Dowload the RFIC 2018 Call for Papers (PDF)

The 2018 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2018) will be held in Philadelphia, PA, USA, on June 10-12, 2018. For the latest information, please visit:

Electronic Paper Submission/Communication: Technical papers must be submitted via the RFIC 2018 website at Hard copies will not be accepted. Complete information on how and when to submit a paper will be posted on the RFIC 2018 website soon.

Technical Areas: The conference will solicit papers describing original work in RFIC circuits, systems engineering, design methodology, RF modeling and CAD simulation, RFIC technologies, devices, fabrication, testing, reliability, packaging and modules to support RF applications in areas such as, but not limited to:

Wireless Cellular and Connectivity: 2G/3G/4G/5G (sub-6GHz), LTE, WWAN, WLAN, BT, GPS, FM, UWB
Low Power Transceivers: RFID, NFC, Zigbee, 802.15.4, WPAN, WBAN, Biomedical, Sensor Nodes, IR-UWB, Wake-up Receivers
Receiver Sub-Systems and Circuits: LNAs, Mixers, VGAs, phase shifters, switches, Integrated FEM, amplifiers, filters, demodulators
Mixed-Signal RF and Data Converters: RF and baseband converters (ADC/DAC), Sub-sampling/Over-sampling Circuits
Reconfigurable and Tunable Front-Ends: SDR/Cognitive Radio, Wideband/Multi-band Front-Ends, Interference Cancellation, Full-Duplex, Adaptive Front-Ends
Transmitter Sub-Systems and Power Amplifiers: Power Amplifiers, Drivers, modulators, digital transmitters, Advanced TX circuits, linearization and efficiency enhancement techniques
Oscillators: VCOs, injection-locking frequency dividers/multipliers
Frequency Synthesis: PLLs, DLLs, MDLLS, DDS, LO drivers, frequency dividers
Device Technologies, Packaging, Modeling, and Testing: CMOS, SOI, FinFet, SiGe, GaAs, GaN, MEMS, Integrated Passives, Photonic, Emerging Devices, Reliability, Packaging, Modeling and Testing, EM Modeling/Co-Simulation, Built-in-Self-Test (BIST)
Millimeter- and Sub-Millimeter Wave Systems: >20GHz SoCs/SiPs for wireless communication (5G mm-Wave, WiGig, 802.11ay), phased-arrays, imaging, radar, remote sensing
High-Speed Data Transceivers: Wireline, Optical Transceivers, and CDRs for High-Speed Data links

Technical Format: The conference starts on Sunday, June 10, 2018 with workshops and short courses, followed by two plenary talks and the reception concurrent with joint Industry Showcase and Finalist Student Papers Forum. Monday, June 11th and Tuesday, June 12th, 2018 will be comprised of oral presentations and Interactive Forum (posters) of contributed papers and special lunch-time panel sessions. ***NEW THIS YEAR*** - A doubleblind review process will be used to ensure anonymity for both authors and reviewers. Detailed instructions on how to submit a double-blind compliant paper can be found at

RFIC Symposium also awards one Best Student Paper and one Best Industry Paper.

Journal Submissions: Selected papers will be invited for special issues in IEEE Journal of Solid State Circuits and Transactions on Microwave Theory and Techniques.

Microwave Week 2018: The RFIC 2018 is part of Microwave Week, which will start with the RFIC Symposium, followed by the IMS Symposium, and the ARFTG Microwave Measurement Conference. This year, IMS2018 themes, “Microwaves, Medicine, Mobility”, highlight the contributions of RF, microwaves and millimeter-waves to the fields of medicine (including diagnosis and treatment) and telecommunications (including 5G, IoS and IoT).

Industry Exhibition: This two-day Exhibition typically showcases as many as 1000 Exhibitors who represent the state-of-the-art of the industry covering everything needed for RF and microwave design including materials, technologies, components and subsystems, as well as RF IC design and simulation software, measurement and fabrication equipment. It is a perfect venue for engineers to find the newest on RF, microwave, and mm-wave ICs. ***NEW THIS YEAR*** - Industry Demos: Companies can submit demo proposals, without the need of a technical paper submission. These will be reviewed by the Technical Program Committee. Companies with selected proposals will be able to showcase their hardware demo on Tuesday June 12th, 2018, in the afternoon.

