IMS2019 Panel/Rump Sessions Chair: Matthew Morton, Raytheon, USA
RFIC2019 Panel Sessions Chair: Donald Y.C. Lie, Texas Tech University, USA
Panel Organizers and Moderators:
Osama Shana’a, MediaTek, USA
Francois Rivet, University of Bordeaux, France
- Ron Rohrer, Professor, Southern Methodist University, USA
- Taylor Hogan, Senior Architect, Cadence, USA
- Thomas Rondeau, DARPA MTO Program Manager, USA
- Paul Franzon, Professor, North Carolina State University, USA
- Modi Sankalp, MathWorks, USA
Abstract: Machine learning (ML) and artificial intelligence (AI) are no longer futuristic concepts. They are already making their marks not only in applications that are purely data-analytics related, but also in communications, transportation, navigation, autonomous driving, finance, e-commerce, gaming, and many more fields. For example, ML/AI have already replaced humans in driving cars/ trucks and in store cash registers. With AI also entering our territory of RF system and IC development, should we expect that our jobs as ‘conventional’ designers will soon be taken away? What will future RF systems and ICs be like, with AI being incorporated in them, as well as in the tools used to design them?
Our distinguished panelists from the academia, DARPA, CAD/EDA, and RF industries will debate what we may expect to see in the near and distant future, and how we should prepare ourselves for the inevitable realities. You don’t want to miss this!