BiCMOS Interconnections and Wafer-Level Packaging Technologies for Sub-THz Communication and Sensing Applications

SiGe BiCMOS and advanced wafer-level packaging technologies are highly desired to realize high performance (sub-) THz systems. In this talk, state-of-the-art SiGe BiCMOS technology with wafer-level packaging components and technologies will be presented. Novel W2W and C2W interconnection technologies as well as antenna-in-package technologies will be demonstrated enabling (sub-) THz packaging and heterogeneous integration.