A 57.6Gb/s Wireless Link Based on 26.4dBm EIRP D-Band Transmitter Module and a Channel Bonding Chipset on CMOS 45nm

This paper presents a baseband to D-band wireless link based on a transmitter module integrating a 45-nm CMOS channel bonding chipset and a high-gain antenna in PCB technology. The link realized using a commercial receiver at 42 cm achieves a data rate of 57.6 Gb/s using a multi-channel 16-QAM with a transmitting energy efficiency of 27.4 pJ/b.