Empowering Multi-Band 5G/6G Wireless and Beyond from Passive Components to Active Microsystem

This talk presents the recent research on substrate-integrated defected ground structures (SIDGS) for passive components design including filter, balun, power divider, etc. These circuits exhibit low insertion loss, wide stopband with low radiation loss, and miniaturized size and these features are simultaneously achieved by such SIDGSs compared to prior-arts. Meanwhile, novel architectures such as digital-microwave transmitter, reflectionless receiver, and auto-tracking phased array transceivers using scaled CMOS technologies with state-of-the-art performance including wide operation band, high data-rate, high power-efficiency, and high phase-resolution are presented. These passive circuits and active micro-systems are attractive for multi-band 5G/6G wireless and beyond.