Antenna-Integrated, Chip-Embedded Glass Packaging of 200-GHz Transceiver Modules

This work reports 200 GHz transceiver modules built from die-embedded glass packages. Previously reported 200-GHz InP HBT transceivers are integrated with 4×2-array antenna-in-package (AiP) solutions. System performance is optimized by chip/package co-design. A single-channel 204-GHz wireless radio link across 7 meters is demonstrated, achieving 44 Gbps (11-Gbaud 16-QAM) with 14.14% associated rms error-vector magnitude (EVM). This is the first reported packaging result demonstrating system integration of a full G-band transceiver module with integrated AiP.