Material and Packaging Trends for High Frequency mm-Wave Applications

With increasing numbers of applications working at higher frequencies such as 5G and 6G communication modules or automotive radars, the need for packaging technologies at lower cost and higher manufacturing volumes is increasing. A good example here is the 77GHz automotive radar from Infineon or NXP in fan-out wafer level packaging technology (FOWLP). In addition heterogeneous integration of different active and passive components will enable even more new applications with better performance. The presentation will give an overview on advanced packaging trends with focus on high frequency mm-wave applications as well as latest packaging material developments and usages of dielectrics, printed circuit board materials, or encapsulants, etc.