Dr. Greg Henderson
Senior Vice President
Automotive, Communications and Aerospace & Defense
Analog Devices, Inc.
Abstract: Through significant advances in RFIC technology that have shrunk form factors and price points, high complexity RF, Microwave, and Millimeter wave solutions for communications and sensing are reaching the point of ubiquity. Large, complex multi-antenna and phased array solutions that previously only government organizations could justify have become the basis of modern wireless communications and automotive radar. Cars include millimeter-wave radar technology as a standard feature and 77GHz radar is playing a critical role in the autonomous vehicle revolution. Wireless bandwidth has grown from a trickle to a torrent and high channel count, multi-antenna systems are the key enabler for 5G, whose impact is predicted to extend beyond enabling that torrent of mobile data to revolutionizing industries as varied as agriculture, automotive, healthcare, and industrial.
To date, most of the advances in RFIC technology have largely been driven by the industry moving to high volume advanced geometry CMOS processes and massive increases in system-on-chip integration of complete antenna-to-bits signal chains. Since these are not the most friendly process technologies for traditional RF and microwave circuit blocks, the advances of tomorrow need new RF signal chain and circuit block architectures that exploit the strengths of advanced CMOS processes, while mitigating the disadvantages. This paper will show how such novel architectures and circuit innovations are enabled through leverage of high-performance digital capabilities, resulting in important performance advances that in fact exceed what could be obtained from traditional “RF friendly” process technologies. The paper will show how digitally-assisted-and-enabled RFICs are enabling the future of wireless sensing and communications with real world examples for applications like 5G and automotive radar.
Speaker Bio: Dr. Greg Henderson was appointed Senior Vice President of Analog Devices’ Automotive, Communications and Aerospace & Defense Group in 2017. Prior to this role, he served as vice president of the RF and Microwave business unit, responsible for the creation and execution of Analog Devices’ strategy for its full suite of RF and microwave products and solutions.
Dr. Henderson has served in leadership roles in the microwave, semiconductor, and wireless communications industry for more than 20 years. He joined Analog Devices as part of the company’s acquisition of Hittite Microwave Corporation, where he served as Vice President of RF and Microwave business units. From 2009 to 2013, Dr. Henderson served as Hittite’s director of broadband products and prior to Hittite, he served as the director of product management, for the Public Safety and Professional Communications Division of Harris Corporation. Prior to Harris Corporation, Dr. Henderson held various management and R&D/product development positions at TriQuint Semiconductor, IBM, and M/A-COM.
Dr. Henderson earned a B.S. in electrical engineering from Texas Tech University and was granted a Ph.D. in electrical engineering from the Georgia Institute of Technology. He holds seven patents in wireless communications and semiconductor technologies and has published more than 20 conference and journal papers.