Conference Location: The Pennsylvania Convention Center is in Philadelphia, PA. The nearby Reading Terminal Market is a must visit when in Philadelphia. For more information visit PA Convention Center and Philadelphia.

Electronic Submission Deadlines
Technical Paper Summaries in PDF format: 12 January 2018
Final Manuscripts for the Digest and USB: 22 March 2018
All submissions must be made at in pdf form. Hard Copies are not accepted.

Author Registration and Paper Submission Steps:

1. Author registration form: title, author(s) and affiliation(s), and statement of exclusivity. This form also includes a 30-50 word abstract (description of the subject, its importance, and how the work contributes to the field). This information is required and must be submitted via the website:

2. Authors must use the template provided on the website (above) to format their manuscript. The manuscript may not exceed 4 pages total and the file size must be less than 2 MB. For PDF files, use Distiller and select "embed all fonts". Please note that we are not accepting "*.doc" files.

3. New this year: authors must adhere to specific guidelines to ensure that the submitted paper is compliant with the double-blind review process. Further details are provided on RFIC website at

4. Submission deadline: 12 January 2018

Submissions will be acknowledged instantly. HARD copy and FAX submissions will NOT be accepted. Late submissions will NOT be considered.

Authors of accepted papers will be required to submit a detailed paper, along with a clear die photo of the work described in the manuscript.

Visa Requirements: Due to the short timeframe between paper acceptance and conference, the contact authors should provide their name as it shows on their passport and correct mailing address.

Paper Selection Criteria: All submissions must be in English. Papers will be selected based on the following factors:

Originality: The paper must be unique, significant, and state-of-the-art. Are references to existing literature included?

Quantitative content: The papers should give an explicit description of the work with supporting data.

Quality: Clarity of the writing and figures. What is the context of the contribution to previous work?

Interest to RFIC attendees: Why should this work be reported at this conference?

Clearances: Authors must obtain all required company and government clearances prior to submitting a paper. A statement of clearance, signed by the submitting author, must accompany the final manuscript for the paper to be considered for publication.

Presentation Format:

Oral-Presentation Papers: Authors will be given 20 minutes to describe novel circuit and system techniques, measurement results, and potential impact to the RFIC community.

Interactive Forum Papers: Selected papers, based on both quality and suitability, will be presented in poster format that facilities interactive discussions.

Best Student Paper Award: A student paper award contest will be held as part of the Symposium. Student papers will be reviewed in the same manner as all other conference papers. To be considered for an award, the student must have been a full-time student (9 hours/term graduate, 12 hours/term undergraduate) during the time the work was performed and be the lead author and presenter of the paper. The email address of the student’s advisor must be supplied during submission time. Upon submission, the student’s advisor will automatically receive a verification email regarding the manuscript. Papers accepted for the competition will be judged on content with prizes awarded for first, second, and third place. Complimentary registration will be given to the student finalists as well as the award winners. For finalist papers, Authors will also be requested to provide a poster format for the Finalist Student Paper Forum held jointly with the Industry Showcase during the Reception to enhance attendees’ experiences.

Industry Best Paper Award: An industry paper award contest will be held as part of the Symposium. Industry papers will be reviewed in the same manner as all other conference papers. Only papers with an industrial first author and presenter will be qualified for the Industry Best Paper Award.

Notification: Authors will be notified of acceptance in February 2018. Authors of accepted papers will receive copyright release forms and instructions for publication and presentation. Final manuscripts for publication in the RFIC digest must be received by 22 March 2018.

Double Submission: Authors who do not properly cite their previous work, or who submit an RFIC manuscript to two or more publications without informing the editor that the paper is concurrently under review by another publication will be reported to IEEE and may be banned from future publications.