Integral Equation Methods for the Electromagnetic Analysis of Interconnect Networks: Fundamentals, State-of-the-Art, and Open Challenges

Electromagnetic solvers are crucial for signal and power integrity engineers at the chip, package, and board levels. With the rise of technologies like 3D integration, chiplets, and sub-nm nodes, the demand for full-wave simulations is rapidly growing. This tutorial reviews the state-of-the-art in integral equation methods for Maxwell’s equations, widely used for interconnect analysis. Key topics include wideband modeling of skin effect, layered substrates, and acceleration techniques. Additionally, we will cover recent advances and open challenges, with examples focusing on interconnect networks and integrated passive components. This tutorial provides a comprehensive overview of mathematical foundations and emerging solutions.