D-Band 2D Scalable Phased Arrays and Transceivers for 6G: Challenges and Recent Progress

6G is envisioned to provide ultimate experience for all through hyper-connectivity involving humans and everything, with unprecedented requirements and expectations. In this vision, sub-THz technology is a leading candidate to realize the 6G requirements due to abundant spectrum available to use for converged wireless communication and sensing use cases. However, at this frequency range, the chip size is close to or larger than half of the carrier wavelength, making it comparable to antenna pitch. Therefore, it is very challenging to implement a large-size phase array, especially in the 2D scalable case. On top of this, heating dissipation is another issue. In this talk, I will share our recent D-band IC and module development with focus on such issues. The end-to-end test results will also be shared in this talk.