Wafer-Level Packaging for High Frequency Applications at Northrop Grumman Space Systems

Wafer Level Packaging (WLP) has become a key technology development and production effort in the past few years for applications to 5G, 6G in the commercial world and space and defense. These applications span frequency ranges up to W-band and in general >100GHz. Several factors need to be considered to select a suitable approach, including active semiconductor technologies, materials for interposers, the WLP methods and interfaces, cost, yield, and last but not least the overall reliability of wafer scale packaging. These topics will be presented and discussed at the workshop.