Panel Sessions

Panel Sessions

The Internet of Things (IoT) – back to the future, or no future?

Monday, 3 June 2019
Room 162 AB
12:00 ~ 13:15

RFIC2019 Panel Sessions Chair:
Donald Y.C. Lie, Texas Tech University, USA

Panel Organizers and Moderators:
Oren Eliezer, PHAZR, USA
Debopriyo Chowdhury, Broadcom, USA

Panelists:

  1. Fari Assaderaghi, Sr. VP & CTO, NXP Semiconductors, USA
  2. Min Hao, Founder & Chairman, Shanghai Quanray Electronics, Professor, Fudan University, China
  3. Alessandro Piovaccari, Sr. VP & CTO, Silicon Labs, USA
  4. Alain Serge Porret, VP, CSEM, Switzerland
  5. Chirag Bhavsar, Sr. Manager, Amazon, USA

Abstract:

Well… It’s been 4 years since our RFIC 2015 lunchtime panel “The Internet of Things (IoT) — What’s All the Hype?”, so has the market for IoT devices been exploding since then or did the hype burst? Four more years into the future — what will it look like? How will the accelerated introduction of 5G and the developments in ‘big data’ and artificial intelligence (AI) affect it? Can we be hopeful as RFIC designers that it will provide us with endless employment and research opportunities?

Come equipped with your own outlook and questions and join the debate with the panel of experts from the industry and academia. Hear what IoT RF industry leaders from Amazon, NXP and Silicon Labs say, as well as the experts’ opinions from CSEM (Swiss Center for Electronics and Microtechnology) and Shanghai Quanray Electronics. There won’t be a better place to have your lunch!

Will Artificial Intelligence (AI) and Machine Learning (ML) take away my job as an RF/Analog Designer?

Tuesday, 4 June 2019
Room 162 AB
12:00 ~ 13:15

IMS2019 Panel/Rump Sessions Chair: Matthew Morton, Raytheon, USA
RFIC2019 Panel Sessions Chair: Donald Y.C. Lie, Texas Tech University, USA

Panel Organizers and Moderators:
Osama Shana’a, MediaTek, USA
Francois Rivet, University of Bordeaux, France

Panelists:

  1. Ron Rohrer, Professor, Southern Methodist University, USA
  2. Taylor Hogan, Senior Architect, Cadence, USA
  3. Thomas Rondeau, DARPA MTO Program Manager, USA
  4. Paul Franzon, Professor, North Carolina State University, USA
  5. Modi Sankalp, MathWorks, USA

Abstract:

Abstract: Machine learning (ML) and artificial intelligence (AI) are no longer futuristic concepts. They are already making their marks not only in applications that are purely data-analytics related, but also in communications, transportation, navigation, autonomous driving, finance, e-commerce, gaming, and many more fields. For example, ML/AI have already replaced humans in driving cars/ trucks and in store cash registers. With AI also entering our territory of RF system and IC development, should we expect that our jobs as ‘conventional’ designers will soon be taken away? What will future RF systems and ICs be like, with AI being incorporated in them, as well as in the tools used to design them?

Our distinguished panelists from the academia, DARPA, CAD/EDA, and RF industries will debate what we may expect to see in the near and distant future, and how we should prepare ourselves for the inevitable realities. You don’t want to miss this!