Ramp to a Two-Way Highway: Integrated Nonreciprocal Antenna Interfaces for Single- and Multi-Antenna Full-Duplex Wireless
Harish Krishnaswamy
Harish Krishnaswamy, Columbia Univ.
Abstract
WFD-4: Radio Frequency Cancellation Approaches for In-Band Full-Duplex Systems
Kenneth E. Kolodziej
Kenneth E. Kolodziej, MIT Lincoln Laboratory
Abstract
WFD-5: Photonics-Based Techniques for In-Band Full-Duplex Applications
Vincent J. Urick
Vincent J. Urick, DARPA
Abstract
WFD-6: State-of-the-Art Solutions for Nonlinear Digital Cancellation in Low-Cost Full-Duplex Radios
Dani Korpi
Dani Korpi, Nokia Bell Labs
Abstract
WFD-7: Digital Nonlinear Processing for Simultaneous Transmit and Receive
Joel Goodman
Joel Goodman, Naval Research Laboratory
Abstract
WFD-8: Applications of the Full-Duplex Radio Technology Beyond Wireless Communications
Taneli Riihonen
Taneli Riihonen, Tampere University
Abstract
WFD-9: Simultaneous Transmit and Receive Phased Arrays
Jonathan Doane
Jonathan Doane, MIT Lincoln Laboratory
Markus Gardill, Christian Carlowitz, Nils Pohl
InnoSenT, FAU Erlangen-Nürnberg, Ruhr-Universität Bochum
Location
152
Abstract
Recent developments in system concepts and digital signal processing techniques are the key enablers for advanced microwave sensors and imagers offering unprecedented accuracy and resolution. A profound understanding of the underlying working principles of those systems is a key competence to advance the design of microwave sensors and imagers at component, system, as well as signal-processing levels. In this workshop, those concepts and processing techniques are introduced from both methodology-driven as well as application-driven viewpoints. Imaging radars, holographic techniques, polarimetric decomposition techniques, advanced processing for automotive radar, cognitive radar, and the application of compressed sensing to radar systems are introduced in tutorial-style presentations from leading experts working in the respective fields, from both academia and industry. The workshop provides a unique platform for an active exchange, to learn from cross-platform implementations, and to get ready to actively contribute to the next-level generation of microwave sensors and imagers.
Technical Papers
Abstract
WFE-1: Polarimetric Decomposition Techniques for Short Range Imaging Radar
Julian Adamentz, Ingrid Ullmann
Ingrid Ullmann, Friedrich-Alexander Univ.
Abstract
WFE-2: Holography in mm-Wave Imaging: Indirect Microwave Holography and Computational Imaging using Holographic Frequency-Diverse Metasurface Antennas
Okan Yurduseven, Thomas Fromenteze, Goutam Chattopadhyay, David R. Smith
Okan Yurduseven, JPL
Abstract
WFE-3: Fully Adaptive Radar: From Theory to Implementation
Graeme E. Smith
Graeme E. Smith, The Ohio State University
Abstract
WFE-4: Compressive Sensing and Sparse Reconstruction in Modern Radar Signal Processing
María Antonia González-Huici
María Antonia González-Huici, Fraunhofer FHR
Abstract
WFE-5: Model-Based Parameter Estimation in Automotive Radar Signal Processing
Florian Engels
Florian Engels, ZF Friedrichshafen
Abstract
WFE-6: Classification and Synthetic Data Generation for Automotive Radar
Christopher Grimm, Ernst Warsitz, Tai Fei, Ridha Farhoud, Tobias Breddermann, Reinhold Häb-Umbach
Christopher Grimm, HELLA
Abstract
WFE-7: Interferometric Microwave Sensing for Medical Diagnostics
Sven Schellenberger, Kilin Shi, Fabian Michler, Alexander Koelpin
Sven Schellenberger, Brandenburgische Technische Universität
Abstract
WFE-8: Terahertz Sensing for Encoder and Positioning Systems
Perry Wang, Toshiaki Koike-Akino, Rui Ma, Philip Orlik, Wataru Tsujita, Ruonan Han, Kubilay Sertel
Perry Wang, MERL
Abstract
WFE-9: High Resolution Radar Measurements for Distance Sensing and Imaging Using Compact SiGe Radar
Nils Pohl, Jan Siska, Lukas Piotrowsky, Andries Küter, Reinhold Herschel
Nils Pohl, Ruhr-Universität Bochum
Vadim Issakov, Jens Reinstädt, Robert Weigel
Infineon Technologies, FAU Erlangen-Nürnberg
Location
156C
Abstract
Radar sensors are used extensively almost everywhere to make daily life more comfortable and safe. Recent advances in silicon-based semiconductor technologies and packaging solutions enable the realization of cost-efficient low-power highly-integrated mm-wave radar sensor systems. In this full-day workshop we will discuss emerging (non-automotive) radar applications focusing on industrial, medical and consumer electronics, operating at mm-wave frequencies. Distinguished speakers from leading companies and academia will present a wide range of topics spanning from chip design of highly-integrated radar transceivers in silicon-based technologies, advanced system architectures (e.g. interferometry or MIMO radar), state-of-the-art and future trends on radar modulation techniques (e.g. FMCW using Micro-Doppler effect, PMCW, OFDM, Pulse-Doppler-Radar) up to the emerging applications (e.g. gesture recognition, object classification, glucose detection, vital sign monitoring). A brief concluding discussion will round-off the workshop to summarize the key learnings on the wide range of aspects presented during the day.
