mm-Wave Antenna on Package Challenges: Manufacturing, Cost and Performance

Moving to mm-wave frequencies allowed us to implement a full radar system on a chip including its antennas. Designing antennas on the package of the IC, for mm-wave applications, poses a series of challenges that demand innovative solutions. Cost limitation forces us to use certain package structures for ease of manufacturing. It also pushes the limits of minimum possible size for the package to fit more devices in a panel. In addition to size and manufacturing limitations, performance including parameters such as radiation efficiency, bandwidth and isolation should not be sacrificed. The presentation will review some examples of challenges and solutions for antenna on package at mm-wave frequencies for automotive and industrial radar applications.