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The Future of Heterogeneous Integration for mm-Wave Systems — Challenges and Opportunities
Emerging electronic systems require the dense integration of many chiplets in either 2D or 3D form. The metrics for these systems will be dictated by power, performance, form factor, cost, and reliability. The complexity of these systems is expected to be large given the integration of sensing, wireless, computing, and other functionality on a single packaging platform that combines electronics and photonics together. Such systems pose immense integration challenges but also provide opportunities for innovation on several fronts that include architecture, design, thermal, materials, embedded intelligence, and many more. This presentation will provide a discussion of the state-of-the-art and opportunities for the future with a focus on 6G communications.