Technical Papers
Abstract
WFF-1: Low-Power mm-Wave Sensors in CMOS and SiGe Technology
Sorin P. Voinigescu, Jürgen Hasch
Sorin P. Voinigescu, Univ. of Toronto
Abstract
WFF-2: UaV Detection Using Low-Cost 5G Phased-Arrays
Aaron Wang, Thomas Phelps, Kerim Kibaroglu, Mustafa Sayginer, Gabriel M. Rebeiz
Aaron Wang, Univ. of California, San Diego
Abstract
WFF-3: Highly-Integrated mm-Wave Radar Transceivers for Industrial and Consumer Applications
Vadim Issakov
Vadim Issakov, Infineon Technologies
Abstract
WFF-4: Zero-Effort Health Monitoring Using Radar Systems
George Shaker
George Shaker, Univ. of Waterloo
Abstract
WFF-5: Radar-Based Vital Sign Monitoring
Fabian Michler, Robert Weigel
Fabian Michler, FAU Erlangen-Nürnberg
Abstract
WFF-6: Modulated Reflectors in Applications for Localization and as Low-Cost Radar Target Simulator
Andreas Stelzer, Werner Scheiblhofer, Andreas Haderer
Andreas Stelzer, Johannes Kepler Universität Linz
Abstract
WFF-7: Imaging MIMO Radar for Home Monitoring
Vito Giannini
Vito Giannini, Uhnder
Abstract
WFF-8: Multistatic MIMO OFDM Radar
Benjamin Nuss, Thomas Zwick, Mario Pauli
Mario Pauli, KIT
Abstract
WFF-9: High Resolution 140GHz MIMO Radar for Contact-less Vital Sign Monitoring and Hand Gesture Recognition
André Bourdoux
Abstract
WFF-10: Pulsed Radar for Various Applications
Yasushi Aoyagi
Yasushi Aoyagi, Furukawa Electric
Abstract
WFF-11: Interferometric Industrial Distance Sensing by Six-Port Technology
Alexander Koelpin
Alexander Koelpin, Brandenburgische Technische Universität
Abstract
WFF-12: Signal Processing Solutions for Object Detection, Tracking, and Classification using 60GHz FMCW Radar
Michael Livshitz, Aleksandar Purkovic
Mingjian Yan, Texas Instruments

-

Costas D. Sarris
Univ. of Toronto
Location
157A
Abstract
Remarkable advances in the available computational power over the past few years, and those anticipated to come, have propelled machine learning algorithms (some developed decades ago) to the forefront of R&D in a wide and diverse range of fields: from medicine to autonomous vehicles and robotics. As the interest in these algorithms deepens, new algorithmic and theoretical developments are reported and applications are explored. These are assisted by the availability of open-source software tools and libraries, such as Google’s TensorFlow and PyTorch. This workshop is a first step towards exploring the relevance and importance of machine learning for microwave engineers, and their CAD tools as used in industry and academia. We are combining a review of the field, its rich past in the microwave community (where artificial neural networks (ANNs) have been used as tools for microwave device modeling for many years) and its prospects, as developments in “deep learning” push the envelope of traditional ANNs even further, creating new opportunities to be harnessed.
Technical Papers
Abstract
WFG-1: Artificial Neural Networks for Microwave Design: An Overview
Qijun Zhang
Qijun Zhang, Carleton Univ.
Abstract
WFG-2: Bayesian Framework for Optimization and Generalization Techniques for Microwave Design
Madhavan Swaminathan
Madhavan Swaminathan, Georgia Institute of Technology
Abstract
WFG-3: Time-Domain Computational Electromagnetics with Machine Intelligence
Zhen Peng
Zhen Peng, Univ. of New Mexico
Abstract
WFG-4: Artificial Neural Networks for RF Component Modeling
Lei Zhang
Lei Zhang, NXP Semiconductors
Abstract
WFG-5: Machine Intelligence for Electromagnetic Computations
Costas D. Sarris
Costas D. Sarris, Univ. of Toronto